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    MICRO LED GRIP BODY
    172.
    发明申请
    MICRO LED GRIP BODY 审中-公开

    公开(公告)号：US20190355610A1

    公开(公告)日：2019-11-21

    申请号：US16414347

    申请日：2019-05-16

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Dong Hyeok Seo

    IPC: H01L21/683 ,  H01L21/677

    Abstract: The present invention relates to a micro LED grip body for vacuum-sucking micro LEDs. More particularly, the present invention relates to a micro LED grip body provided with a mask below a porous member to increase vacuum pressure for vacuum-sucking micro LEDs such that the micro LEDs are transferred without deviation.

    UNIT SUBSTRATE FOR OPTICAL DEVICE AND OPTICAL DEVICE PACKAGE HAVING SAME
    174.
    发明申请
    UNIT SUBSTRATE FOR OPTICAL DEVICE AND OPTICAL DEVICE PACKAGE HAVING SAME 审中-公开

    公开(公告)号：US20190097090A1

    公开(公告)日：2019-03-28

    申请号：US16144857

    申请日：2018-09-27

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Moon Hyun KIM

    IPC: H01L33/48 ,  H01L33/58

    Abstract: Disclosed is a unit substrate for an optical device, the unit substrate including: an optical device-mounting region provided on an upper surface of the unit substrate; and first and second metal substrates bonded to each other with a vertical insulating layer interposed therebetween. A lower surface of the unit substrate is electrically connected to the mounting region, and side and upper surfaces of the unit substrate are electrically isolated from the mounting region such that an optical device is capable of operating in an environment with low electrical resistance.

    Mask and masking assembly
    177.
    发明授权
    Mask and masking assembly 有权

    公开(公告)号：US10170731B2

    公开(公告)日：2019-01-01

    申请号：US15491351

    申请日：2017-04-19

    Applicant: Point Engineering Co., Ltd.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01L51/00 ,  H01L51/50 ,  H01L51/56

    Abstract: A mask for forming a pattern on a substrate is provided. The mask includes an anodic oxide film formed by anodizing metal, at least one transmission hole configured to vertically penetrate the anodic oxide film and formed in a corresponding relationship with the pattern, a plurality of pores formed in the anodic oxide film so as to have a smaller diameter than the transmission hole, and a magnetic material provided in each of the pores.

    Substrate for can package-type optical device and optical device using same
    178.
    发明授权
    Substrate for can package-type optical device and optical device using same 有权

    公开(公告)号：US10062812B2

    公开(公告)日：2018-08-28

    申请号：US14986092

    申请日：2015-12-31

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/56 ,  H01L25/075

    CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.

    Chip substrate
    179.
    发明授权
    Chip substrate 有权

    公开(公告)号：US10014446B2

    公开(公告)日：2018-07-03

    申请号：US15363261

    申请日：2016-11-29

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/48 ,  H01L33/60 ,  H01L33/62

    CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: A chip substrate includes conductive layers, an insulation layer configured to electrically isolate the conductive layers, and a cavity composed of a groove formed at a predetermined depth in a region including the insulation layer. One side of the cavity includes a first surface and a second surface continuously extending from the first surface, the first surface is formed to vertically extend from a lower portion of the cavity and the second surface is formed so as to have the same slope as the other side of the cavity, whereby the distance between one side of the lower portion of the cavity and the insulation layer is increased.

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