Abstract:
A method is for treating a doped gallium nitride substrate of a first conductivity type, having dislocations emerging on the side of at least one of its surfaces. The method may include: a) forming, where each dislocation emerges, a recess extending into the substrate from the at least one surface; and b) filling the recesses with doped gallium nitride of the second conductivity type.
Abstract:
A method for managing the lifetime of a battery is disclosed herein. An ambient temperature is measured near a battery. The ambient temperature rises above a first threshold and, in response to detecting that the ambient temperature has risen above the first threshold, the battery is discharged. A battery system and a device operable with a battery are also disclosed.
Abstract:
An AC/DC converter includes: a first terminal and a second terminal for receiving an AC voltage and a third terminal and a fourth terminal for supplying a DC voltage. A rectifying bridge includes input terminals respectively coupled to the first terminal and the second terminal, and output terminals respectively coupled to the third terminal and fourth terminal. A first branch of the rectifying bridge includes, connected between the output terminals, two series-connected thyristors with a junction point of the two thyristors being connected to a first one of the input terminals. A second branch of the rectifying bridge is formed by series connected diodes. A control circuit is configured to generate control signals for application to the control gates of the thyristors.
Abstract:
A device may be for protection against overvoltages in a power supply line. The device may include a breakover diode, an avalanche diode coupled in series with the breakover diode, and a switch coupled in parallel with the breakover diode and the avalanche diode. The device may also include a circuit coupled across the avalanche diode and configured to control the switch.
Abstract:
A vertical power component includes a silicon substrate of a first conductivity type with a well of the second conductivity type on a lower surface of the substrate. The first well is bordered at a component periphery with an insulating porous silicon ring. An upper surface of the porous silicon ring is only in contact with the substrate of the first conductivity type. The insulating porous silicon ring penetrates into the substrate down to a depth greater than a thickness of the well.
Abstract:
An overvoltage protection device capable of protecting a power supply line and including in parallel a break-over diode, a controlled switch, and a circuit for controlling the switch.
Abstract:
A method for forming a microbattery including, on a surface of a first substrate, one active battery element and two contact pads, this method including the steps of: a) forming, on a surface of a second substrate, two contact pads with a spacing compatible with the spacing of the pads of the first substrate; and b) arranging the first substrate on the second substrate so that the surfaces face each other and that the pads of the first substrate at least partially superpose to those of the second substrate, where a portion of the pads of the second substrate is not covered by the first substrate.
Abstract:
An AC/DC converter includes a first terminal and a second terminal for receiving an AC voltage and a third terminal and a fourth terminal for delivering a DC voltage. A capacitive circuit is connected between the third and fourth terminals. A rectifying bridge circuit has input terminals respectively coupled to the first and second terminals and has output terminal respectively connected to the third and fourth terminals. An inductive element is coupled in series with a first switch circuit between the first terminal and an input terminal of the rectifying bridge circuit.
Abstract:
A high-voltage vertical power component including a silicon substrate of a first conductivity type, and a first semiconductor layer of the second conductivity type extending into the silicon substrate from an upper surface of the silicon substrate, wherein the component periphery includes: a porous silicon ring extending into the silicon substrate from the upper surface to a depth deeper than the first layer; and a doped ring of the second conductivity type, extending from a lower surface of the silicon surface to the porous silicon ring.
Abstract:
A vertical power component includes a silicon substrate of a first conductivity type with a well of the second conductivity type on a lower surface of the substrate. The first well is bordered at a component periphery with an insulating porous silicon ring. An upper surface of the porous silicon ring is only in contact with the substrate of the first conductivity type. The insulating porous silicon ring penetrates into the substrate down to a depth greater than a thickness of the well.