公开(公告)号：US20090311885A1

公开(公告)日：2009-12-17

申请号：US12485077

申请日：2009-06-16

Applicant: CHIH-PI CHENG ,  CHI-NAN LIAO

Inventor： CHIH-PI CHENG ,  CHI-NAN LIAO

IPC: H01R12/00 ,  A44B21/00 ,  G06F1/20

CPC classification number: G06F1/20 ,  H01L23/4093 ,  H01L2924/0002 ,  Y10T24/44017 ,  H01L2924/00

Abstract: An electrical connector assembly for electrically connecting a printed circuit board and an electronic package, comprises an electrical connector on which the electronic package is mounted, a heat sink module mounted upon the electronic package and a clip positioned upon the heat sink module. The printed circuit board defines a connector mounting area surrounded by a plurality of through holes thereof. The clip has a base portion downwardly pressing against the heat sink module, a pair of mounting portions mounted to the corresponding holes, and a pair of pressing portions extending from the mounting portions and disposed on opposite sides of the clip for pressing against the heat sink module.

Abstract translation: 一种用于电连接印刷电路板和电子封装的电连接器组件，包括安装有电子封装的电连接器，安装在电子封装上的散热模块和位于散热器模块上的夹子。 印刷电路板限定了由多个通孔包围的连接器安装区域。 夹子具有向下按压散热器模块的基部，安装到相应孔的一对安装部分和从安装部分延伸并设置在夹子的相对侧上的一对按压部分，用于压靠散热片 模块。

公开(公告)号：US07601036B2

公开(公告)日：2009-10-13

申请号：US12077114

申请日：2008-03-17

Applicant: Chih-Pi Cheng ,  Hao-Yun Ma

Inventor： Chih-Pi Cheng ,  Hao-Yun Ma

IPC: H01R11/22

CPC classification number: H01R13/11 ,  H01R12/716

Abstract: A conductive contact (200) for electrically connecting with a chip module and a printed circuit board comprises a base portion (50), a top head portion (60) formed above the base portion adapted for connecting with a belt, at least one spring arm (70) extending sidewardly from the base portion and forming at least one contacting section (703) adapted for elastically contacting with the chip module, and a bottom soldering portion (80) extending form at least one of the base portion and the spring arm adapted for being soldered to the printed circuit board. The head portion defines a cutout (601) recessed downwardly from a top edge (602) thereof to reduce connecting length between the head portion and the belt and reduce siphonic effect when plating the spring arm.

Abstract translation: 用于与芯片模块和印刷电路板电连接的导电触点（200）包括基部（50），形成在适于与皮带连接的基部上方的顶部头部（60），至少一个弹簧臂 （70），其从所述基部侧向延伸并且形成适于与所述芯片模块弹性接触的至少一个接触部分（703），以及底部焊接部分（80），其基本部分和所述弹簧臂中的至少一个延伸， 用于焊接到印刷电路板。 头部限定从其顶部边缘（602）向下凹陷的切口（601），以减少头部和带之间的连接长度，并且在镀覆弹簧臂时减少虹吸效应。

公开(公告)号：US20050169568A1

公开(公告)日：2005-08-04

申请号：US10996474

申请日：2004-11-26

Applicant: Hen-Tai Shang ,  I-Wen Wu ,  Chun-Chu Yang ,  Chih-Pi Cheng

Inventor： Hen-Tai Shang ,  I-Wen Wu ,  Chun-Chu Yang ,  Chih-Pi Cheng

IPC: G01C9/06 ,  G02B6/00 ,  G02B6/02

CPC classification number: G01C9/06 ,  G01C2009/066 ,  G02B6/022

Abstract: An optical fiber inclinometer comprises a pair of fiber Bragg grating devices, a fixed base, a connection plate, and a rotatable base. One end of the connection plate is fixed to the fixed base, whereas the other end of the connection plate is connected to the rotatable base through the joint of a turning pair mechanism between them. The two ends of each fiber Bragg grating device are installed onto the fixed base and the rotatable base respectively, and the two devices are mounted on the opposite side of the connection plate. Once the rotatable base rotates around the joint of the connection plate, axial tensile elongation occurs in one of the fiber Bragg grating devices, whereas axial compressive deformation occurs in the other device. The rotation angle of the rotatable base relative to the connection plate can be obtained by measuring and calculating the Bragg wavelength drifts of the pair of fiber Bragg grating devices respectively.

