公开(公告)号：US07696525B2

公开(公告)日：2010-04-13

申请号：US11736159

申请日：2007-04-17

申请人： Yong Sik Kim ,  Seog Moon Choi ,  Hyun Ho Kim

发明人： Yong Sik Kim ,  Seog Moon Choi ,  Hyun Ho Kim

IPC分类号： H01L21/00

CPC分类号： H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2933/0091 ,  H01L2924/00014

摘要： A surface mounting device-type light emitting diode (SMD-type LED) comprises a lead frame composed of a pair of lead terminals; a package housing a portion of the lead frame therein, the package having an emission window which is opened so that light is emitted through the emission window; an LED chip mounted on the lead frame inside the package; a wire for electrically connecting the LED chip and the lead frame; and a molding material filled in the package, the molding material having surface irregularities with a predetermined shape formed on the surface thereof which is exposed through the emission window of the package.

摘要翻译： 表面安装器件型发光二极管（SMD型LED）包括由一对引线端子构成的引线框架; 一个将引线框架的一部分容纳在其中的封装，该封装具有一个打开的发射窗，使得光通过发射窗口发射; LED芯片安装在封装内的引线框架上; 用于电连接LED芯片和引线框架的导线; 以及填充在所述封装中的成型材料，所述成型材料具有形成在其表面上的具有预定形状的表面凹凸，所述表面凹凸通过所述封装的所述发射窗露出。

公开(公告)号：US20090095975A1

公开(公告)日：2009-04-16

申请号：US12332678

申请日：2008-12-11

申请人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

发明人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/26175 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.

摘要翻译： 一种用于防止半导体层之间的电短路并且具有优异的接合强度的发光二极管封装。 发光二极管封装包括封装衬底，结合到封装衬底的上表面的发光二极管芯片，以及用于将发光二极管芯片接合到封装衬底的接合材料。 封装基板具有形成在其接合表面中的凹部以容纳接合材料。

公开(公告)号：US07268014B2

公开(公告)日：2007-09-11

申请号：US11314003

申请日：2005-12-22

申请人： Young Ki Lee ,  Seog Moon Choi ,  Yong Sik Kim ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Yong Sik Kim ,  Sang Hyun Shin

IPC分类号： H01L21/00

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2933/0075 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention provides a fabrication method of an LED package for easily fabricating LED packages of excellent heat radiation characteristics. In the method, a metallic package substrate having a recess and a reflecting surface formed in the recess is prepared, and the package substrate is selectively anodized and divided into two package electrode parts divided from each other. Then, an light emitting device is mounted on the bottom of the recess. Preferably, the package substrate is a metal substrate made of Al or Al-based metal.

摘要翻译： 本发明提供一种用于容易地制造具有优异散热特性的LED封装的LED封装的制造方法。 在该方法中，制备具有形成在凹部中的凹部和反射表面的金属封装基板，并且将封装基板选择性地阳极氧化并分成彼此分开的两个封装电极部分。 然后，将发光装置安装在凹部的底部。 优选地，封装衬底是由Al或Al基金属制成的金属衬底。

公开(公告)号：US07371603B2

公开(公告)日：2008-05-13

申请号：US11439189

申请日：2006-05-24

申请人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

发明人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10S438/974 ,  H01L2924/00014

摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

摘要翻译： 本发明涉及一种LED封装，并提出一种制造LED封装的方法，包括以下步骤：提供具有与LED连接的LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造 至少形成将形成树脂成型部件的封装基板的预定表面积。 该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图案电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

公开(公告)号：US08800137B2

公开(公告)日：2014-08-12

申请号：US12730128

申请日：2010-03-23

申请人： Jin Su Kim ,  Seog Moon Choi

发明人： Jin Su Kim ,  Seog Moon Choi

IPC分类号： H05K3/20

CPC分类号： H05K3/3457 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/3511 ,  H05K3/0052 ,  H05K3/3478 ,  H05K2203/0405 ,  Y10T29/49128 ,  Y10T29/49135 ,  Y10T29/4914 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49169 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： Embodiments of the invention provide a method of manufacturing a printed circuit board, including: mounting a strip substrate on a fixing member; separating the strip substrate into unit substrates by performing a singulation process; attaching solder balls onto the unit substrates using a jig; and fixing the solder balls on the unit substrates by performing a reflow process. The method of manufacturing a printed circuit board is advantageous in that the solder balls can be accurately formed at the predetermined positions of the strip substrate because they are attached to the unit substrates after the warpage of the strip substrate was reduced by a singulation process.

摘要翻译： 本发明的实施例提供一种制造印刷电路板的方法，包括：将条形基板安装在固定部件上; 通过执行单独处理将带状基板分离成单元基板; 使用夹具将焊球附着到单元基板上; 并通过进行回流处理将焊球固定在单元基板上。 制造印刷电路板的方法的优点在于，可以在条形基板的预定位置精确地形成焊球，因为在通过单切化处理减少带状基板的翘曲之后，它们附着到单元基板。

公开(公告)号：US08686295B2

公开(公告)日：2014-04-01

申请号：US12614407

申请日：2009-11-07

申请人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Young Ki Lee ,  Sung Keun Park

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K7/20

CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US08610146B2

公开(公告)日：2013-12-17

申请号：US12238663

申请日：2008-09-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2224/48091 ,  H01L2924/00 ,  H01L2224/0401

摘要： Provided is an LED package including a metal substrate that has one or more via holes formed therein; an insulating layer that is formed on a surface of the metal substrate including inner surfaces of the via holes; a plurality of metal patterns that are formed on the insulating layer and are electrically isolated from one another; and an LED chip that is mounted on a metal pattern among the plurality of metal patterns.

摘要翻译： 本发明提供一种LED封装体，其具有形成有一个以上的通孔的金属基板; 绝缘层，其形成在包括所述通孔的内表面的所述金属基板的表面上; 多个金属图案，形成在绝缘层上并且彼此电隔离; 以及安装在多个金属图案中的金属图案上的LED芯片。

公开(公告)号：US08586128B2

公开(公告)日：2013-11-19

申请号：US12467513

申请日：2009-05-18

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： B05D5/12

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

公开(公告)号：US08502374B2

公开(公告)日：2013-08-06

申请号：US13281285

申请日：2011-10-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

公开(公告)号：US20130020687A1

公开(公告)日：2013-01-24

申请号：US13301616

申请日：2011-11-21

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Jin Suk Son

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/50 ,  H01L21/565 ,  H01L23/24 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/73 ,  H01L25/072 ,  H01L2224/32245 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes first and second lead frames disposed to face each other; ceramic coating layers formed on a portion of a first surface of both or one of both of the first and second lead frames; and semiconductor devices mounted on second surfaces of the first and second lead frames.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括彼此相对设置的第一和第二引线框架; 形成在所述第一引线框架和所述第二引线框架中的两个或第二引线框架的第一表面的一部分上的陶瓷涂层; 以及安装在第一和第二引线框架的第二表面上的半导体器件。