公开(公告)号：US20130136291A1

公开(公告)日：2013-05-30

申请号：US13494336

申请日：2012-06-12

Applicant: Sang Ho LEE ,  Yong Hyun SHIM

Inventor： Sang Ho LEE ,  Yong Hyun SHIM

IPC: H04R19/04

CPC classification number: H04R19/005

Abstract: A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space.

Abstract translation: MEMS麦克风包括具有侧壁，顶壁和开口底部的壳体; 一个PCB连接到壳体的底部; MEMS芯片，其布置在PCB上并且包括内部MEMS空间; 以及至少一个通过壳体的表面形成的用于引入外部声音的声孔，其中形成声孔和内部MEMS空间彼此连通的声道的内部通信单元布置在壳体内部 通过声孔引入的外部声音穿过声音路径并进入内部MEMS空间。

公开(公告)号：US08390110B2

公开(公告)日：2013-03-05

申请号：US12582582

申请日：2009-10-20

Applicant: Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

Inventor： Sang-Ho Lee ,  Taewoo Lee ,  Soo-San Park

IPC: H01L23/48

CPC classification number: H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/85 ,  H01L25/03 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18165 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A method of manufacture of an integrated circuit packaging system includes: mounting a substrate-less integrated circuit package, having a terminal having characteristics of an intermetallic compound, over a substrate; connecting the substrate and the substrate-less integrated circuit package; and forming a base encapsulation over the substrate-less integrated circuit package with the terminal exposed.

Abstract translation: 一种集成电路封装系统的制造方法，包括：在衬底上安装具有金属间化合物特性的端子的无基板集成电路封装; 连接基板和无基板集成电路封装; 以及在所述无衬底的集成电路封装上形成基底封装，所述端子暴露。

公开(公告)号：US08383458B2

公开(公告)日：2013-02-26

申请号：US12974265

申请日：2010-12-21

Applicant: DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

Inventor： DaeSik Choi ,  BumJoon Hong ,  Sang-Ho Lee ,  Jong-Woo Ha ,  Soo-San Park

IPC: H01L21/00 ,  H01L23/02

CPC classification number: H01L24/81 ,  H01L23/552 ,  H01L24/14 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81194 ,  H01L2224/81801 ,  H01L2224/83 ,  H01L2224/8592 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00012 ,  H01L2924/00011 ,  H01L2924/00

Abstract: A method for manufacturing an integrated circuit package system includes: providing a base package including a first integrated circuit coupled to a base substrate by an electrical interconnect formed on one side; and mounting an offset package over the base package, the offset package electrically coupled to the base substrate via a system interconnect.

Abstract translation: 一种用于制造集成电路封装系统的方法，包括：通过在一侧形成的电互连，提供包括耦合到基底基板的第一集成电路的基底封装; 以及将偏移封装安装在所述基底封装上，所述偏移封装通过系统互连电耦合到所述基底衬底。

公开(公告)号：US08280401B2

公开(公告)日：2012-10-02

申请号：US12676455

申请日：2008-08-25

Applicant: Jee Hyeon Na ,  Sang Ho Lee

Inventor： Jee Hyeon Na ,  Sang Ho Lee

IPC: H04W64/00 ,  H04W68/00

CPC classification number: H04W68/02

Abstract: The present invention relates to a method of managing a paging group in a mobile terminal that is in an idle mode. A method of managing a paging group according to an exemplary embodiment of the invention includes: collecting paging group ID information including paging group levels and local IDs; determining, on the basis of the collected paging group ID information, whether or not a location update occurs; and if it is determined that the location update occurs, comparing a location update cycle according to a location update time with a threshold value, selecting a paging group level on the basis of the comparison result, and selecting a paging group corresponding to the selected paging group level.

Abstract translation: 本发明涉及管理处于空闲模式的移动终端中的寻呼组的方法。 根据本发明的示例性实施例的管理寻呼组的方法包括：收集包括寻呼组级别和本地ID的寻呼组ID信息; 基于所收集的寻呼组ID信息确定是否发生位置更新; 并且如果确定位置更新发生，则根据位置更新时间与阈值比较位置更新周期，基于比较结果选择寻呼组级别，并且选择与所选寻呼相对应的寻呼组 组级别。

公开(公告)号：US20120228767A1

公开(公告)日：2012-09-13

申请号：US13477630

申请日：2012-05-22

Applicant: Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

Inventor： Sang-Ho Lee ,  Soo-San Park ,  DaeSik Choi

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L23/3128 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/29 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04073 ,  H01L2224/1134 ,  H01L2224/1308 ,  H01L2224/13099 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48475 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/85051 ,  H01L2224/85951 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An integrated circuit package system includes: providing a package substrate; mounting an interposer chip containing active circuitry over the package substrate; attaching a conductive bump stack having a base bump end and a stud bump end, the base bump end on the interposer chip; connecting a stack connector to the interposer chip and the package substrate; and applying a package encapsulant over the interposer chip, the stack connector, and the conductive bump stack with the stud bump end of the conductive bump stack substantially exposed.

