公开(公告)号：US07916499B2

公开(公告)日：2011-03-29

申请号：US12055587

申请日：2008-03-26

Applicant: Yong-Hui Feng ,  I-Hsien Chiang ,  Cheng-Hsien Lin

Inventor： Yong-Hui Feng ,  I-Hsien Chiang ,  Cheng-Hsien Lin

IPC: H05K7/14 ,  H05K7/18

CPC classification number: H05K13/0069

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.

Abstract translation: 在一个实施例中，用于保持印刷电路板的保持器包括在其上形成有多个保持单元的基板。 每个保持单元包括弹簧构件，固定构件和阻挡结构。 弹簧构件包括第一端和第二端。 第一端连接到基板。 固定构件可滑动地安装在基板上。 固定构件包括连接端和固定端。 连接端与弹簧构件的第二端连接。 阻挡结构位于基板上。 弹簧构件构造成用于按压固定构件朝向阻挡结构移动，使得印刷电路板可保持在固定构件的固定端和基板上的阻挡结构之间。 支架能够分批装载印刷电路板。

公开(公告)号：US20110065904A1

公开(公告)日：2011-03-17

申请号：US12558911

申请日：2009-09-14

Applicant: Show-Wen Liu ,  Cheng-Hsien Lin ,  Tsyh-Lang Lin ,  Cheng-Fang Hsu

Inventor： Show-Wen Liu ,  Cheng-Hsien Lin ,  Tsyh-Lang Lin ,  Cheng-Fang Hsu

IPC: C07F13/00 ,  C07C237/04 ,  C07C69/003

CPC classification number: C07C323/41 ,  C07F13/005

Abstract: H3LMN series compounds used as radioactive agents for treatment of liver cancer and a manufacturing method thereof are revealed. 2-thioethylamine hydrochloride is reacted with triphenylmethanol for protection of thiol to obtain 2-[(triphenylmethyl)thio]ethylamine. Then obtain N-[2-((triphenylmethyl)thio)ethyl]chloroacetamide by a transamidation reaction between 2-[(triphenylmethyl)thio]ethylamine and chloroactyl chloride. Next produce a amine-amide-thiol ligand-N-[2-((triphenylmethyl)thio)ethyl][2-((triphenylmethyl)thio)ethylamino]acetamide by a substitution reaction of N-[2-((triphenylmethyl)thio)ethyl]chloroacetamide and 2-[(triphenylmethyl)thio]ethylamine. After respective reaction with 1-bromotetradecane, 1-bromohexadecane and ethyl 16-bromohexadecanoate, H3LMN series compounds are obtained. These amine-amide-dithiols quadridentate ligands can react with MO3+ (M=Tc or Re) to produce electrically neutral complexes. The complexes have high lipophilicity, allowing them soluble in lipiodol to be applied to radiation therapy for liver cancer.

Abstract translation: 揭示了用作肝癌治疗放射剂的H3LMN系列化合物及其制造方法。 将2-硫代乙胺盐酸盐与三苯基甲醇反应以保护硫醇，得到2 - [（三苯基甲基）硫代]乙胺。 然后通过2 - [（三苯基甲基）硫代]乙胺和氯代酰氯的酰胺化反应获得N- [2 - （（三苯基甲基）硫基）乙基]氯乙酰胺。 接着通过N- [2 - （（三苯基甲基）硫代）的取代反应生成胺 - 酰胺 - 硫醇配体-N- [2 - （（三苯基甲基）硫代）乙基] [2 - （（三苯基甲基）硫基）乙基氨基] ）乙基]氯乙酰胺和2 - [（三苯甲基）硫基]乙胺。 在与1-溴十四烷，1-溴十六烷和16-溴十六烷酸乙酯反应后，得到H3LMN系列化合物。 这些胺 - 酰胺 - 二硫醇三元配体可以与MO3 +（M = Tc或Re）反应，产生电中性络合物。 复合物具有高亲脂性，使其可溶于碘油以适用于放射治疗肝癌。

