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公开(公告)号：US10957624B2
公开(公告)日：2021-03-23
申请号：US16840305
申请日：2020-04-03
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Will J. Tan
IPC: H01L23/473 , F28F3/12 , F28F13/06 , H01L21/48 , H05K7/20
Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins.
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公开(公告)号：US20190221911A1
公开(公告)日：2019-07-18
申请号：US16167217
申请日：2018-10-22
Applicant: Microfabrica Inc.
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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公开(公告)号：US20190218680A1
公开(公告)日：2019-07-18
申请号：US16182989
申请日：2018-11-07
Applicant: Microfabrica Inc.
Inventor： Gregory P. Schmitz , Michael S. Lockard , Ming-Ting Wu , Eric C. Miller , Adam L. Cohen
CPC classification number: C25D1/003 , B32B15/01 , B33Y10/00 , B33Y40/00 , B33Y70/00 , B33Y80/00 , C25D1/08 , C25D5/022 , C25D5/48 , C25D7/005
Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.
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公开(公告)号：US20180241112A1
公开(公告)日：2018-08-23
申请号：US15887921
申请日：2018-02-02
Applicant: Microfabrica Inc.
Inventor： Elliott R. Brown , John D. Evans , Christopher A. Bang , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley , Morton Grosser
Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, hybrid couplers, antenna arrays and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).
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公开(公告)号：US20180078276A1
公开(公告)日：2018-03-22
申请号：US15718780
申请日：2017-09-28
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ming Ting Wu , Arun S. Veeramani , Vacit Arat , Gregory P. Schmitz , Juan Diego Perea , Ronald Leguidleguid , Gregory B. Arcenio , Eric C. Miller
IPC: A61B17/3205
CPC classification number: A61B17/3205 , A61B10/0266 , A61B10/0283 , A61B17/32002 , A61B17/3203 , A61B17/320758 , A61B2017/00345 , A61B2017/00526 , A61B2017/320064 , A61B2017/320775 , A61F2009/00887
Abstract: Various embodiments of a tissue cutting device and methods for using are described. In some variations devices include an elongate tube having a proximal end and a distal end and a central axis extending from the proximal end to the distal end; a first annular element at the distal end of the elongate tube, the first annular element having a cutting portion at its distal; and a second annular element at the distal end of the elongate tube and concentric with the first annular element, the second annular element having a cutting portion at its distal end, the first and second annular elements being rotatable relative to one another to cause the first annular element and the second annular element to pass each other to shear tissue.
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Patent Agency Ranking
公开(公告)号：US20170260636A1
公开(公告)日：2017-09-14
申请号：US15389149
申请日：2016-12-22
Applicant: Microfabrica Inc.
Inventor： Gregory P. Schmitz , Michael S. Lockard , Ming-Ting Wu , Eric C. Miller , Adam L. Cohen
IPC: C25D1/00
CPC classification number: C25D1/003 , B32B15/01 , B33Y10/00 , B33Y40/00 , B33Y70/00 , B33Y80/00 , C25D1/08 , C25D5/022 , C25D5/48 , C25D7/005
Abstract: A counterfeiting deterrent device according to one implementation of the disclosure includes a plurality of layers formed by an additive process. Each of the layers may have a thickness of less than 100 microns. At least one of the layers has a series of indentations formed in an outer edge of the layer such that the indentations can be observed to verify that the device originated from a predetermined source. According to another implementation, a counterfeiting deterrent device includes at least one raised layer having outer edges in the shape of a logo. A light source is configured and arranged to shine a light through a slit in a substrate layer of the device and past an intermediate layer to light up the outer edge of the raised layer. The layers of the device are formed by an additive process and have a thickness of less than 100 microns each.
