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33 条记录 (耗时 0.019 秒)

    COVER FILM WITH HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD
    13.
    发明申请
    COVER FILM WITH HIGH DIMENSIONAL STABILITY AND MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD 审中-公开
    柔性印刷电路板的高尺寸稳定性和制造方法

    公开(公告)号：US20160205776A1

    公开(公告)日：2016-07-14

    申请号：US14620197

    申请日：2015-02-12

    申请人： Taiflex Scientific Co., Ltd.

    发明人： Hsiu-Chu Wu ,  Ching-Wen Yu ,  Wen-Chien Chen ,  Wu-Ying Su ,  Wei-Yuan Huang ,  Meng-Cheng Tsai ,  Chi-Sheng Hung

    IPC分类号： H05K1/03 ,  H05K3/46

    CPC分类号： H05K1/0393 ,  H05K3/007 ,  H05K3/025 ,  H05K2201/0154

    摘要： A cover film with high dimensional stability includes an insulation film, a first adhesive layer, and a carrier. A first side of the first adhesive layer is connected to a first surface of the insulation film, and a second side of the first adhesive layer is configured to adhere to at least one metal conductor of a flexible printed circuit board. The carrier includes a supporting film and a second adhesive layer. A first side of the second adhesive layer is connected to the supporting film, and a second side of the second adhesive layer is adhered to a second surface of the insulation film, wherein bonding strength of the second adhesive film is smaller than bonding strength of the first adhesive film.

    摘要翻译： 具有高尺寸稳定性的覆盖膜包括绝缘膜，第一粘合剂层和载体。 第一粘合剂层的第一侧连接到绝缘膜的第一表面，并且第一粘合剂层的第二侧被配置为粘附到柔性印刷电路板的至少一个金属导体。 载体包括支撑膜和第二粘合剂层。 第二粘合剂层的第一面连接到支撑膜，第二粘合剂层的第二侧粘附到绝缘膜的第二表面，其中第二粘合膜的接合强度小于 第一胶粘剂。

    PHOTOSENSITIVE POLYIMIDE COMPOSITION, BASE AGENT THEREOF, METHOD OF MAKING THE BASE AGENT, AND SOLDER-RESISTANT POLYIMIDE THIN FILM MADE FROM THE COMPOSITION
    14.
    发明申请
    PHOTOSENSITIVE POLYIMIDE COMPOSITION, BASE AGENT THEREOF, METHOD OF MAKING THE BASE AGENT, AND SOLDER-RESISTANT POLYIMIDE THIN FILM MADE FROM THE COMPOSITION 有权
    感光性聚酰亚胺组合物，其基础代理，制备基剂的方法和由组合物制成的耐电极聚酰亚胺薄膜

    公开(公告)号：US20160018733A1

    公开(公告)日：2016-01-21

    申请号：US14332904

    申请日：2014-07-16

    申请人： TAIFLEX SCIENTIFIC CO., LTD.

    发明人： Shih-Chang Lin ,  Hsiu-Ming Chang ,  Tzu-Ching Hung

    IPC分类号： G03F7/038 ,  C08F283/04

    CPC分类号： G03F7/0387 ,  C08F283/04 ,  C08F299/024 ,  C08G73/1014 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/1053 ,  C08G73/1082 ,  C08G73/14 ,  C08L77/06 ,  C08L79/08 ,  C09D179/08 ,  C09J179/08 ,  C09J2479/08 ,  G03F7/029 ,  G03F7/038 ,  G03F7/0388 ,  C08L63/00 ,  C08K5/353

    摘要： A photosensitive polyimide composition; the composition comprises a base agent and a curing agent comprising a photoinitiator. By applying an aliphatic diamine monomer, which has a long carbon chain, and a grafting monomer, which has a main carbon chain having a double bond and an epoxy group at two ends respectively, to a method of making the base agent, a mixture of the base agent and the curing agent can be screen printed to form a photosensitive polyimide film on a copper foil. Also, the photosensitive polyimide film can be exposed under low exposure energy, and can be developed to a solder-resistant polyimide thin film by a weak alkaline developer after exposed. In addition, the solder-resistant polyimide thin film has low dielectric constant, low dielectric loss, good flame resistance, good solder resistance, and good pencil hardness. Accordingly, the photosensitive polyimide composition is applicable to high density flexible printed circuit boards.

    摘要翻译： 光敏聚酰亚胺组合物; 组合物包含基剂和包含光引发剂的固化剂。 通过将具有长碳链的脂族二胺单体和分别具有两端的主链碳原子和双环氧基的接枝单体分别与制备该基剂的方法相同， 可以将基础剂和固化剂丝网印刷以在铜箔上形成感光性聚酰亚胺膜。 此外，感光性聚酰亚胺膜可以以低曝光能量曝光，并且可以在暴露后通过弱碱性显影剂显影成耐焊料聚酰亚胺薄膜。 此外，耐焊料聚酰亚胺薄膜具有低介电常数，低介电损耗，良好的阻燃性，良好的阻焊性和良好的铅笔硬度。 因此，光敏聚酰亚胺组合物可应用于高密度柔性印刷电路板。

    POLYIMIDE METAL LAMINATED PLATE AND METHOD OF MAKING THE SAME
    15.
    发明申请
    POLYIMIDE METAL LAMINATED PLATE AND METHOD OF MAKING THE SAME 有权
    聚酰亚胺金属层压板及其制备方法

    公开(公告)号：US20150367606A1

    公开(公告)日：2015-12-24

    申请号：US14312827

    申请日：2014-06-24

    申请人： TAIFLEX SCIENTIFIC CO., LTD.