公开(公告)号：US20110040123A1

公开(公告)日：2011-02-17

申请号：US12540467

申请日：2009-08-13

Applicant: Show-Wen Liu ,  Cheng-Hsien Lin ,  Tsyh-Lang Lin ,  Cheng-Fang Hsu

Inventor： Show-Wen Liu ,  Cheng-Hsien Lin ,  Tsyh-Lang Lin ,  Cheng-Fang Hsu

IPC: C07C237/10

CPC classification number: C07C323/41 ,  Y02P20/55

Abstract: A bifunctional compound containing an amino group and diaminedithiol ligand and a manufacturing method thereof are revealed, the bifunctional compound includes at least one amino group and a diaminedithiol (N2S2) ligand. The amino groups is for reacting with compounds containing carboxylic acids or halogens while the N2S2 ligand binds with technetium or rhenium so as to form an anion complex. The thiol group in the N2S2 ligand is protected by a protecting group for prevention of oxidation and easy storage. This protecting group is released easily during complex reactions. Due to the bifunctional property, the compound is applied to preparation of radiopharmaceuticals such as imaging agents and targeted agents.

公开(公告)号：US07839647B2

公开(公告)日：2010-11-23

申请号：US12346804

申请日：2008-12-30

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H05K1/00

CPC classification number: H05K3/4641 ,  B82Y10/00 ,  H05K1/056 ,  H05K9/0088 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10S977/70 ,  Y10S977/701 ,  Y10S977/712 ,  Y10S977/734 ,  Y10T428/24116 ,  Y10T428/30 ,  Y10T442/10

Abstract: An insulating film includes a first polymer layer, a second polymer layer and an electromagnetic shielding layer sandwiched between the first polymer layer and the second polymer layer. The electromagnetic shielding layer includes a number of carbon nanotube films that are substantially parallel to the first and second polymer layer. Each of the carbon nanotube films includes a number of carbon nanotubes that are substantially parallel to each other. The insulating film can provide anti-EMI effect in printed circuit boards without employing additional electromagnetic shielding layers.

Abstract translation: 绝缘膜包括第一聚合物层，第二聚合物层和夹在第一聚合物层和第二聚合物层之间的电磁屏蔽层。 电磁屏蔽层包括大致平行于第一和第二聚合物层的多个碳纳米管薄膜。 每个碳纳米管膜包括基本上彼此平行的多个碳纳米管。 绝缘膜可以在印刷电路板中提供抗电磁效应，而不需要额外的电磁屏蔽层。

公开(公告)号：US20100059910A1

公开(公告)日：2010-03-11

申请号：US12535909

申请日：2009-08-05

Applicant: WEN-TSUN CHEN ,  SHIN-CHIH LIAW ,  TAO-MING LIAO ,  CHIA-HUNG SHEN ,  CHENG-HSIEN LIN

Inventor： WEN-TSUN CHEN ,  SHIN-CHIH LIAW ,  TAO-MING LIAO ,  CHIA-HUNG SHEN ,  CHENG-HSIEN LIN

IPC: C22B3/02

CPC classification number: C22B7/006 ,  C02F2101/20 ,  C02F2103/346 ,  C22B3/02 ,  C22B3/46 ,  C22B15/0091 ,  Y02P10/234 ,  Y02P10/236

Abstract: An apparatus for recycling metals from metal ions containing waste solution includes a conveying device, a reducing agent supplier and a solution supplier. The conveying device includes a first ferromagnetic conveyor belt, a first roller, and a second roller. The first and second rollers are substantially horizontally arranged, and the second roller is arranged at a lower position relative to the first roller and spaced from the first roller. The ferromagnetic conveyor belt is wrapped around the first and second rollers. The reducing agent supplier is used for supplying a reducing agent onto the first conveyor belt, the ferromagnetic conveyor belt is capable of conveying the reducing agent from the second roller to the first roller. The solution supplier is configured for supplying the waste solution onto the first conveyor belt.

