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公开(公告)号：US09681533B2
公开(公告)日：2017-06-13
申请号：US14943337
申请日：2015-11-17
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
CPC分类号： H05K1/0204 , H01L23/445 , H05K1/00 , H05K5/0213 , H05K13/00
摘要： An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.
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公开(公告)号：US09648749B1
公开(公告)日：2017-05-09
申请号：US14943299
申请日：2015-11-17
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
CPC分类号： H05K1/181 , H05K1/0203 , H05K1/0271 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K3/303 , H05K3/46 , H05K2201/0338 , H05K2201/068 , H05K2201/09063 , H05K2201/09663 , H05K2201/09672 , H05K2201/09763
摘要： A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.
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公开(公告)号：US11693047B2
公开(公告)日：2023-07-04
申请号：US17366316
申请日：2021-07-02
申请人： Tessandra Anne Sage , Stanley Katsuyoshi Wakamiya , Jonathan Francis Van Dyke , Kevin Collao , Joshua P. Osborne
发明人： Tessandra Anne Sage , Stanley Katsuyoshi Wakamiya , Jonathan Francis Van Dyke , Kevin Collao , Joshua P. Osborne
CPC分类号： G01R31/2849 , G01R1/07342
摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes at least one wafer prober configured to implement a test on a superconducting die of the plurality of superconducting die via a plurality of electrical probe contacts. The system further includes a wafer chuck actuator system confined within a second chamber. The wafer chuck actuator system can be configured to provide at least one of translational and rotational motion of the wafer chuck to facilitate alignment and contact of a plurality of electrical contacts of the superconducting die to the respective plurality of electrical probe contacts of the at least one wafer prober.
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公开(公告)号：US11639957B2
公开(公告)日：2023-05-02
申请号：US17366337
申请日：2021-07-02
申请人： Kelsey McCusker , Stanley Katsuyoshi Wakamiya , Jonathan Shane Atienza , Jonathan Francis Van Dyke , Kevin Collao
发明人： Kelsey McCusker , Stanley Katsuyoshi Wakamiya , Jonathan Shane Atienza , Jonathan Francis Van Dyke , Kevin Collao
IPC分类号： G01R31/28
摘要： One example includes a cryogenic wafer test system. The system includes a first chamber that is cooled to a cryogenic temperature and a wafer chuck confined within the first chamber. The wafer chuck can be configured to accommodate a wafer device-under-test (DUT) comprising a plurality of superconducting die. The system also includes a second chamber that is held at a non-cryogenic temperature and which comprises a wafer chuck actuator system configured to provide at least one of translational and rotational motion of the wafer chuck via mechanical linkage interconnecting the wafer chuck and the wafer chuck actuator system. The system further includes a radiation barrier arranged between the first chamber and the second chamber and through which the mechanical linkage extends, the radiation barrier being configured to provide a thermal gradient between the cryogenic temperature of the first chamber and the non-cryogenic temperature of the second chamber.
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公开(公告)号：US20190320557A1
公开(公告)日：2019-10-17
申请号：US15951913
申请日：2018-04-12
申请人： MARTIN BROKNER CHRISTIANSEN , STANLEY KATSUYOSHI WAKAMIYA , ELIE K. TRACK , STEVEN WARD VAN SCIVER , KELSEY MCCUSKER
发明人： MARTIN BROKNER CHRISTIANSEN , STANLEY KATSUYOSHI WAKAMIYA , ELIE K. TRACK , STEVEN WARD VAN SCIVER , KELSEY MCCUSKER
摘要： An apparatus for providing forced flow cooling in a circuit card environment is provided includes at least one circuit card including first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, which are different from one another. A housing defines a housing internal volume which completely three-dimensionally surrounds the circuit card. A first temperature-control fluid is directed laterally across at least a portion of the first circuit card subassembly within the housing internal volume in a first flow path to induce the first operating temperature concurrently with a second temperature-control fluid being directed laterally across at least a portion of the second circuit card subassembly within the housing internal volume in a second flow path to induce the second operating temperature.
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公开(公告)号：US20190279916A1
公开(公告)日：2019-09-12
申请号：US15916019
申请日：2018-03-08
申请人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , HARLAN CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
发明人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , HARLAN CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
摘要： An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.
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公开(公告)号：US20170142836A1
公开(公告)日：2017-05-18
申请号：US14943299
申请日：2015-11-17
申请人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
发明人： Martin Brokner Christiansen , Leonard George Chorosinski , H. Craig Heffner , Stanley Katsuyoshi Wakamiya , Keith R. Kirkwood
CPC分类号： H05K1/181 , H05K1/0203 , H05K1/0271 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K3/303 , H05K3/46 , H05K2201/0338 , H05K2201/068 , H05K2201/09063 , H05K2201/09663 , H05K2201/09672 , H05K2201/09763
摘要： A circuit card assembly includes a substrate having longitudinally spaced first and second substrate end edges and transversely spaced top and bottom substrate surfaces. The top and/or bottom substrate surface has first, second, and third substrate regions. The first substrate region is directly laterally adjacent the first substrate side edge. The third substrate region is directly laterally adjacent the second substrate side edge. The second substrate region is located between the first and third substrate regions. At least one circuit trace is located on the selected substrate surface. The portion of the circuit trace in the first substrate region is made of only a first material. The portion of the circuit trace in the third substrate region is made of only a second material. The portion of the circuit trace in the second substrate region is made of both the first and second materials.
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公开(公告)号：US20170142820A1
公开(公告)日：2017-05-18
申请号：US14943337
申请日：2015-11-17
申请人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
发明人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
CPC分类号： H05K1/0204 , H01L23/445 , H05K1/00 , H05K5/0213 , H05K13/00
摘要： An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.
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