公开(公告)号：US20130233594A1

公开(公告)日：2013-09-12

申请号：US13774511

申请日：2013-02-22

Applicant: Jun-Der Lee ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua Tsai ,  Tung-Han Chuang

IPC: H01L23/00 ,  H01B13/30

CPC classification number: H01L24/45 ,  H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2224/48507 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/48824 ,  H01L2224/85203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01327 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00 ,  H01L2924/01079 ,  H01L2924/00015 ,  H01L2924/01014 ,  H01L2924/013 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-gold-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 金 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。

公开(公告)号：US20130233593A1

公开(公告)日：2013-09-12

申请号：US13774451

申请日：2013-02-22

Applicant: Jun-Der LEE ,  WIRE TECHNOLOGY CO., LTD.

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: H01B1/02 ,  H01B13/30

CPC classification number: H01B1/02 ,  H01B13/30 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/43 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45639 ,  H01L2224/45644 ,  H01L2224/45655 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2224/45673 ,  H01L2224/48511 ,  H01L2224/48624 ,  H01L2224/48824 ,  H01L2224/85206 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01046 ,  H01L2924/00015 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: The invention provides a composite wire for electronic package, the composite wire including an alloy core member and a plating layer forming on a surface of the alloy core member. The alloy core member is silver-palladium alloy. The plating layer is at least one layer of thin film of pure gold, pure palladium or gold-palladium alloy. The invention also provides a method for manufacturing the composite wire. The method includes steps of: (a) providing a wire rod, (b) forming a wire having a predetermined diameter from the wire rod by a plurality of processes including cold working and annealing and (c) forming a plating layer on a surface of the wire rod before step (b) or forming a plating layer on a surface of the wire after step (b) by electroplating, sputtering or vacuum evaporation.

Abstract translation: 本发明提供了一种用于电子封装的复合线，该复合线包括合金芯构件和在该合金芯构件的表面上形成的镀层。 合金芯材是银 - 钯合金。 镀层是纯金，纯钯或金钯合金的至少一层薄膜。 本发明还提供一种制造复合线材的方法。 该方法包括以下步骤：（a）提供线材，（b）通过包括冷加工和退火的多种工艺从线材形成具有预定直径的线材，以及（c）在表面上形成镀层 步骤（b）之前的线材，或者在步骤（b）之后通过电镀，溅射或真空蒸发在电线表面上形成镀层。

公开(公告)号：US20130171470A1

公开(公告)日：2013-07-04

申请号：US13495800

申请日：2012-06-13

Applicant: Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

Inventor： Jun-Der LEE ,  Hsing-Hua TSAI ,  Tung-Han CHUANG

IPC: B32B15/01 ,  C22C5/06 ,  C22F1/14 ,  B32B15/02

CPC classification number: B32B15/018 ,  C22C5/06 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/0132 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/45669 ,  H01L2224/45647 ,  H01L2924/01204 ,  H01L2224/48 ,  H01L2924/00013 ,  H01L2224/4321 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2924/01045 ,  H01L2924/01004 ,  H01L2924/01005

Abstract: An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

Abstract translation: 提供由选自银 - 金合金，银 - 钯合金和银 - 钯 - 钯合金之一的材料制成的合金丝。 合金线具有面心立方晶格的多晶结构，并且包括多个晶粒。 合金线的中心部分包​​括细长晶粒或等轴晶粒，合金线的其他部分由等轴晶粒组成。 一定数量的具有退火双晶的晶粒是合金丝的晶粒总量的20％以上。

公开(公告)号：US20130164169A1

公开(公告)日：2013-06-27

申请号：US13627880

申请日：2012-09-26

Applicant: Jun-Der Lee

Inventor： Jun-Der Lee

IPC: C22C5/06

CPC classification number: B21C1/003 ,  B21C37/047 ,  B22D11/00 ,  B22D21/027 ,  B23K35/0261 ,  B23K35/22 ,  B23K35/24 ,  B23K35/3006 ,  B23K35/40 ,  C22C1/02 ,  C22C5/06 ,  C22F1/00 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/4321 ,  H01L2224/4381 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/745 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2924/01005 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2224/45144 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A manufacturing method for a composite alloy bonding wire and products thereof are provided. A primary material of Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain an Ag—Pd alloy solution. The obtained Ag—Pd alloy solution is drawn to obtain an Ag—Pd alloy wire. The Ag—Pd alloy wire is then drawn to obtain an Ag—Pd alloy bonding wire with a predetermined diameter.

