THERMAL SENSOR PACKAGE FOR EARBUDS
    11.
    发明申请

    公开(公告)号:US20200249101A1

    公开(公告)日:2020-08-06

    申请号:US16441916

    申请日:2019-06-14

    Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

    ACCURATE MULTI-GAS ANALYZER
    12.
    发明申请

    公开(公告)号:US20180136182A1

    公开(公告)日:2018-05-17

    申请号:US15351086

    申请日:2016-11-14

    Inventor: Chien-Hsun WANG

    CPC classification number: G01N33/0036 G01N27/124 G01N33/0073

    Abstract: A multi-gas analysis includes a semiconductor gas sensor driven by a constant resistance driver circuit with a driving current to obtain a sensing output of a gas in a gas sample. A processing unit is operable, based on a reference voltage from the constant resistance driver circuit associated with the driving current, in one of a gas-identification mode, where the gas is identified based on the sensing output obtained in response to fine variation of the operating temperature of the semiconductor gas sensor, and a gas-detection mode, where an analysis result indicative of the concentration of the gas is obtained based on the sensing output obtained in response to an optimal operating temperature of the semiconductor gas sensor.

    TEMPERATURE SENSING DEVICE
    15.
    发明公开

    公开(公告)号:US20240230414A9

    公开(公告)日:2024-07-11

    申请号:US17970539

    申请日:2022-10-20

    CPC classification number: G01J5/07 G01J5/14

    Abstract: A temperature sensing device includes a substrate, a first reflective module, a first window cover, and a dual thermopile sensor. The first reflective module is disposed on the substrate, including a first mirror chamber with a narrow field of view (FOV), and the first reflective module focuses a thermal radiation from measured object to a first image plane in the first mirror chamber. The first window cover is disposed on the first reflective module, and the first window cover allows a selected band of the thermal radiation to pass through. The dual thermopile sensor is disposed on the substrate and located in the first mirror chamber, and the dual thermopile sensor senses a temperature data from the first image plane. Additional second reflective module, LED source plus pin hole with same FOV of dual thermopile sensor can illuminate the measured object for ease of placement of object to be heated.

    Hair dryer
    17.
    发明授权

    公开(公告)号:US11607023B2

    公开(公告)日:2023-03-21

    申请号:US16726602

    申请日:2019-12-24

    Abstract: A hair dryer comprises a fan, a heater, a temperature sensor, and a controller. The heater is disposed at the airflow output end of the fan and used to heat the airflow output by the fan. The temperature sensor is pointed to the hair, receiving the infrared light radiated by the hair to obtain the temperature of the hair, determining the dryness of the hair according to at least one of the temperature of the hair and the rate of temperature variation of the hair, and outputting a corresponding control signal. The controller is electrically connected with the fan, the heater and the temperature sensor, and controlling at least one of the rotation speed of the fan and the heating power of the heater according to the control signal. The above-mentioned hair dryer not only can prevent from hair overheating and hair damage but also can shorten the time for drying hair.

    Thermal sensor package for earbuds
    18.
    发明授权

    公开(公告)号:US11408781B2

    公开(公告)日:2022-08-09

    申请号:US16441916

    申请日:2019-06-14

    Abstract: A thermal sensor package for earbuds includes two thermopile sensor elements on a single thermopile sensor chip, and the two thermopile sensor elements are separated by a block wall of a cap. One of the thermopile sensor elements senses external infrared thermal radiation through a window of the cap, and the other thermopile sensor element senses internal infrared thermal radiation from a package structure as a basis for correcting compensation. Therefore, the foregoing thermal sensor package for earbuds can quickly correct a measurement error caused by the package structure to improve the measurement accuracy. In addition, the forgoing thermal sensor package for earbuds has a simple packaging step and is easy to arrange a silicon based infrared lens to expand its application.

    INFRARED TEMPERATURE SENSOR
    19.
    发明申请

    公开(公告)号:US20210364359A1

    公开(公告)日:2021-11-25

    申请号:US16924698

    申请日:2020-07-09

    Abstract: An infrared temperature sensor comprises a thermopile sensing chip. The thermopile sensing chip includes a chip substrate, a thermopile sensing unit, a heater and a temperature sensing element. The thermopile sensing unit is disposed on the chip substrate, receives infrared thermal radiation from a target and outputs a corresponding infrared sensation signal. The heater is disposed on the chip substrate and used to heat the chip substrate to a working temperature. The temperature sensing element is disposed on the chip substrate, senses the working temperature of the chip substrate and outputs a corresponding working temperature signal. In operation, the infrared temperature sensor can maintain the thermopile sensing unit at the preset working temperature. Thereby, a single-point temperature calibration is sufficient to obtain more accurate measurement results in a broad environmental temperature range.

Patent Agency Ranking