公开(公告)号：US07289661B2

公开(公告)日：2007-10-30

申请号：US10661633

申请日：2003-09-15

Applicant: Chung-Sam Jun ,  Sun-Yong Choi ,  Kwang-Soo Kim ,  Joo-Woo Kim ,  Jeong-Hyun Choi ,  Dong-Jin Park

Inventor： Chung-Sam Jun ,  Sun-Yong Choi ,  Kwang-Soo Kim ,  Joo-Woo Kim ,  Jeong-Hyun Choi ,  Dong-Jin Park

IPC: G06K9/00

CPC classification number: H01L21/67253 ,  G01N21/9503 ,  G01N21/95607 ,  G01N2021/0162 ,  G01N2021/0187 ,  G01N2021/1736 ,  G01N2021/1772 ,  G01N2021/8411 ,  G01N2021/8896 ,  G01N2021/95615 ,  G01N2201/103 ,  G01N2201/1087

Abstract: An automated and integrated substrate inspecting apparatus for performing an EBR/EEW inspection, a defect inspection of patterns and reticle error inspection of a substrate includes a first stage for supporting a substrate; a first image acquisition unit for acquiring a first image of a peripheral portion of the substrate supported by the first stage; a second stage for supporting the substrate; a second image acquisition unit for acquiring a second image of the substrate supported by the second stage; a transfer robot for transferring the substrate between the first stage and the second stage; and a data processing unit, connected to the first image acquisition unit and the second image acquisition unit, for inspecting results of an edge bead removal process and an edge exposure process performed on the substrate using the first image, and for inspecting for defects of patterns formed on the substrate using the second image.

Abstract translation: 用于执行EBR / EEW检查的自动化和一体化的基板检查装置，对基板的图案和掩模版错误检查的缺陷检查包括用于支撑基板的第一阶段; 第一图像获取单元，用于获取由所述第一平台支撑的所述基板的周边部分的第一图像; 用于支撑衬底的第二阶段; 第二图像获取单元，用于获取由第二平台支撑的基板的第二图像; 用于在第一阶段和第二阶段之间转移衬底的传送机器人; 以及数据处理单元，连接到第一图像获取单元和第二图像获取单元，用于检查使用第一图像在基板上执行的边缘珠去除处理和边缘曝光处理的结果，并且用于检查图案的缺陷 使用第二图像在基板上形成。

公开(公告)号：US20070188748A1

公开(公告)日：2007-08-16

申请号：US11703095

申请日：2007-02-07

Applicant: Koung-Su Shin ,  Dong-Su Ha ,  Chung-Sam Jun

Inventor： Koung-Su Shin ,  Dong-Su Ha ,  Chung-Sam Jun

IPC: G01J3/00

CPC classification number: G01J3/10 ,  G01J3/02 ,  G01J3/0267 ,  G01J3/0291 ,  G01N21/255

Abstract: An apparatus for examining spectral characteristics of an object may include a chuck configured to support and releasably fix the object, wherein the chuck is larger than the object, a first light source assembly integral with the chuck and configured to illuminate a bottom surface of the object with light having a predetermined spectrum and intensity, and a transmission analysis unit for collecting and analyzing light transmitted through the object. The first light source assembly may include multiple and/or adjustable light sources. A second light source assembly may illuminate a top surface of the object, and a reflection analysis unit may collect resultant reflected light.

Abstract translation: 用于检查物体的光谱特性的装置可以包括配置成支撑和可释放地固定物体的卡盘，其中卡盘大于物体;第一光源组件，与卡盘一体并且被构造成照射物体的底面 具有预定的光谱和强度的光，以及用于收集和分析透过物体的光的透射分析单元。 第一光源组件可以包括多个和/或可调光源。 第二光源组件可以照亮物体的顶表面，并且反射分析单元可以收集所得到的反射光。

公开(公告)号：US20070041609A1

公开(公告)日：2007-02-22

申请号：US11421019

申请日：2006-05-30

Applicant: Ki-Suk CHUNG ,  Chung-Sam JUN ,  Yu-Sin YANG ,  Byung-Sug LEE ,  Ji-Young SHIN ,  Tae-Sung KIM