    发明人： Ching-Hung Huang ,  Kuang-Ting Hsueh ,  Tzu-Ching Hung ,  Hui-Chen Huang

    IPC分类号： B32B15/088 ,  B05D1/36 ,  B32B27/34 ,  B32B37/24 ,  B32B7/02 ,  B32B27/08 ,  B05D3/02 ,  B05D7/14

    CPC分类号： B32B37/24 ,  B05D3/0254 ,  B05D7/16 ,  B05D7/582 ,  B32B2037/0092 ,  B32B2037/243 ,  B32B2307/7246 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  Y10T156/10 ,  Y10T428/24942 ,  Y10T428/24975

    摘要： A polyimide metal laminated plate has a first metallic film, a first thermoplastic polyimide film laminated on a surface of the first metallic film, a first thermosetting polyimide film laminated on a surface of the first thermoplastic polyimide film distal from the first metallic film, and a second thermoplastic polyimide film laminated on a surface of the first thermosetting polyimide film distal from the first thermoplastic polyimide film. The polyimide metal laminated plate has no adhesive layer, so the polyimide metal laminated plate not only has good heat resistance, flame resistance, anti-chemical properties, and dimensional stability, but also meets the thinning tendency of FPCB. In addition, by the first thermosetting polyimide film and the second thermoplastic polyimide film having a water vapor transmission rate equal to or more than 170 g-μm/m2-day, the delamination and whitening of the polyimide metal laminated plate is prevented.

    摘要翻译： 聚酰亚胺金属层压板具有第一金属膜，层压在第一金属膜的表面上的第一热塑性聚酰亚胺膜，层压在远离第一金属膜的第一热塑性聚酰亚胺膜的表面上的第一热固性聚酰亚胺膜， 第二热塑性聚酰亚胺膜层叠在远离第一热塑性聚酰亚胺膜的第一热固性聚酰亚胺膜的表面上。 聚酰亚胺金属层压板没有粘合层，因此聚酰亚胺金属层压板不仅具有良好的耐热性，阻燃性，抗化学性能和尺寸稳定性，而且还满足FPCB的变薄趋势。 此外，通过第一热固性聚酰亚胺膜和水蒸汽透过率等于或大于170g-μm/ m 2·天的第二热塑性聚酰亚胺膜，防止了聚酰亚胺金属叠层板的脱层和增白。

    THERMALLY CURABLE SOLDER-RESISTANT INK AND METHOD OF MAKING THE SAME
    16.
    发明申请
    THERMALLY CURABLE SOLDER-RESISTANT INK AND METHOD OF MAKING THE SAME 有权
    耐热耐焊锡塞及其制造方法

    公开(公告)号：US20150322274A1

    公开(公告)日：2015-11-12

    申请号：US14270413

    申请日：2014-05-06

    申请人： TAIFLEX SCIENTIFIC CO., LTD.

    发明人： Hsiu-Ming Chang ,  Shih-Chang Lin ,  Tzu-Ching Hung

    IPC分类号： C09D11/102

    CPC分类号： C09D11/102 ,  C08L63/00 ,  C08L79/08 ,  C08L2205/05

    摘要： A method of making a thermally curable solder-resistant ink, which comprises the following steps: polymerizing an aliphatic diamine monomer having a long carbon chain, an aromatic dianhydride monomer, an aromatic diamine monomer having a carboxylic group, and an anhydride monomer having a carboxylic group in an aprotic solvent to obtain a polyamine acid; cyclizing the polyamine acid to obtain a modified polyimide; and mixing the modified polyimide and a curing agent to obtain the thermally curable solder-resistant ink. By the steps mentioned above, the thermally curable solder-resistant ink made from the method has a dielectric constant less than 3.00 and a dielectric loss less than 0.01 and thereby is applicable to high frequency electronic equipments. Also, the thermally curable solder-resistant ink has good electrical properties, folding endurance, solder resistance, warpage resistance, flame resistance, acid endurance, alkali endurance, good solvent resistance and low water absorption.

    摘要翻译： 一种制备耐热可焊性耐油墨的方法，包括以下步骤：聚合具有长碳链的脂族二胺单体，芳族二酐单体，具有羧基的芳族二胺单体和具有羧酸的酸酐单体 将其置于非质子溶剂中以获得多胺酸; 环化多胺酸得到改性聚酰亚胺; 并将改性聚酰亚胺和固化剂混合，得到可热固化的耐焊料油墨。 通过上述步骤，由该方法制成的可热固化的耐焊锡墨水具有小于3.00的介电常数和小于0.01的介电损耗，因此可应用于高频电子设备。 另外，可热固化的耐焊锡墨水具有良好的电气性能，耐折叠性，耐焊接性，耐翘曲性，阻燃性，耐酸性，耐碱性，耐溶剂性和低吸水性。