Abstract translation: 用于从含金属离子的废液中回收金属的设备包括输送装置，还原剂供应商和溶液供应商。 输送装置包括第一铁磁输送带，第一辊和第二辊。 第一和第二辊基本上是水平布置的，并且第二辊布置在相对于第一辊子的下部位置并与第一辊子间隔开。 铁磁输送带缠绕在第一和第二辊子周围。 还原剂供应器用于将还原剂供应到第一传送带上，铁磁传送带能够将还原剂从第二辊输送到第一辊。 解决方案供应商被配置为将废溶液供应到第一传送带上。

公开(公告)号：US20090286006A1

公开(公告)日：2009-11-19

申请号：US12327621

申请日：2008-12-03

Applicant: CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

Inventor： CHENG-HSIEN LIN ,  QIU-YUE ZHANG ,  YAO-WEN BAI

IPC: C09D11/00 ,  B05D3/06

CPC classification number: H05K3/182 ,  C09D11/38 ,  C09D11/52 ,  C23C18/14 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1651 ,  C23C18/405 ,  C23C18/44 ,  H05K3/105 ,  H05K2203/013 ,  H05K2203/1157

Abstract: An exemplary ink for forming electrical traces includes an aqueous carrier medium, a palladium salt and a reducing agent. The palladium salt is capable of being dissolved in the aqueous carrier medium. The reducing agent is configured for reducing the palladium ions into palladium particles under an irradiation ray.

Abstract translation: 用于形成电迹线的示例性油墨包括水性载体介质，钯盐和还原剂。 钯盐能够溶解在载体介质中。 还原剂被配置为在照射光线下将钯离子还原成钯颗粒。

公开(公告)号：US20090050677A1

公开(公告)日：2009-02-26

申请号：US12102613

申请日：2008-04-14

Applicant: JIAN-YI HAO ,  I-HSIEN CHIANG ,  CHENG-HSIEN LIN

Inventor： JIAN-YI HAO ,  I-HSIEN CHIANG ,  CHENG-HSIEN LIN

IPC: B23K31/02

CPC classification number: H05K3/3494 ,  B23K1/0016 ,  B23K2101/40 ,  B23K2101/42 ,  H05K2203/0165 ,  H05K2203/1581

Abstract: An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are mounted on the welding pads. Fourthly, PCBs are placed on the metal tray in a manner that each printed circuit board is placed in a corresponding supporting area and the welding pads being above the through hole. Finally, the solder pastes are heated to weld the electronic components on the printed circuit board. By doing so, the heat can pass through the through holes in each supporting area directly and fully melt the solder paste. As a result, welding defects can be reduced.

Abstract translation: 公开了一种在PCB上焊接电子部件的示例性方法。 首先，提供包括多个支撑区域的金属托盘。 在每个支撑区域中形成至少一个通孔。 其次，将焊膏施加到PCB的焊盘上。 第三，将电子部件安装在焊盘上。 第四，将印刷电路板放置在金属托盘上，使每个印刷电路板放置在相应的支撑区域中，焊盘位于通孔上方。 最后，焊膏被加热以焊接印刷电路板上的电子部件。 通过这样做，热能够直接通过每个支撑区域中的通孔并使焊膏完全熔化。 结果，可以减少焊接缺陷。

公开(公告)号：US07488428B2

公开(公告)日：2009-02-10

申请号：US11309852

申请日：2006-10-13

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H01B13/00

CPC classification number: H05K3/0035 ,  H05K3/0038 ,  H05K3/4652 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K2203/108

Abstract: A method for forming stacked via-holes on a printed circuit board includes the steps of: providing a printed circuit board having a conductive trace formed on a side surface thereof; forming a first copper-clad laminate on the side surface having the conductive trace; forming a number of first copper micro-via in a copper layer of the first copper-clad laminate; forming a second copper-clad laminate on the surface of the copper layer having the first copper micro-via of the first copper-clad laminate; forming a number of second copper micro-via in a copper layer of the second copper-clad laminate by a first laser on the basis of the first copper micro-via, each second copper micro-via being located corresponding to its correspondingly first copper micro-via; and removing corresponding resin layer portions of the first and second copper-clad laminates, using a second laser, to yield the respective stacked via-holes.