Inventor： Ki-Suk CHUNG ,  Chung-Sam JUN ,  Yu-Sin YANG ,  Byung-Sug LEE ,  Ji-Young SHIN ,  Tae-Sung KIM

IPC: G06K9/00

CPC classification number: G06T7/0004

Abstract: A method of classifying defects of an object includes irradiating multi-wavelength light onto the object, splitting light reflected from the object into light beams, each of the light beams having different wavelengths, obtaining image information of the object based on each of the light beams, forming a characteristic matrix that represent the wavelengths and the image information, and analyzing the characteristic matrix to determine types of the defects on the object. Thus, the defects may be accurately classified using a difference between reactivity of each of the defects in accordance with variations of the wavelengths and inspection conditions.

Abstract translation: 对物体的缺陷进行分类的方法包括将多波长光照射到物体上，将从物体反射的光分成光束，每个光束具有不同的波长，基于每个光束获得物体的图像信息 ，形成表示波长和图像信息的特征矩阵，并且分析特征矩阵以确定对象上的缺陷的类型。 因此，可以使用根据波长的变化和检查条件的每个缺陷的反应性之间的差异来精确地分类缺陷。

公开(公告)号：US07081952B2

公开(公告)日：2006-07-25

申请号：US10718817

申请日：2003-11-24

Applicant: Kye-Weon Kim ,  Chung-Sam Jun ,  Hyun-Tae Kang

Inventor： Kye-Weon Kim ,  Chung-Sam Jun ,  Hyun-Tae Kang

IPC: G01N21/00

CPC classification number: G01N21/95607

Abstract: A method for obtaining an image using a selective combination of wavelengths of light includes dispersing a light in accordance with wavelength bands of the light using a dispersing member, irradiating the dispersed light onto an object to measure reflectivities of the light reflected from the object in accordance with the wavelength bands of the light, comparing reflectivity differences between an objective region and a peripheral region of the object, selecting wavelength bands having the reflectivity differences indicated as either positive values or negative values, adjusting the dispersing member to transmit only the light having the selected wavelength bands, passing light only having the selected wavelength bands through the dispersing member to irradiate the light that has passed through the dispersing member onto the object, taking photographs of the object using the irradiated light, and superposing the photographs of the object to obtain the image of the object.

Abstract translation: 使用光的波长的选择性组合获得图像的方法包括使用分散构件分散根据光的波长带的光，将分散的光照射到物体上，以测量根据物体反射的光的反射率 利用光的波长带，比较物体的目标区域和外围区域之间的反射率差异，选择反射率差异的波长带表示为正值或负值，调节分散构件以仅透射具有 选择的波长带，使仅通过分散构件具有所选波长带的光将通过分散构件的光照射到物体上，使用照射光拍摄物体，并叠加物体的照片，以获得 对象的图像。

公开(公告)号：US20050191768A1

公开(公告)日：2005-09-01

申请号：US11054752

申请日：2005-02-09

Applicant: Young-Jee Yoon ,  Chung-Sam Jun ,  Chul-Gi Song ,  Sang-Mun Chon

Inventor： Young-Jee Yoon ,  Chung-Sam Jun ,  Chul-Gi Song ,  Sang-Mun Chon

IPC: G01N27/416 ,  G01R31/26 ,  H01L21/4763 ,  H01L21/66 ,  H01L21/768

CPC classification number: H01L22/14 ,  H01L21/76802 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A substrate measuring apparatus includes a reference value storage unit, an electron irradiator, a current measuring device, and a property value calculating device. The reference value storage unit stores data on the relationship between current flow in a sample substrate with a contact hole of known characteristics that is irradiated by an electron beam. The current measuring device measures current flow in a test substrate. The property value calculating device calculates the property value of the contact hole formed in a material layer of the test substrate using the current flow in the test substrate and the data stored in the reference value storage unit. The property values of the contact hole may be a surface area of underlying substrate exposed by a contact hole or an amount of residual material remaining in the contact hole.