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公开(公告)号：US09533376B2
公开(公告)日：2017-01-03
申请号：US14156437
申请日：2014-01-15
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Heath A. Jensen , Uri Frodis , Christopher G. Wiita , Michael S. Lockard , Irina Boguslavsky , Pavel Lembrikov , Dennis R. Smalley , Richard T. Chen
CPC classification number: B23K26/38 , B23K26/0624 , B23K26/18 , B23K26/40 , B23K2101/40 , B23K2103/50 , G01R1/06738 , G01R1/06744 , G01R3/00
Abstract: Embodiments are directed to the formation micro-scale or millimeter scale structures or method of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).
Abstract translation: 实施例涉及形成微尺度或毫米级结构或制造这种结构的方法，其中结构由至少一个片状结构材料形成，并且可以包括附加的片状结构材料或沉积的结构材料，其中所有或部分图案化 的结构材料通过激光切割发生。 在一些实施例中，使用选择性沉积来提供图案化的一部分。 在一些实施例中，结构材料或结构材料由牺牲桥接材料（例如金属）从下方限定，并且可能由上面由牺牲性封盖材料（例如金属）限定。
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18.发明申请Cantilever Microprobes for Contacting Electronic Components and Methods for Making Such Probes 审中-公开用于接触电子元件的悬臂式微孔和制造这种探头的方法公开(公告)号：US20140231264A1
公开(公告)日：2014-08-21
申请号：US14260072
申请日：2014-04-23
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Ezekiel J.J. Kruglick , Christopher A. Bang , Dennis R. Smalley , Pavel B. Lembrikov
IPC: C25D5/02
CPC classification number: C25D5/02 , G01R1/0483 , G01R1/06711 , G01R1/06716 , G01R1/06727 , G01R1/06738 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/07357 , G01R3/00 , G01R31/2886
Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.
Abstract translation: 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及悬臂式探针结构的各种设计。 一些实施例涉及制造这种悬臂结构的方法。 在一些实施例中，例如，悬臂探头具有延伸的基部结构，在安装结构中滑动，多光束配置，偏移粘合位置，以允许相邻探针，具有张力构型的柔顺元件，改善的行程，改善的顺应性，改进的擦洗 能力和/或类似物。
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19.发明申请Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures 审中-公开具有电介质或活性碱的电化学结构和用于生产这种结构的方法和装置公开(公告)号：US20140209470A1
公开(公告)日：2014-07-31
申请号：US14184362
申请日：2014-02-19
Applicant: Microfabrica Inc.
Inventor： Jeffrey A. Thompson , Adam L. Cohen , Michael S. Lockard , Dennis R. Smalley
IPC: C25D1/00
CPC classification number: C25D1/003 , B81C1/00373 , B81C2201/0181 , B81C2201/019
Abstract: Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
Abstract translation: 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。
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20.发明申请公开(公告)号：US20140151237A1
公开(公告)日：2014-06-05
申请号：US14065720
申请日：2013-10-29
Applicant: Microfabrica Inc.
Inventor： Dennis R. Smalley
CPC classification number: C25D5/02 , B33Y10/00 , B33Y50/00 , B33Y50/02 , B81B2201/042 , B81C1/00126 , B81C1/0038 , C23C18/1605 , C23C18/1651 , C25D1/003 , G01P15/0802 , G01P15/125 , G06F17/5072 , H01L21/2885 , H01L21/76885 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647
Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.
Abstract translation: 通过沉积第一材料，选择性地蚀刻第一材料（例如经由掩模），沉积第二材料以填充由蚀刻产生的空隙，然后平坦化沉积物以便结合层，电化学地制造多层结构 被创建并且之后向之前形成的层添加附加层。 第一和第二沉积可以是毯子或选择类型。 用于形成连续层的形成过程的重复可以在有或没有变化（例如：在图案上的变化;与沉积，蚀刻和/或平面化操作相关联的数量或存在或参数的变化）中重复，操作顺序或沉积的材料 ）。 其他实施例使用使用与其它层相关联地沉积的材料与一些层相关联地沉积材料的操作形成多层结构。
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