Abstract translation: 一种在印刷电路板上形成堆叠的通孔的方法包括以下步骤：提供在其侧表面上形成有导电迹线的印刷电路板; 在具有导电迹线的侧表面上形成第一覆铜层压板; 在第一覆铜层压板的铜层中形成多个第一铜微通孔; 在具有第一覆铜层压板的第一铜微通孔的铜层的表面上形成第二覆铜层压板; 基于第一铜微通孔，通过第一激光在第二覆铜层压板的铜层中形成多个第二铜微通孔，每个第二铜微通孔对应于其相应的第一铜微通孔 -通过; 并使用第二激光器除去第一和第二覆铜层压板的相应树脂层部分，以产生相应的堆叠通孔。

公开(公告)号：US07418780B2

公开(公告)日：2008-09-02

申请号：US11560787

申请日：2006-11-16

Applicant: Wen-Chin Lee ,  Cheng-Hsien Lin

Inventor： Wen-Chin Lee ,  Cheng-Hsien Lin

IPC: H01K3/10 ,  H05K3/36

CPC classification number: H05K3/4652 ,  H05K3/0035 ,  H05K3/421 ,  H05K3/429 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: An exemplary method for forming stacked via-holes in a multilayer printed circuit board includes the steps of: providing a base circuit board; attaching a first copper-coated-substrate having a first substrate and a first copper layer thereon and a second copper-coated-substrate having a second substrate and a second copper layer thereon onto the base circuit board in a manner such that; forming at least one first window in the second copper layer, making at least one first hole in the second substrate through the at least one first window, forming at least one second window in the first copper layer through the at least one first hole, and making at least one second hole in the first substrate through the at least one second window, thus forming at least one part-finished stacked via-hole; and plating the at least one part-finished stacked via-hole thereby forming at least one stacked via-hole.

Abstract translation: 在多层印刷电路板中形成堆叠的通孔的示例性方法包括以下步骤：提供基底电路板; 将其上具有第一基板和第一铜层的第一铜涂覆基板和其上具有第二基板和第二铜层的第二铜涂覆基板以如下方式附接到基板电路板上; 在所述第二铜层中形成至少一个第一窗口，通过所述至少一个第一窗口在所述第二基板中形成至少一个第一孔，通过所述至少一个第一孔在所述第一铜层中形成至少一个第二窗口，以及 通过所述至少一个第二窗口在所述第一基板中形成至少一个第二孔，从而形成至少一个部分完成的堆叠通孔; 以及对所述至少一个部分精加工的堆叠通孔进行电镀，从而形成至少一个堆叠的通孔。

公开(公告)号：US20080148562A1

公开(公告)日：2008-06-26

申请号：US11877585

申请日：2007-10-23

Applicant: CHIH-YI TU ,  CHENG-HSIEN LIN ,  MING WANG

Inventor： CHIH-YI TU ,  CHENG-HSIEN LIN ,  MING WANG

IPC: H05K3/10

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49139 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 制造多层FPCB的方法包括以下步骤：提供第一覆铜层压板，第二覆铜层压板和粘合剂层; 在粘合剂层上限定开口; 在所述第一覆铜层压板上限定第一狭缝; 层压第一覆铜层压板，粘合剂层和第二覆铜层压板; 限定用于在所述第一覆铜层压板和所述第二覆铜层压板之间建立电连接的通孔; 切割第一覆铜层压板，粘合剂层和第二覆铜层压板，从而形成在不同区域中具有不同层数的多层柔性印刷电路板。