Abstract:
A three-dimensional SoC structure formed by stacking multiple chip modules is provided. The three-dimensional SoC structure includes at least two vertical SoC modules and at least one connector module, wherein each connector module electrically connects two vertical SoC modules. Each vertical SoC module is constructed by stacking at least two chip modules vertically. Each chip module includes a module circuit board and at least one preset element. A recess is formed in each module circuit board and provided with a first connecting interface for electrically connecting with the corresponding at least one preset element. The at least two vertical SoC modules are connected by the connector module to form a three-dimensional SoC structure with multiple functions. Besides, the recesses formed in the module circuit boards provide effective heat dissipation paths for the preset elements.
Abstract:
A method for repairing and assembling contact image sensor module and structure thereof are provided. The method includes following steps: (1) making a sensor housing; (2) providing a PCB; (3) assembling the PCB into the sensor housing; (4) melting an end of a securing post located on the sensor housing and forming fastening means for fixing the PCB to the sensor housing; (5) testing the assembled CIS, if it can't pass the test, then cut off the fastening means and take away the PCB for repairing or replacing it; (6) cutting off the securing post located on the housing; (7) making an adapted post with a securing tip and fixing said adapted post to a corresponding position of the sensor housing on which the former securing post being located; (8) assembling the repaired or replaced PCB into the sensor housing, and make the securing tip of the adapted post passing through the securing hole and extending outwardly from the PCB; (9) melting the tip of the adapted post by the manner of hot-press and forming a new fastening means for fixing the repaired or replaced PCB to the sensor housing again.
Abstract:
A miniature sieve apparatus is described and includes a first sieve, a separator and a second sieve from top to bottom. The first and second sieves are formed with at least one first mesh and a plurality of second meshes, respectively. The first and second meshes are misaligned with each other in a vertical direction of the first and second sieves. The miniature sieve apparatus is provided to separate or screen microparticles with different sizes, such as target cells, bio-medical particles, organic or inorganic microparticles. Additionally, the invention also provides a manufacturing method of the miniature sieve apparatus, and the same material is applied to manufacture the sieves and the separators. Thus, the problem caused by the residual thermal stress due to different material can be solved. Therefore, the cost of the miniature sieve apparatus can be lowered as the yield rate thereof is improved.
Abstract:
An optical touch display device is provided. The optical touch display device includes a front frame, a light guide strip, a photosensitive element, and a light source. The front frame includes a body portion having a display opening, at least one positioning board located on a corner of the body portion, and a protecting cover located on the body portion. An end of the protecting cover is adjacent to the positioning board. An opening groove is defined between the protecting cover and the body portion. The body portion, the positioning board, and the protecting cover are integrally formed. The light guide strip is placed in the opening groove. The photosensitive element is fixed on the positioning board. The light source is located between the photosensitive element and the light guide strip, and a light-emitting side of the light source faces a light inlet side of the light guide strip.
Abstract:
A method for arranging memories of a low-complexity low-density parity-check (LDPC) decoder and a low-complexity LDPC decoder using the same method are provided. The main idea of the method for arranging memories of a low-complexity LDPC decoder is to merge at least one or two small-capacity memory blocks into one memory group, so that the memory area can be reduced and the power consumption in reading or writing data is lowered. Besides, as the merged memory group shares the same address line in reading or writing data, at least one delay unit is used to adjust the reading or writing order and thereby ensure data validity. A low-complexity LDPC decoder using the disclosed method can meet the demands of high processing rate and low power consumption.
Abstract:
A microparticle detecting apparatus is disclosed and includes at least one detection unit, each of which includes: a first sieve having at least a first mesh, a separator stacked on one side of the first sieve and having a separator hole, and a second sieve stacked on one side of the separator and having several second meshes. The diameter of the second mesh is smaller than that of the first mesh, and the first and second meshes are misaligned with each other in a vertical direction of the first and second sieves. The detection unit further includes at least a sensor aligned with the first or second mesh for detecting microparticles trapping into the first mesh or passing through the second mesh. Therefore, the microparticle detecting apparatus is suitably used for detecting or counting any microparticles with different size, to effectively shorten the detection processes of sample fluids.
Abstract:
A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.
Abstract:
An assembly includes a main body, a screw, a nut and a restricting tab. The main body has a slot. A first end portion of the slot is narrower than a second end portion of the slot. The screw has a head and a shank. The shank is movable along the slot. The nut is threadedly engaged with the shank, and is wider than the first end portion and narrower than the second end portion. The restricting tab can be detachably sandwiched between the nut and the main body such that the shank can be trapped in the first end portion.
Abstract:
The present invention discloses a unitized charging and discharging battery management system and a programmable battery management module thereof The unitized charging and discharging battery management system includes a smart battery module and a programmable battery management module, which has a universal loop and a control unit. The smart battery module has at least two smart batteries which are electrically connected by a plurality of switches and circuits of the universal loop to form a charging/discharging loop in series/parallel. The control unit monitors the charging and discharging status of the smart batteries to turn on or off the switches accordingly, so as to manage the smart batteries, thereby enhancing the overall power efficacy of the smart battery module. Besides, the service life of the smart battery module is also prolonged due to the simultaneous charging and discharging capability.
Abstract:
A multi-layer system-on-chip (SoC) module structure is provided. The multi-layer SoC module structure includes at least two circuit board module layers and at least one connector module layer. Each connector module layer is sandwiched between and thus electrically connects two circuit board module layers such that the SoC module structure is formed by stacking. Each circuit board module layer is composed of at least one circuit board module while each connector module layer is composed of at least one connector module. Hence, the SoC module structure can be manufactured as a three-dimensional structure, thus allowing highly flexible connections within the SoC module structure.