公开(公告)号：US07863640B2

公开(公告)日：2011-01-04

申请号：US11710436

申请日：2007-02-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L23/34 ,  H05K1/14

CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

公开(公告)号：US07816156B2

公开(公告)日：2010-10-19

申请号：US11882167

申请日：2007-07-31

申请人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

发明人： Sang Hyun Choi ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sung Jun Lee ,  Chang Hyun Lim

IPC分类号： H01L29/22 ,  H01L23/498

CPC分类号： H01L33/641 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.

摘要翻译： 本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

公开(公告)号：US20100124071A1

公开(公告)日：2010-05-20

申请号：US12507356

申请日：2009-07-22

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

IPC分类号： F21V29/00 ,  F28F13/12

CPC分类号： F21V29/63 ,  B61D29/00 ,  F21S41/141 ,  F21S41/143 ,  F21S45/43 ,  F21V29/02 ,  F21W2102/00 ,  F21W2107/10 ,  F21Y2115/10 ,  F28F13/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.

摘要翻译： 一种用于振动发生机的发光器件封装的冷却装置，包括：设置在发光器件封装的一侧的散热板; 振动器，其设置为面对所述散热板并振动以根据所述振动发生机的振动产生气流; 以及振动传递单元，其构造成将所述振动器和所述散热板连接以允许从所述振动器产生的气流被传递到所述散热板以被冷却。

公开(公告)号：US07696525B2

公开(公告)日：2010-04-13

申请号：US11736159

申请日：2007-04-17

申请人： Yong Sik Kim ,  Seog Moon Choi ,  Hyun Ho Kim

发明人： Yong Sik Kim ,  Seog Moon Choi ,  Hyun Ho Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A surface mounting device-type light emitting diode (SMD-type LED) comprises a lead frame composed of a pair of lead terminals; a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window; an LED chip mounted on the lead frame inside the package; a wire for electrically connecting the LED chip and the lead frame; and a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.

摘要翻译： 表面安装器件型发光二极管（SMD型LED）包括由一对引线端子构成的引线框架; 一个将引线框架的一部分容纳在其中的封装，该封装具有一个打开的发射窗，使得光通过发射窗口发射; LED芯片安装在封装内的引线框架上; 用于电连接LED芯片和引线框架的导线; 以及填充在所述封装中的成型材料，所述成型材料具有形成在其表面上的具有预定形状的表面凹凸，所述表面凹凸通过所述封装的所述发射窗露出。

公开(公告)号：US07649208B2

公开(公告)日：2010-01-19

申请号：US11313508

申请日：2005-12-21

申请人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

发明人： Sung Jun Lee ,  Woong Lin Hwang ,  Seog Moon Choi ,  Ho Joon Park ,  Sang Hyun Choi ,  Chang Hyun Lim

IPC分类号： H01L27/15

CPC分类号： H01L31/147 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2924/00014

摘要： The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.

摘要翻译： 本发明涉及一种包括光电二极管的LED封装。 LED封装包括硅衬底，并且在其上部形成光电二极管。 而且，除了光电二极管的光接收面积以外，在硅基板上形成绝缘层。 在LED封装中，在绝缘层上形成LED端子以连接到光电二极管。 第一和第二LED连接焊盘形成在绝缘层上，并布置在光电二极管的两侧。 此外，LED芯片安装在硅衬底上，并连接到第一和第二LED连接焊盘。

公开(公告)号：US20090267505A1

公开(公告)日：2009-10-29

申请号：US12213241

申请日：2008-06-17

申请人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

IPC分类号： H01J1/62 ,  H01L31/00 ,  H01J9/02

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48227

摘要： The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

摘要翻译： 本发明涉及一种发光器件封装及其制造方法。 提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。

公开(公告)号：US20090095975A1

公开(公告)日：2009-04-16

申请号：US12332678

申请日：2008-12-11

申请人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

发明人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/26175 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.

摘要翻译： 一种用于防止半导体层之间的电短路并且具有优异的接合强度的发光二极管封装。 发光二极管封装包括封装衬底，结合到封装衬底的上表面的发光二极管芯片，以及用于将发光二极管芯片接合到封装衬底的接合材料。 封装基板具有形成在其接合表面中的凹部以容纳接合材料。

公开(公告)号：US20080283989A1

公开(公告)日：2008-11-20

申请号：US12153373

申请日：2008-05-16

申请人： Won Kyu Jeung ,  Seog Moon Choi ,  Job Ha ,  Sang Hee Park ,  Tae Hoon Kim

发明人： Won Kyu Jeung ,  Seog Moon Choi ,  Job Ha ,  Sang Hee Park ,  Tae Hoon Kim

IPC分类号： H01L23/055 ,  H01L21/54

CPC分类号： H01L23/26 ,  H01L23/055 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided are a wafer level package and a wafer level packaging method, which are capable of performing an attaching process at a low temperature and preventing contamination of internal devices. In the wafer level package, a device substrate includes a device region, where a device is formed, and internal pads on the top surface. The internal pads are electrically connected to the device. A cap substrate includes a getter corresponding to the device on the bottom surface. A plurality of sealing/attaching members are provided between the device substrate and the cap substrate to attach the device substrate and the cap substrate and seal the device region and the getter. The sealing/attaching members are formed of polymer. A plurality of vias penetrate the cap substrate and are connected to the internal pads. The getter provided in the sealed space defined by the sealing/attaching members can prevent the devices of the device region from being contaminated by moisture or foreign particles generated during the fabrication process, and the sealing/attaching process can be performed at a lower temperature compared with a typical sealing/attaching process using a metal.

摘要翻译： 提供了能够在低温下执行附着处理并防止内部装置的污染的晶片级封装和晶片级封装方法。 在晶片级封装中，器件衬底包括其中形成器件的器件区域和顶表面上的内部焊盘。 内部焊盘电连接到设备。 盖基板包括对应于底表面上的装置的吸气剂。 在装置基板和盖基板之间设置多个密​​封/附接构件，以附接装置基板和盖基板，并密封装置区域和吸气剂。 密封/附接构件由聚合物形成。 多个通孔穿过盖基板并连接到内部焊盘。 设置在由密封/附接构件限定的密封空间中的吸气剂可以防止装置区域的装置被制造过程中产生的湿气或异物污染，并且密封/附着过程可以在较低的温度下进行比较 具有典型的使用金属的密封/附着工艺。

公开(公告)号：US20070246715A1

公开(公告)日：2007-10-25

申请号：US11783948

申请日：2007-04-13

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

公开(公告)号：US20070201213A1

公开(公告)日：2007-08-30

申请号：US11710436

申请日：2007-02-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H05K1/14

CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。