公开(公告)号：US09780080B2

公开(公告)日：2017-10-03

申请号：US14510433

申请日：2014-10-09

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin

IPC: H01L25/00 ,  H01L25/16 ,  G06F1/32 ,  H03K17/94 ,  G06F3/01

CPC classification number: H01L25/50 ,  G06F1/3231 ,  G06F3/017 ,  H01L25/165 ,  H01L25/167 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2217/94108 ,  H04M2250/12 ,  H01L2924/00

Abstract: A method for making an optical proximity sensor includes forming a package top plate having an optical transmit opening and an optical receive opening extending therethrough, attaching an optical transmit element to the package top plate adjacent the optical transmit opening, and attaching an optical receive element to the package top plate adjacent the optical receive opening. A package body is formed onto the package top plate to define an optical transmit cavity receiving the optical transmit element and an optical receive cavity receiving the optical receive element.

公开(公告)号：US09723186B2

公开(公告)日：2017-08-01

申请号：US14183937

申请日：2014-02-19

Applicant: STMicroelectronics Pte Ltd.

Inventor： Loic Pierre Louis Renard ,  Wee Chin Judy Lim

IPC: H04N5/225 ,  H04N17/00 ,  H04N5/217 ,  H04N5/357

CPC classification number: H04N5/2254 ,  H04N5/217 ,  H04N5/2257 ,  H04N5/3572 ,  H04N17/002 ,  Y10T29/49128

Abstract: A low-cost resin lens is disclosed for use in miniature cameras. The resin lens features a low profile that is particularly well-suited to consumer products such as smart phones. The resin lens is mounted to an integrated circuit die that is attached to a standard four-layer substrate. The integrated circuit die includes electronic and/or optoelectronic circuits to support digital image capture, transfer, and processing. Image correction software adjusts the image to correct for distortion introduced by the resin lens.

公开(公告)号：US09679870B2

公开(公告)日：2017-06-13

申请号：US14565484

申请日：2014-12-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yiyi Ma ,  Kim-Yong Goh ,  Xueren Zhang ,  Wei Zhen Goh

IPC: H01L23/00 ,  H01L23/482 ,  H01L23/495 ,  H01L23/31

CPC classification number: H01L24/85 ,  H01L23/3107 ,  H01L23/4822 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48177 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) device includes an IC and encapsulating material surrounding the IC. Leads are coupled to the IC and extend outwardly from sides of the encapsulating material, with each lead having three contiguous exposed segments with upper and lower bends defining a Z-shape. In another example, the leads include an upper horizontal segment, lower horizontal segment, and intermediate curved segment extending upwardly from the upper horizontal segment and downwardly to the lower horizontal segment.

公开(公告)号：US09645238B1

公开(公告)日：2017-05-09

申请号：US14981196

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En Luan

IPC: G01J1/42 ,  G01S17/02 ,  G01J1/04

CPC classification number: G01S17/026 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0271 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/42 ,  G01S7/4813 ,  H01L31/167 ,  H01L2224/73265

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

公开(公告)号：US20170123064A1

公开(公告)日：2017-05-04

申请号：US14981196

申请日：2015-12-28

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Jing-En LUAN

IPC: G01S17/02 ,  G01J1/04 ,  G01J1/42

CPC classification number: G01S17/026 ,  G01J1/0204 ,  G01J1/0209 ,  G01J1/0271 ,  G01J1/0488 ,  G01J1/06 ,  G01J1/42 ,  G01S7/4813 ,  H01L31/167 ,  H01L2224/73265

Abstract: The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a substrate, a sensor chip, a light-emitting device, a non-transparent isolation structure and a non-transparent molding material, wherein the sensor chip is located on the substrate and electrically coupled to the substrate; the light-emitting device is located on the sensor chip and electrically coupled to the sensor chip; the non-transparent isolation structure is located on the sensor chip and isolates the light-emitting device from a sensor region of the sensor chip; and the non-transparent molding material at least partially covers the substrate, the sensor chip and the non-transparent isolation structure, such that a portion of the proximity sensor which is located right above the sensor region and the light-emitting device is not covered by the non-transparent molding material.

公开(公告)号：US20170052277A1

公开(公告)日：2017-02-23

申请号：US14832971

申请日：2015-08-21

Applicant: STMicroelectronics Pte Ltd ,  STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED

Inventor： Wing Shenq Wong ,  Andy Price ,  Eric Christison

IPC: G01V8/12 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0232 ,  H01L31/16 ,  H01L25/16

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method for forming a molded proximity sensor with an optical resin lens and the structure formed thereby. A light sensor chip is placed on a substrate, such as a printed circuit board, and a diode, such as a laser diode, is positioned on top of the light sensor chip and electrically connected to a bonding pad on the light sensor chip. Transparent, optical resin in liquid form is applied as a drop over the light sensor array on the light sensor chip as well as over the light-emitting diode. After the optical resin is cured, a molding compound is applied to an entire assembly, after which the assembly is polished to expose the lenses and have a top surface flush with the top surface of the molding compound.

