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    Dual curing polymers and methods for their preparation and use
    13.
    发明授权
    Dual curing polymers and methods for their preparation and use 有权
    双固化聚合物及其制备和使用方法

    公开(公告)号：US08618233B2

    公开(公告)日：2013-12-31

    申请号：US12517211

    申请日：2007-11-07

    Applicant: Khristopher Alvarez ,  Nick Shephard ,  James Tonge

    Inventor： Khristopher Alvarez ,  Nick Shephard ,  James Tonge

    IPC: C08G77/08

    CPC classification number: C08G77/50 ,  C08J3/243 ,  C08J2383/04 ,  C08K5/54 ,  C09D183/14 ,  Y10T428/31663

    Abstract: A polymer cures by either radiation or moisture curing mechanisms, or both. The polymer is prepared by hydrosilylation. The polymer includes units of formula: (R22Si02/2)b, (R2Si03/2)c, (SiO4/2)d, (R1′)f, and (R23Si01/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1′ is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    Abstract translation: 聚合物通过辐射或湿气固化机制或两者固化。 聚合物通过氢化硅烷化制备。 聚合物包括式（R22SiO2 / 2）b，（R2Si03 / 2）c，（SiO4 / 2）d，（R1'）f和（R23Si01 / 2）g的单元，其中每个R1独立地是氧原子 或二价烃基; 每个R1'独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    Voltage transformation circuit
    15.
    发明授权
    Voltage transformation circuit 有权
    电压变换电路

    公开(公告)号：US07821245B2

    公开(公告)日：2010-10-26

    申请号：US11890362

    申请日：2007-08-06

    Applicant: Peter James Tonge

    Inventor： Peter James Tonge

    IPC: G05F3/04 ,  G05F3/16

    CPC classification number: G01R19/10 ,  H03F3/345 ,  H03F3/45475 ,  H03F2203/45136

    Abstract: A voltage transformation circuit comprising a first input, a second input, a first output, first and second impedances and a current mirror having master and slave terminals, wherein the first impedance is connected between the first input and the master terminal of the current mirror, the second impedance is connected between the second input and the slave terminal of the current mirror, and the first output is connected to the slave terminal of the current mirror.

    Abstract translation: 一种电压变换电路，包括第一输入端，第二输入端，第一输出端，​​第一和第二阻抗端以及具有主端子和从端子的电流镜，其中第一阻抗连接在电流镜的第一输入端和主端之间， 第二阻抗连接在电流镜的第二输入端和从端之间，第一输出连接到电流镜的从端。

    Dual Curing Polymers and Methods for Their Preparation and Use
    16.
    发明申请
    Dual Curing Polymers and Methods for Their Preparation and Use 失效
    双固化聚合物及其制备和使用方法

    公开(公告)号：US20100069523A1

    公开(公告)日：2010-03-18

    申请号：US12517220

    申请日：2007-12-10

    Applicant: Khristopher Edward Alvarez ,  Nick Evan Shephard ,  James Tonge

    Inventor： Khristopher Edward Alvarez ,  Nick Evan Shephard ,  James Tonge

    IPC: C08J3/28 ,  C08G77/04 ,  C08G77/12

    CPC classification number: C08G77/14 ,  C08G77/50 ,  C08J3/243 ,  C08J2383/06 ,  C08J2383/14 ,  C08L83/06 ,  C08L83/14 ,  C09D183/14 ,  C08L2666/28

    Abstract: A polymer cures by both radiation and moisture curing mechanisms. The polymer is prepared by hydrosilylation. The polymer is useful in adhesive compositions. The polymer includes units of formulae (I), (R22Si02/2)b, (R2Si03/2)c, (Si04/2)d, (R1)f, and (R23SiO1/2)g, where each R1 is independently an oxygen atom or a divalent hydrocarbon group; each R1 is independently divalent hydrocarbon group; each R2 is independently a monovalent organic group that is free of terminal aliphatic unsaturation each X is independently a monovalent hydrolyzable group; each J is independently a monovalent epoxy functional organic group; subscript a has a value of 1 or more; subscript b has a value of 0 or more; subscript c has a value of 0 or more; subscript d has a value of 0 or more; subscript e has a value of 1 or more; subscript f has a value of 0 or more; subscript g has a value of 0 or more; subscript s is 1, 2, or 3; and subscript t is 1, 2, or 3.

    Abstract translation: 聚合物通过辐射和湿气固化机制固化。 聚合物通过氢化硅烷化制备。 该聚合物可用于粘合剂组合物。 聚合物包括式（I），（R 22 SiO 2/2）b，（R 2 SiO 3/2）c，（SiO 4/2）d，（R 1）f和（R 23 SiO 1/2）g的单元，其中每个R 1独立地为 氧原子或二价烃基; 每个R 1独立地为二价烃基; 每个R 2独立地是不含末端脂族不饱和键的一价有机基团，每个X独立地是一价可水解基团; 每个J独立地是一价环氧官能的有机基团; 下标a的值为1以上; 下标b的值为0以上; 下标c的值为0以上; 下标d的值为0以上; 下标e的值为1以上; 下标f的值为0以上; 下标g的值为0以上; 下标s为1,2或3; 下标t为1,2或3。

    Lithography Technique Using Silicone Molds
    17.
    发明申请
    Lithography Technique Using Silicone Molds 审中-公开
    硅胶模具的平版印刷技术

    公开(公告)号：US20070269747A1

    公开(公告)日：2007-11-22

    申请号：US11659989

    申请日：2005-08-31

    Applicant: Maneesh Bahadur ,  Wei Chen ,  John Albaugh ,  Brian Harkness ,  James Tonge

    Inventor： Maneesh Bahadur ,  Wei Chen ,  John Albaugh ,  Brian Harkness ,  James Tonge

    IPC: G03F7/00 ,  G03F7/004 ,  G03F7/027

    CPC classification number: B82Y10/00 ,  B82Y40/00 ,  C08F220/18 ,  C08F220/22 ,  C08F222/1006 ,  G03F7/0002 ,  G03F7/0046 ,  G03F7/027

    Abstract: A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.

    Abstract translation: 一种方法包括以下步骤：A）用可固化（甲基）丙烯酸酯配方填充具有图案化表面的硅氧烷模具，B）固化可固化（甲基）丙烯酸酯配方以形成图案化特征，C）将硅氧烷模具和 图案化特征，任选地D）蚀刻图案化特征，以及可选地E）重复步骤A）至D）重新使用硅酮模具。 可固化（甲基）丙烯酸酯配方含有氟官能（甲基）丙烯酸酯，（甲基）丙烯酸酯和光引发剂。

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