Abstract translation: 光纤倾斜仪包括一对光纤布拉格光栅装置，固定基座，连接板和可旋转基座。 连接板的一端固定到固定基座，而连接板的另一端通过它们之间的转动对机构的接头连接到可旋转基座。 每个光纤布拉格光栅装置的两端分别安装在固定基座和可旋转基座上，两个装置安装在连接板的相对侧上。 一旦可旋转的基座围绕连接板的接头旋转，则在一个光纤布拉格光栅装置中发生轴向拉伸伸长，而在另一个装置中发生轴向压缩变形。 旋转底座相对于连接板的旋转角度可以通过分别测量和计算一对光纤布喇格光栅器件的布拉格波长漂移来获得。

公开(公告)号：US08894422B2

公开(公告)日：2014-11-25

申请号：US13271242

申请日：2011-10-12

Applicant: Cheng-Chi Yeh ,  Nan-Hung Lin ,  Andrew Cheng ,  Chih-Pi Cheng ,  Shuo-Hsiu Hsu ,  Ting-Yao Hung

Inventor： Cheng-Chi Yeh ,  Nan-Hung Lin ,  Andrew Cheng ,  Chih-Pi Cheng ,  Shuo-Hsiu Hsu ,  Ting-Yao Hung

IPC: H01R12/00 ,  H01R12/57 ,  H01R4/02 ,  H05K3/34 ,  H05K7/10 ,  H01R12/71 ,  H01R13/24 ,  H01R43/02

CPC classification number: H01R12/57 ,  H01R4/024 ,  H01R12/716 ,  H01R13/2442 ,  H01R43/0256 ,  H05K3/3426 ,  H05K7/1069 ,  H05K2201/10325 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: An electrical connector includes an insulative housing with a number of through holes extending therethrough, a number of contacts assembled to the insulative housing, and a number of solder balls disposed in the though holes and each is clasped by the tail and insulative housing. Each contact includes a vertical base portion secured to a first side of the through hole, a contact engaging arm extending from a top end of the base portion, and a solder portion extending from a bottom end of the base portion. The solder portion has a wave arrangement below the base portion and projecting from the base portion to a second side of the through hole which opposites to said first side, and a tail extending downwardly from the wave arrangement and capable of moving from the first side to the second side.

Abstract translation: 电连接器包括绝缘壳体，其具有穿过其中延伸的多个通孔，组装到绝缘壳体上的多个触点，以及设置在通孔中的多个焊球，并且每个焊球被尾部和绝缘壳体扣紧。 每个触点包括固定到通孔的第一侧的垂直底部，从基部的顶端延伸的触点接合臂以及从基部的底端延伸的焊接部。 焊接部分具有在基部下方的波形布置，并且从基部突出到通孔的与所述第一侧相对的第二侧，以及从波浪组件向下延伸并能够从第一侧向第 第二面。

公开(公告)号：US08668502B2

公开(公告)日：2014-03-11

申请号：US13231977

申请日：2011-09-14

Applicant: Yen-Chih Chang ,  Chih-Pi Cheng

Inventor： Yen-Chih Chang ,  Chih-Pi Cheng

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H01R13/2442

Abstract: An electrical assembly used for connecting an IC package, includes at least an upper and a lower layer stacked with each other, wherein the upper layer is formed with an opening for receiving a socket connector. The socket connector has contacts electrically connected to conductive traces respectively provided on the upper and the lower layer.

Abstract translation: 用于连接IC封装的电组件至少包括彼此堆叠的上层和下层，其中上层形成有用于接收插座连接器的开口。 插座连接器具有电连接到分别设置在上层和下层上的导电迹线的触点。

公开(公告)号：US08295042B2

公开(公告)日：2012-10-23

申请号：US12686398

申请日：2010-01-13

Applicant: Chih-Pi Cheng ,  Chi-Nan Liao

Inventor： Chih-Pi Cheng ,  Chi-Nan Liao

IPC: H05K7/20 ,  G06F1/20

CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electrical connector assembly electrically connecting a CPU and a printed circuit board includes an electrical connector mounted on the printed circuit board, and a heat dissipating device mounted upon the CPU. The heat dissipating device includes a load plate, a heat pipe, and a heat plate. The load plate is mounted upon the CPU under condition that heat generated from the CPU is absorbed by the heat pipe and the heat plate. The load plate is sandwiched between the heat plate and the heat pipe. The load plate has two clips each of which has two cantilever arms extending toward and engaging with the other clip.

