Abstract:
Methods are provided for measuring the potential for mutual coupling in an integrated circuit package of any type or configuration using a network analyzer in conjunction with a coaxial test probe. Simple, low-cost test fixturing and methods of testing may be used to measure the parasitic capacitance and inductance of one or more I/O leads of an integrated circuit package, the measured parasitic capacitances and inductances providing an indication of the susceptibility of the integrated circuit package to mutual coupling between electrical leads of the package or between an electrical lead and other components of the integrated circuit package.
Abstract:
An integrated circuit characterization printed circuit board and method are provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of an integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.
Abstract:
An apparatus and method are described for reducing the timing skew on a printed circuit board including a plurality of conductive traces interconnecting a first node and a second node. At least one section is removed from at least one printed circuit board trace to thereby sever a trace and prevent signals passing from the first node to the second node from following the severed trace. In this manner, signal path length can be adjusted to reduce timing skews in the circuit. Sections are removed from the traces by using a laser, CVD, a router, a plasma or by passing sufficient current through weakened areas of the traces.
Abstract:
An apparatus which provides the ability to charge or power multiple devices from multiple different power sources, and to communicate electronic data to and from one of the devices. The apparatus utilizes simple construction, requiring no active electronics, thereby reducing the cost of production and the reliability of the device. The apparatus employs a single USB connection cable with connectors on both ends and a second power-only cable and connector which is connected to the power wires of the USB cable and thereby is able to power a second portable device from a single USB port. USB master provide sufficient power for two average portable devices without additional circuitry. Moreover, restricting the data path to only one device also eliminates the need for USB hub circuitry. Finally, greater end user flexibility is provided by using a USB male connector as the source of the data and power connection, a USB female connector for the output of the data and power connection, and a standard barrel-type power connector for the power-only output connection. Having two different output connectors ensures that the user will not confuse the two connectors.
Abstract:
An integrated circuit characterization printed circuit board and method are provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of an integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.
Abstract:
A method is for making an integrated circuit on a semiconductor wafer, where the integrated circuit includes circuit features having a desired, relatively small, critical dimension. The method preferably comprises the steps of: designing a reticle including pattern features having a critical dimension to form corresponding circuit features based upon overlap areas defined by a plurality of exposure steps with a shift therebetween so that the circuit features have the desired, relatively small, critical dimension. The designing step preferably includes determining a scaling factor function for relating the critical dimension of the pattern features and the shift to the desired critical dimension of the circuit features and while taking into account that the scaling factor function is also a function of the shift. The method preferably includes steps of fabricating the reticle and using the reticle to make the integrated circuit on the semiconductor wafer based on the plurality of exposure steps. The present invention recognizes that the scaling factor is not a single number, but instead is a non-linear function which is also based upon the shift between exposure steps.
Abstract:
The present invention comprises switched capacitor amplifiers including positive feedback on semiconductor devices, wafers, and systems incorporating same and methods for amplifying signals using positive feedback, while maintaining a stable gain and producing an improved signal-to-noise ratio. One embodiment includes a switched capacitor amplifier comprising a CMOS amplifier, a feed-in switched capacitor, and a feedback switched capacitor. The feed-in switched capacitor couples an input signal to the non-inverting input of the CMOS amplifier. Similarly, the feedback switched capacitor couples the amplifier output to the non-inverting input to create a positive feedback loop. A capacitance of the feedback switched capacitor relative to a capacitance of the feed-in switched capacitor comprises a feedback proportion. This feedback proportion may be configured to maintain a stable gain of the switched capacitor amplifier and increase a signal-to-noise ratio of the switched capacitor amplifier, even with the switched capacitor amplifier in a positive feedback arrangement
Abstract:
The present invention comprises switched capacitor amplifiers including positive feedback, semiconductor devices, wafers and systems incorporating same and methods for amplifying signals using positive feedback, while maintaining a stable gain and producing an improved signal-to-noise ratio. One embodiment includes a switched capacitor amplifier comprising a Complementary Metal Oxide Semiconductor (CMOS) amplifier, a feed-in switched capacitor, and a feedback switched capacitor. The feed-in switched capacitor operably couples an input signal to the non-inverting input of the CMOS amplifier. Similarly, the feedback switched capacitor operably couples the amplifier output to the non-inverting input to create a positive feedback loop. A capacitance of the feedback switched capacitor relative to a capacitance of the feed-in switched capacitor comprises a feedback proportion. This feedback proportion may be configured to maintain a stable gain of the switched capacitor amplifier and increase a signal-to-noise ratio of the switched capacitor amplifier, even with the switched capacitor amplifier configured in a positive feedback arrangement.
Abstract:
A memory sense amplifier includes a sample and hold circuit followed by a differential amplifier. The sample and hold circuit samples a reference voltage on a bit line of a memory circuit when the sense amplifier is reset and a signal voltage on the same bit line when a signal representing a data bit is present in the bit line. The differential amplifier amplifies the difference between the signal voltage and the reference voltage.
Abstract:
A memory sense amplifier includes a sample and hold circuit followed by a differential amplifier. The sample and hold circuit samples a reference voltage on a bit line of a memory circuit when the sense amplifier is reset and a signal voltage on the same bit line when a signal representing a data bit is present in the bit line. The differential amplifier amplifies the difference between the signal voltage and the reference voltage.