OPTICAL MODULE PACKAGE STRUCTURE AND METHOD THEREOF

    公开(公告)号:US20180087958A1

    公开(公告)日:2018-03-29

    申请号:US15479048

    申请日:2017-04-04

    Abstract: The present disclosure discloses an optical module package structure and method thereof. The optical module includes a substrate, a shield, a photosensitive unit and a cover. The shield is disposed on the top of the substrate and forms a first housing space with the upper surface of the substrate. The photosensitive unit is disposed on the substrate and located in the first housing space. The shield has a light-receiving part above the photosensitive unit. At least one notch is on the outer surface of the shield. A cushion is disposed on the notch and protrudes on the upper surface of the shield. The cover is disposed on the cushion(s) and kept a constant distance to the upper surface of the shield by contacting with the cushion(s).

    LIGHT PIPE SENSOR SYSTEM
    173.
    发明申请

    公开(公告)号:US20180080814A1

    公开(公告)日:2018-03-22

    申请号:US15592400

    申请日:2017-05-11

    Applicant: Gooee Limited

    Abstract: A system and a method for transporting high luminous intensity light from at least one luminaire to a destination area are disclosed. The system may include a light guide that carries light from the luminaire to a plurality of sensors located on a Printed Circuit Board (PCB). The PCB may be attachable anywhere the luminaire is located. According to an aspect, the luminaire is a separate entity from the sensor system. While collecting light rays originating from the luminaire and delivering them to the light sensors, the light guide may perform a plurality of operations to modify the characteristics of the collected light rays. The plurality of operations performed by the light guide on the light rays may support the accuracy and longevity of the light sensors on the PCB. Further, the light guide allows the sensor subsystem to be proximal to or distant from the luminaire.

Patent Agency Ranking