Abstract translation: 基板测量装置包括参考值存储单元，电子辐射器，电流测量装置和属性值计算装置。 参考值存储单元存储关于样品基板中的电流与具有由电子束照射的已知特性的接触孔之间的关系的数据。 当前的测量装置测量测试基板中的电流。 属性值计算装置使用测试基板中的电流和存储在参考值存储单元中的数据来计算形成在测试基板的材料层中的接触孔的属性值。 接触孔的特性值可以是由接触孔暴露的下层基板的表面积或残留在接触孔中的残留材料的量。

公开(公告)号：US06927077B2

公开(公告)日：2005-08-09

申请号：US10704753

申请日：2003-11-12

Applicant: Tae-Min Eom ,  Yu-Sin Yang ,  Kwan-Woo Ryu ,  Park-Song Kim ,  Sang-Mun Chon ,  Sun-Yong Choi ,  Chung-Sam Jun

Inventor： Tae-Min Eom ,  Yu-Sin Yang ,  Kwan-Woo Ryu ,  Park-Song Kim ,  Sang-Mun Chon ,  Sun-Yong Choi ,  Chung-Sam Jun

IPC: H01L21/66 ,  G01R31/303 ,  G01R31/311 ,  H01L21/00 ,  G01N21/00 ,  G01R31/302

CPC classification number: G01R31/303 ,  G01R31/311

Abstract: An apparatus for measuring contamination of a semiconductor substrate includes a chuck for loading a substrate, a position detection means for recognizing a front surface of the loaded substrate to obtain position data of a portion of the substrate to be measured, a first driving part for moving the chuck in accordance with the position data to measure a rear portion of the substrate, and a surface measurement means disposed under the chuck for selectively measuring metal contamination of the substrate at the rear portion of the substrate. In operation, the substrate is loaded onto a chuck, position data of a portion of the substrate to be measured is obtained by recognizing patterns formed on the substrate, the substrate is then moved in accordance with the position data to measure a rear portion of the substrate, and metal contamination is selectively measured at the rear portion of the substrate.

Abstract translation: 一种用于测量半导体衬底的污染的装置，包括用于装载衬底的卡盘，位置检测装置，用于识别所加载的衬底的前表面，以获得要测量的衬底的一部分的位置数据，用于移动的第一驱动部件 所述卡盘根据位置数据来测量所述基板的后部;以及表面测量装置，设置在所述卡盘下方，用于选择性地测量所述基板的后部处的所述基板的金属污染。 在操作中，将基板装载到卡盘上，通过识别形成在基板上的图案来获得要测量的基板的一部分的位置数据，然后根据位置数据移动基板，以测量基板的后部 衬底和金属污染物在衬底的后部被选择性地测量。

公开(公告)号：US06650408B2

公开(公告)日：2003-11-18

申请号：US09988683

申请日：2001-11-20

Applicant: Chung-Sam Jun ,  Kye-Weon Kim ,  Yu-Sin Yang ,  Hyo-Hoo Kim

Inventor： Chung-Sam Jun ,  Kye-Weon Kim ,  Yu-Sin Yang ,  Hyo-Hoo Kim

IPC: G01N2100

CPC classification number: B24B37/013 ,  B24B49/12 ,  G01N21/9501

Abstract: A method for inspecting a polishing pad, an apparatus for performing the method, and a polishing device adopting the apparatus for preventing wafer defects. Polishing pad defects are detected by comparing optical data from a normal polishing pad, which does not cause wafer defects, with optical data from a polishing pad to be inspected. The respective optical data are obtained by radiating a beam into the polishing pad and then collecting and analyzing a beam reflected from the polishing pad.

公开(公告)号：US20160025654A1

公开(公告)日：2016-01-28

申请号：US14795396

申请日：2015-07-09

Applicant: Joon-Seo SONG ,  Woo-seok KO ,  Ji-Young SHIN ,  Seong-Jin YUN ,  Yu-Sin YANG ,  Sang-Kil LEE ,  Chung-Sam JUN

Inventor： Joon-Seo SONG ,  Woo-seok KO ,  Ji-Young SHIN ,  Seong-Jin YUN ,  Yu-Sin YANG ,  Sang-Kil LEE ,  Chung-Sam JUN

IPC: G01N21/95 ,  G01N21/88

CPC classification number: G01N21/9505 ,  G01N21/8806 ,  G01N21/9501 ,  G01N21/95692 ,  G01N2201/061

Abstract: Example embodiments relate to an apparatus and method for inspecting a substrate defect. The substrate defect inspecting apparatus includes a substrate, a light source emitting an infrared beam to the substrate, a detector detecting the infrared beam reflected from the substrate, and a defect analyzer receiving first information and second information from the detector and analyzing defects existing in the substrate. According to at least one example embodiment, the second information is acquired during a later process than the first information.