Abstract translation: 电连接CPU和印刷电路板的电连接器组件包括安装在印刷电路板上的电连接器和安装在CPU上的散热装置。 散热装置包括负载板，热管和加热板。 在CPU产生的热量被热管和热板吸收的情况下，负载板安装在CPU上。 负载板夹在加热板和热管之间。 负载板具有两个夹子，每个夹具具有两个向另一夹子延伸并与另一夹子接合的悬臂。

公开(公告)号：US08292666B2

公开(公告)日：2012-10-23

申请号：US13049902

申请日：2011-03-17

Applicant: Chih-Pi Cheng ,  Jia-Hau Liu

Inventor： Chih-Pi Cheng ,  Jia-Hau Liu

IPC: H01R24/00

CPC classification number: H01R12/714 ,  H01R13/2442 ,  H05K7/1069

Abstract: An electrical connector includes an insulative housing defining a plurality of passageways and a plurality of contacts disposed in the passageways by two arrangement manners. Each contact includes a mating portion located at an upper end and a soldering portion located at a bottom end. Wherein a first arrangement manner is that neighboring mating portions defined a distance in a same row is smaller than a distance defined by corresponding neighboring soldering portions, and neighboring mating portions defined a distance in a same column is equal to a distance defined by corresponding neighboring soldering portions. A second arrangement manner is that neighboring mating portions defined a distance in both a same row and a same column is smaller than a distance defined by corresponding neighboring soldering portions.

Abstract translation: 电连接器包括限定多个通道的绝缘壳体和通过两种布置方式设置在通道中的多个触点。 每个触点包括位于上端的配合部分和位于底端的焊接部分。 其中以第一布置方式是限定相同行中的距离的相邻匹配部分小于由相应的相邻焊接部分限定的距离，并且限定在相同列中的距离的相邻匹配部分等于由相应的相邻焊接限定的距离 部分。 第二布置方式是在相同行和同一列中限定距离的相邻匹配部分小于由相应的相邻焊接部分限定的距离。

公开(公告)号：US20120018747A1

公开(公告)日：2012-01-26

申请号：US13187515

申请日：2011-07-21

Applicant: ANDREW CHENG ,  CHIH-PI CHENG

Inventor： ANDREW CHENG ,  CHIH-PI CHENG

IPC: H01L33/62 ,  H01L33/08 ,  H01L33/52

CPC classification number: H05K3/32 ,  F21K9/90 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/58 ,  H01L33/62 ,  H01L2224/48472 ,  H05K3/284 ,  H05K2201/0311 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/1031 ,  Y02P70/611

Abstract: An LED lead frame assembly comprises a wiring board having a plurality set of positive and negative poles arranged on a top surface thereof A plurality of LED chips are disposed on the wiring board, and electrically bonded to the bus line. A transparent cover is arranged upon the wiring board and covering the LED chip and the conductive lead.

Abstract translation: LED引线框架组件包括布置在其顶表面上的多组正极和负极的布线板。多个LED芯片设置在布线板上，并电连接到总线上。 透明盖布置在接线板上并覆盖LED芯片和导电引线。

公开(公告)号：US20110111638A1

公开(公告)日：2011-05-12

申请号：US12900429

申请日：2010-10-07

Applicant: CHIH-PI CHENG

Inventor： CHIH-PI CHENG

IPC: H01R33/00

CPC classification number: H01R12/57 ,  B23K1/0016 ,  B23K1/20 ,  H01R43/0256 ,  H05K3/3426 ,  H05K7/1069 ,  H05K2201/10189 ,  H05K2201/10984 ,  H05K2203/041 ,  Y02P70/613

Abstract: Disclosed herewith a socket connector configured with an insulative housing defining a mating interface surrounded with peripheral walls and a mounting surface. A plurality of passageways is defined between the mating interface and the mounting surface and having an opening at the mounting surface. The insulative housing includes an encampment associated with each of the passageway at the mounting surface, and includes an extension crossing over an inner wall of the passageway to substantially narrow the opening of the opening. The socket connector furthers includes a plurality of contact terminals each received in the passageway and further includes a curvilinear solder portion extending beyond the mounting surface. And the socket connector further is incorporated with a plurality of solder balls each disposed between the encampment and the curvilinear solder portion.

公开(公告)号：US07887356B1

公开(公告)日：2011-02-15

申请号：US12730265

申请日：2010-03-24

Applicant: Andrew Cheng ,  Hu-Guang Luo ,  Chia-Wei Fan ,  Chih-Pi Cheng

Inventor： Andrew Cheng ,  Hu-Guang Luo ,  Chia-Wei Fan ,  Chih-Pi Cheng

IPC: H01R13/62

CPC classification number: H05K7/1069

Abstract: A socket connector includes a socket body, a plurality of contact terminals received in the socket body. The socket body includes an upper surface, a plurality of sidewalls extending upwardly from the upper surface. The upper surface and the sidewalls jointly define a cavity for receiving an IC package therein. A plurality of protrusions extend upwardly from the upper surface and formed separately from the sidewall. The protrusions being discretely distributed at periphery of the IC package and thereby positioning the IC package.

Abstract translation: 插座连接器包括插座主体，容纳在插座主体中的多个接触端子。 插座主体包括上表面，从上表面向上延伸的多个侧壁。 上表面和侧壁共同限定用于在其中接收IC封装的空腔。 多个突起从上表面向上延伸并与侧壁分开形成。 这些突起离散地分布在IC封装的周边，从而定位IC封装。