Abstract translation: 一种用于形成具有光学树脂透镜的模制接近传感器的方法及由此形成的结构。 将光传感器芯片放置在诸如印刷电路板的基板上，并且诸如激光二极管的二极管位于光传感器芯片的顶部上并电连接到光传感器芯片上的焊盘。 液体形式的透明光学树脂以光传感器芯片上的光传感器阵列以及发光二极管上的方式被施加。 在光学树脂固化之后，将模塑料施加到整个组件上，然后抛光组件以露出透镜并且具有与模塑料的顶表面齐平的顶表面。

公开(公告)号：US09530681B2

公开(公告)日：2016-12-27

申请号：US14986130

申请日：2015-12-31

Applicant: STMicroelectronics Pte Ltd

Inventor： Calvin Leung ,  Olivier Le Neel

IPC: H01L21/683 ,  H01L21/768 ,  H01L27/06 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/00 ,  H01L27/105 ,  H01L49/02 ,  H01L29/66

CPC classification number: H01L21/6835 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/76895 ,  H01L23/3135 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/5389 ,  H01L24/20 ,  H01L27/0629 ,  H01L27/1052 ,  H01L28/60 ,  H01L29/6675 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/18 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic device is formed by depositing polyimide on a glass substrate. A conductive material is deposited on the polyimide and patterned to form electrodes and signal traces. Remaining portions of the electronic device are formed on the polyimide. A second polyimide layer is then formed on the first polyimide layer. The glass substrate is then removed, exposing the electrodes and the top surface of the electronic device.

公开(公告)号：US09525832B1

公开(公告)日：2016-12-20

申请号：US14740565

申请日：2015-06-16

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Dave Alexis De La Cruz

IPC: H04N5/225 ,  H04N5/369 ,  G01D11/24 ,  H01L31/0232

CPC classification number: H04N5/2252 ,  G01D11/245 ,  H01L27/14618 ,  H01L31/02325 ,  H04N5/2253 ,  H04N5/2257

Abstract: An image sensor device includes a base having a rectangular shape and comprising first contacts and a reference voltage contact extending along a first side thereof, a housing carried by the base, and an image sensor integrated circuit (IC) carried by the base within the housing and having an image sensing surface. A focus cell is within the housing, aligned with the image sensing surface, and includes second contacts. An electromagnetic compatibility (EMC) shield is carried by the housing and includes a top panel having an opening therein aligned with the focus cell, and side panels extending downwardly from the top panel. Conductive leads extend between one of the first contacts and a corresponding one of the second contacts. A reference conductive lead extends between the reference voltage contact and the EMC shield.

Abstract translation: 一种图像传感器装置包括具有矩形形状的基部，包括第一触点和沿其第一侧延伸的参考电压触点，由基座承载的外壳以及由基座承载在壳体内的图像传感器集成电路（IC） 并具有图像感测表面。 聚焦单元位于壳体内，与图像感测表面对准，并且包括第二触点。 电磁兼容性（EMC）屏蔽由壳体承载，并且包括顶板，其具有与聚焦电池对准的开口，以及从顶板向下延伸的侧板。 导电引线在第一触点中的一个和第二触点之间相应的一个之间延伸。 参考导线在参考电压触点和EMC屏蔽之间延伸。

公开(公告)号：US20160284920A1

公开(公告)日：2016-09-29

申请号：US14671707

申请日：2015-03-27

Applicant: STMICROELECTRONICS PTE LTD ,  STMICROELECTRONICS (GRENOBLE 2) SAS

Inventor： Eric SAUGIER ,  Wing Shenq WONG ,  David GANI

IPC: H01L31/167 ,  H01L31/18 ,  H01S5/022 ,  H01S5/183 ,  H01L31/02 ,  H01L25/16

CPC classification number: H01L31/167 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/18 ,  H01L2224/18 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01S5/02248 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/183 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A proximity sensor having a relatively small footprint includes a substrate, a semiconductor die, a light emitting device, and a cap. The light emitting device overlies the semiconductor die. The semiconductor die is secured to the substrate and includes a sensor area capable of detecting light from by the light emitting device. The cap also is secured to the substrate and includes a light barrier that prevents some of the light emitted by the light emitting device from reaching the sensor area. In one embodiment, the light emitting device and the semiconductor die are positioned on the same side of the substrate, wherein the light emitting device is positioned on the semiconductor die. In another embodiment, the light emitting device is positioned on one side of the substrate and the semiconductor die is positioned on an opposing side of the substrate.

Abstract translation: 具有相对较小占地面积的接近传感器包括衬底，半导体管芯，发光器件和帽。 发光器件覆盖半导体管芯。 半导体管芯被固定到基板上并且包括能够检测来自发光器件的光的传感器区域。 盖子也被固定到基板上并且包括防止由发光装置发射的一些光到达传感器区域的光栅。 在一个实施例中，发光器件和半导体管芯位于衬底的相同侧上，其中发光器件位于半导体管芯上。 在另一个实施例中，发光器件位于衬底的一侧，并且半导体管芯位于衬底的相对侧上。

公开(公告)号：US09448216B2

公开(公告)日：2016-09-20

申请号：US14511280

申请日：2014-10-10

Applicant: STMICROELECTRONICS PTE LTD

Inventor： Yonggang Jin ,  Ravi Shankar

IPC: G01N27/12 ,  G01N33/00

CPC classification number: G01N33/0009 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A gas sensor device may include a gas sensor integrated circuit (IC) having a gas sensing surface, and bond pads adjacent to the gas sensing surface, and a frame having gas passageways extending therethrough adjacent the gas sensing surface. The gas sensor device may include leads, each having a proximal end spaced from the frame and bonded to a respective bond pad, and a distal end extending downwardly from the proximal end, and encapsulation material filling the space between the proximal ends of the leads and the frame.

Abstract translation: 气体传感器装置可以包括具有气体检测表面的气体传感器集成电路（IC）和与气体感测表面相邻的接合焊盘，以及具有在气体感测表面附近延伸穿过的气体通道的框架。 气体传感器装置可以包括引线，每个引线具有与框架间隔开并且接合到相应的接合焊盘的近端和从近端向下延伸的远端，以及填充引线的近端之间的空间的封装材料和 框架。