Abstract translation: 提供了复合合金接合线的制造方法及其制造方法。 Ag的主要材料在真空熔化炉中熔化，然后将Pd的二次金属材料加入到真空熔化炉中，并与主要材料共熔，得到Ag-Pd合金溶液。 将得到的Ag-Pd合金溶液拉伸以获得Ag-Pd合金线。 然后将Ag-Pd合金线拉伸以获得具有预定直径的Ag-Pd合金接合线。

公开(公告)号：US08101123B2

公开(公告)日：2012-01-24

申请号：US12408987

申请日：2009-03-23

Applicant: Jun-Der Lee

Inventor： Jun-Der Lee

IPC: C22C5/06 ,  C22F1/00

CPC classification number: C22C5/06 ,  B21C1/003 ,  B21C37/047 ,  B23K35/0261 ,  B23K35/24 ,  B23K35/3006 ,  C22C1/02 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A manufacturing method for a composite alloy bonding wire and products thereof. A primary material of Au and Ag is melted in a vacuum melting furnace, and then a secondary metal material of Pd is added into the vacuum melting furnace and is co-melted with the primary material to obtain a Au—Ag—Pd alloy solution. The obtained Au—Ag—Pd alloy solution is drawn to obtain a Au—Ag—Pd alloy wire. The Au—Ag—Pd alloy wire is then drawn to obtain a Au—Ag—Pd alloy bonding wire with a predetermined diameter.

Abstract translation: 一种复合合金接合线的制造方法及其制造方法。 Au和Ag的主要材料在真空熔化炉中熔融，然后将Pd的二次金属材料加入到真空熔化炉中，并与主要材料共熔，得到Au-Ag-Pd合金溶液。 将得到的Au-Ag-Pd合金溶液拉伸，得到Au-Ag-Pd合金线。 然后将Au-Ag-Pd合金线拉伸以获得具有预定直径的Au-Ag-Pd合金接合线。

公开(公告)号：US20090297391A1

公开(公告)日：2009-12-03

申请号：US12128097

申请日：2008-05-28

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: C22C5/08 ,  C22C5/06 ,  B22D11/10

CPC classification number: C22C5/06 ,  B22D11/005 ,  C22C5/08 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/45139 ,  H01L2924/00011 ,  H01L2924/14 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01004 ,  H01L2924/01013 ,  H01L2924/013 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049 ,  H01L2924/01005

Abstract: A manufacturing method for a silver alloy bonding wire and products thereof A primary material of Ag is melted in a vacuum melting furnace, and then a plurality of secondary metal materials are added into the vacuum melting furnace and co-melted with the primary material to obtain a silver alloy ingot. The obtained silver alloy ingot is drawn to obtain a silver alloy wire. The silver alloy wire is then drawn to obtain a silver alloy bonding wire with a predetermined diameter.

Abstract translation: 银合金接合线的制造方法及其制造方法将Ag的一次材料在真空熔化炉中熔融，然后将多种二次金属材料添加到真空熔融炉中，与主要材料共熔，得到 银合金锭。 将得到的银合金锭拉伸，得到银合金线。 然后，对该银合金线进行拉伸，得到规定直径的银合金线。

公开(公告)号：US20090191088A1

公开(公告)日：2009-07-30

申请号：US12020884

申请日：2008-01-28

Applicant: Jun-Der LEE

Inventor： Jun-Der LEE

IPC: C22C5/08 ,  B21C9/00 ,  C22C5/06

CPC classification number: B21C3/02 ,  B21C37/047 ,  C22C5/06 ,  C22C5/08 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/435 ,  H01L2224/43848 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01201 ,  H01L2924/01202 ,  H01L2924/01203 ,  H01L2924/01204 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/01004 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/01049 ,  H01L2924/01006

Abstract: A manufacturing method for a composite metal bonding wire and products thereof. A material of Ag and Au is co-melted in a vacuum melting furnace, and then a plurality of trace metal elements are added into the vacuum melting furnace and co-melted with the material to obtain a composite metal ingot. The obtained composite metal ingot is drawn to obtain a composite metal wire. The composite metal wire is then drawn to obtain a composite metal bonding wire with a predetermined diameter.

Abstract translation: 复合金属接合线的制造方法及其制造方法。 Ag和Au的材料在真空熔化炉中共熔融，然后将许多微量金属元素加入真空熔化炉中并与该材料共熔，得到复合金属锭。 将得到的复合金属锭拉出，得到复合金属丝。 然后将复合金属丝拉伸以获得具有预定直径的复合金属接合线。