PUMP, CHEMICAL LIQUID SUPPLYING UNIT, AND SUBSTRATE TREATING APPARATUS

    公开(公告)号:US20230072779A1

    公开(公告)日:2023-03-09

    申请号:US17900761

    申请日:2022-08-31

    Abstract: Provided is a pump for supplying a liquid. The pump includes: a tube including a pump chamber communicating with a chemical liquid inlet and a chemical liquid outlet, and configured to discharge a chemical liquid through a change in volume due to contraction and expansion; and a driving unit contracting or expanding the tube in a longitudinal direction, in which the tube includes: a flexible tube body including a pump chamber which has an increased internal volume when is contracted in a longitudinal direction and has a decreased internal volume when is expanded in the longitudinal direction, and which has a jar shape of which a radius is increased from the chemical liquid inlet to a center of the pump chamber, and the radius is decreased from the pump chamber to the chemical liquid outlet; a first flange provided at one end of the tube body and including the chemical liquid inlet; and a second flange provided at the other end of the tube body and including the chemical liquid outlet.

    SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD

    公开(公告)号:US20230071737A1

    公开(公告)日:2023-03-09

    申请号:US17901904

    申请日:2022-09-02

    Inventor: Myung Chan CHO

    Abstract: Provided is a substrate treating method. The substrate treating method includes: a first supercritical processing operation of loading a first substrate into a supercritical chamber and supercritically processing the first substrate in the supercritical chamber; a resting operation of maintaining the supercritical chamber in an empty state for a first time until a temperature in the supercritical chamber becomes a preset temperature by opening the supercritical chamber after the first substrate is unloaded from the supercritical chamber; and a second supercritical processing operation of loading a second substrate into the supercritical chamber and supercritically processing the second substrate in the supercritical chamber.

    SUBSTRATE TREATMENT APPARATUS AND METHOD

    公开(公告)号:US20230071392A1

    公开(公告)日:2023-03-09

    申请号:US17738010

    申请日:2022-05-06

    Abstract: Provided is a substrate treatment apparatus with improved workability. The substrate treatment apparatus includes: a first bath storing a cleaning solution and having a first opening formed in an upper surface thereof; and a first ultrasonic oscillator installed in the first bath and providing ultrasonic waves toward a surface of the cleaning solution exposed by the first opening to form a water film protruding from the surface of the cleaning solution, wherein a substrate is not immersed in the first bath, and a surface of the substrate is placed adjacent to the first opening and cleaned by the water film.

    APPARATUS FOR TREATING SUBSTRATES AND TEMPERATURE CONTROL METHOD OF HEATING ELEMENTS

    公开(公告)号:US20230070679A1

    公开(公告)日:2023-03-09

    申请号:US17895266

    申请日:2022-08-25

    Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber having a treating space; and a support unit configured to support and heat a substrate in the treating space, and wherein the support unit includes: at least one heating element for adjusting a temperature of the substrate; a power source for generating a power applied to at least one heating element; a power supply line for transmitting the power generated by the power source to the at least one heating element; a power return line for grounding the at least one heating element; and a current measuring resistor provided on the power supply line or the power return line and used for estimating a temperature of the at least one heating element.

    UNIT FOR SUPPLYING SUBSTRATE TREATING LIQUID AND APPARATUS FOR TREATING SUBSTRATE INCLUDING THE SAME

    公开(公告)号:US20230068426A1

    公开(公告)日:2023-03-02

    申请号:US17879012

    申请日:2022-08-02

    Abstract: A unit for supplying a substrate-treating liquid is provided with a first reservoir and a second reservoir between which a differential pressure is constantly maintained to establish a flow rate, along with a substrate-treating apparatus having the unit for supplying the substrate-treating liquid. The unit for supplying the substrate-treating liquid includes a supply reservoir module and a buffer reservoir module. The supply reservoir module includes a first reservoir for supplying the substrate-treating liquid to an inkjet head unit for jetting the substrate-treating liquid onto a substrate, and a second reservoir for recovering the substrate-treating liquid that remains unused in the inkjet head unit. The buffer reservoir module is configured to provide the substrate-treating liquid to the first reservoir. Differential pressure is constantly maintained between the first reservoir and the second reservoir.

    SUBSTRATE PROCESSING APPARATUS AND THE METHOD THEREOF

    公开(公告)号:US20230068295A1

    公开(公告)日:2023-03-02

    申请号:US17870840

    申请日:2022-07-22

    Abstract: A substrate processing apparatus and a substrate processing method are provided, which can improve the yield by minimizing the occurrence of stains. The substrate processing method includes forming on the substrate a plurality of ink patterns spaced apart from each other by jetting ink onto the substrate by using a plurality of nozzles, calculating the density of each of the plurality of ink patterns, and selecting at least one nozzle for jetting ink into one pixel area based on respectively calculated densities of the plurality of ink patterns.

    SUBSTRATE PROCESSING APPARATUS AND METHOD

    公开(公告)号:US20230063546A1

    公开(公告)日:2023-03-02

    申请号:US17864613

    申请日:2022-07-14

    Abstract: A substrate processing apparatus capable of minimizing process defects by controlling mist in a processing bath is provided. The substrate treating apparatus comprises a first processing bath and a second processing bath disposed adjacent to each other in a first direction, a first partition wall disposed between the first processing bath and the second processing bath and having an entrance, through which a substrate passes, a transfer unit installed in the first processing bath and the second processing bath and for moving the substrate, a chemical solution supply unit installed in the first processing bath and for providing a chemical solution to the substrate, and a first exhaust unit disposed between the first processing bath and the second processing bath, connected to the first partition wall, comprising a plurality of exhaust holes disposed along a second direction different from the first direction, and for exhausting mist in the first processing bath.

    Load port unit, storage apparatus including the same, and exhaust method

    公开(公告)号:US11579538B2

    公开(公告)日:2023-02-14

    申请号:US17130619

    申请日:2020-12-22

    Abstract: A storage apparatus for storing an object includes a load port unit that a receptacle is loaded onto or unloaded from, in which the receptacle accommodates the object in a storage space formed by a body and a cover that covers the body, and a controller. The load port unit includes a housing having an interior space, a stage member that is provided on the housing and that opens the storage space by moving the body, the receptacle being seated on the stage member, and an exhaust tube that evacuates a spacing space between the body and the cover spaced apart from each other. One end of the exhaust tube faces toward the spacing space, and an opposite end of the exhaust tube faces toward the interior space.

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