Abstract translation: 集成电路封装系统包括：提供封装衬底; 将包含有源电路的插入器芯片安装在所述封装衬底上; 附接具有基底凸起端和柱形凸起端的导电凸块，所述基座凸起端在所述插入片上; 将堆叠连接器连接到插入器芯片和封装衬底; 以及将封装密封剂施加在所述插入器芯片，所述堆叠连接器以及所述导电凸块堆叠上，其中所述导电凸块的所述凸块的端部基本暴露。

公开(公告)号：USD666564S1

公开(公告)日：2012-09-04

申请号：US29404757

申请日：2011-10-25

Applicant: Sang-Ho Lee

Designer： Sang-Ho Lee

公开(公告)号：US08258008B2

公开(公告)日：2012-09-04

申请号：US12970755

申请日：2010-12-16

Applicant: Taewoo Lee ,  Sang-Ho Lee ,  SeungYun Ahn

Inventor： Taewoo Lee ,  Sang-Ho Lee ,  SeungYun Ahn

IPC: H01L21/00

CPC classification number: H01L23/5385 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/5384 ,  H01L24/48 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for manufacturing a package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates.

Abstract translation: 一种用于制造包装封装系统的方法，包括：提供插入器衬底; 将基底基板安装在所述插入器基板下方并具有与其连接的第一集成电路管芯; 在所述插入器基板和所述基底基板之间形成密封剂，所述密封剂封装所述第一集成电路管芯; 以及形成通过所述密封剂和所述衬底中的一个延伸到另一个衬底的通孔z-互连。

公开(公告)号：US08115293B2

公开(公告)日：2012-02-14

申请号：US12633789

申请日：2009-12-08

Applicant: DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

Inventor： DongSoo Moon ,  Taewoo Lee ,  Soo-San Park ,  SooMoon Park ,  Sang-Ho Lee

IPC: H01L21/60

CPC classification number: H01L25/50 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a first substrate; mounting a component over the first substrate; mounting a stack substrate over the component, the stack substrate having an inner pad and an outer pad connected to the first substrate; mounting a first exposed interconnect on the outer pad; forming a first encapsulation over the stack substrate, the first exposed interconnect partially exposed and the inner pad partially exposed in a recess of the first encapsulation; and mounting a second exposed interconnect on the inner pad.

Abstract translation: 一种集成电路封装系统的制造方法，包括：提供第一基板; 将部件安装在所述第一基板上; 将堆叠衬底安装在所述部件上，所述堆叠衬底具有内衬垫和连接到所述第一衬底的外衬垫; 将第一暴露的互连件安装在所述外垫上; 在所述堆叠衬底上形成第一封装，所述第一暴露的互连部分暴露，并且所述内衬垫部分地暴露在所述第一封装的凹部中; 以及将第二暴露的互连件安装在所述内垫上。

公开(公告)号：US08110905B2

公开(公告)日：2012-02-07

申请号：US12328717

申请日：2008-12-04

Applicant: DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

Inventor： DongSam Park ,  YoungSik Cho ,  Sang-Ho Lee

IPC: H01L23/495 ,  H01L21/58 ,  H01L21/60

CPC classification number: H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of manufacture of an integrated circuit packaging system includes: forming a substrate; mounting a base integrated circuit on the substrate; forming a leadframe interposer, over the base integrated circuit, by: providing a metal sheet, mounting an integrated circuit die on the metal sheet, injecting a molded package body on the integrated circuit die and the metal sheet, and forming a ball pad, a bond finger, or a combination thereof from the metal sheet that is not protected by the molded package body; coupling a circuit package on the ball pad; and forming a component package on the substrate, the base integrated circuit, and the leadframe interposer.

Abstract translation: 一种集成电路封装系统的制造方法，包括：形成衬底; 将基底集成电路安装在基板上; 在基底集成电路上形成引线框架插入件，通过：提供金属片，在金属片上安装集成电路管芯，将模制封装体注入集成电路管芯和金属片上，并形成球垫， 粘合指状物或其组合从未被模制包装体保护的金属片材; 将电路封装耦合在球垫上; 以及在基板，基底集成电路和引线框架插入件上形成部件封装。

公开(公告)号：US20110260882A1

公开(公告)日：2011-10-27

申请号：US13091543

申请日：2011-04-21

Applicant: Kwang Yeol Lee ,  Dong Won Han ,  Sang Ho Lee

Inventor： Kwang Yeol Lee ,  Dong Won Han ,  Sang Ho Lee

IPC: G08B21/00

CPC classification number: H04M1/72577 ,  H04M2250/12

Abstract: A proximity sensing method of a portable terminal and a proximity sensing apparatus thereof are provided. The proximity sensing method of a portable terminal with an illumination sensor includes determining an output of the illumination sensor, determining that the portable terminal is proximate to an object when the output of the illumination sensor has a set pattern, and determining that the portable terminal is not proximate to the object when the output of the illumination sensor does not the set pattern. The proximity sensing method of a portable terminal may support a proximity sensing function using an illumination sensor instead of a proximity sensor to reduce a manufacturing cost of the portable terminal. In addition, since the method does not need a separate proximity sensor, it may address a lack of mounting space problem.

Abstract translation: 提供了便携式终端的接近感测方法及其接近感测装置。 具有照明传感器的便携式终端的接近感测方法包括确定照明传感器的输出，当照明传感器的输出具有设定模式时，确定便携式终端接近物体，并且确定便携式终端是 当照明传感器的输出不是设定模式时，不靠近物体。 便携式终端的接近感测方法可以使用照明传感器代替接近传感器来支持接近感测功能，以降低便携式终端的制造成本。 另外，由于该方法不需要单独的接近传感器，所以可能解决了安装空间问题的缺乏。