Abstract translation: 示例性实施例涉及用于检查衬底缺陷的装置和方法。 基板缺陷检查装置包括基板，向基板发射红外光束的光源，检测从基板反射的红外光束的检测器和从检测器接收第一信息和第二信息的缺陷分析器，并分析存在于 基质。 根据至少一个示例性实施例，在稍后的处理中获取第二信息而不是第一信息。

公开(公告)号：US07747063B2

公开(公告)日：2010-06-29

申请号：US11463281

申请日：2006-08-08

Applicant: Jung-Taek Lim ,  Chung-Sam Jun ,  Young-Jee Yoon ,  Sung-Hong Park

Inventor： Jung-Taek Lim ,  Chung-Sam Jun ,  Young-Jee Yoon ,  Sung-Hong Park

IPC: G06K9/00

CPC classification number: G06T7/001 ,  G06T2207/30148 ,  H01J2237/2817

Abstract: In an embodiment of a method of inspecting a substrate, the substrate on which minute structures are formed is divided into a plurality of inspection regions. A main inspection region among the inspection regions is selected. A main image of the main inspection region and sub-images of sub-inspection regions adjacent to the main inspection region are obtained. An average image of the main image and the sub-images is obtained. The average image is then compared with the main image to detect defects in the main inspection region. Gray levels may be used. The average image may have improved quality so that the defects in the selected inspection region may be rapidly and accurately detected. This process has an improved reliability. Further, the number of inspecting processes for the substrate may be reduced. And a line for the inspection process may be automated so that a worker-free line may be established.

Abstract translation: 在检查基板的方法的实施例中，其上形成有微小结构的基板被分成多个检查区域。 选择检验区域的主要检验区域。 获得主检查区域的主要图像和与主检查区域相邻的副检查区域的子图像。 获得主图像和子图像的平均图像。 然后将平均图像与主图像进行比较，以检测主检查区域中的缺陷。 可以使用灰度级。 平均图像可以具有改进的质量，使得可以快速和准确地检测所选择的检查区域中的缺陷。 该过程具有改进的可靠性。 此外，可以减少基板的检查过程的数量。 并且检查过程的一行可以是自动化的，从而可以建立无工人行。

公开(公告)号：US07666069B2

公开(公告)日：2010-02-23

申请号：US11783534

申请日：2007-04-10

Applicant: Tae-Kyoung Kim ,  Yun-Jung Jee ,  Kyoung-Su Shin ,  Chung-Sam Jun

Inventor： Tae-Kyoung Kim ,  Yun-Jung Jee ,  Kyoung-Su Shin ,  Chung-Sam Jun

IPC: B24B47/02

CPC classification number: H01L21/68785 ,  H01L21/6776

Abstract: The present invention is directed to a wafer holder and a related wafer conveyor system. The wafer holder holds a wafer and moves horizontally within a chamber. A contact area between the wafer and the wafer holder is reduced, and potential contaminants generated by ear between components of the wafer holder are trapped by an airtight cover. Since the wafer holder moves horizontally while being fixed to a guide rail, the wafer conveyor system reduces friction between the guide rail and the wafer holder.

Abstract translation: 本发明涉及晶片保持器和相关的晶片输送系统。 晶片保持器保持晶片并且在腔室内水平移动。 晶片和晶片保持架之间的接触面积减小，并且由晶片保持器的部件之间的耳朵产生的潜在的污染物被气密的盖子所困住。 由于晶片保持架在固定到导轨的同时水平移动，所以晶片传送系统减小了导轨和晶片保持器之间的摩擦。