Semiconductor device
    11.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号:US08054680B2

    公开(公告)日:2011-11-08

    申请号:US10852150

    申请日:2004-05-25

    IPC分类号: G11C11/34 G11C7/00 H01L29/792

    CPC分类号: G11C16/107 G11C16/3468

    摘要: Memory cells in which an erase and write operation is performed by injecting electrons from a substrate and extracting the electrons into a gate electrode constitute a semiconductor nonvolatile memory device. That is a gate extraction semiconductor nonvolatile memory device. In that device, if an erase bias is applied in a first process of an erase and write operation, memory cells in an overerase condition occur and the charge retention characteristics of such memory cells are degraded. The present invention provides a semiconductor nonvolatile memory device using means for writing all the memory cells in an erase unit before applying the erase bias, and then applying the erase bias.

    摘要翻译: 通过从基板注入电子并将电子提取到栅极电极进行擦除和写入操作的存储单元构成半导体非易失性存储器件。 这是一个栅极提取半导体非易失性存储器件。 在该器件中,如果在擦除和写入操作的第一过程中施加擦除偏置,则发生过度过热状态的存储器单元,并且这种存储器单元的电荷保留特性降低。 本发明提供一种半导体非易失性存储器件,其使用在施加擦除偏置之前将所有存储单元写入擦除单元的装置,然后施加擦除偏置。

    Semiconductor device and manufacturing method of the same
    12.
    发明授权
    Semiconductor device and manufacturing method of the same 有权
    半导体器件及其制造方法相同

    公开(公告)号:US07935597B2

    公开(公告)日:2011-05-03

    申请号:US12912609

    申请日:2010-10-26

    IPC分类号: H01L21/336

    摘要: Performance and reliability of a semiconductor device including a non-volatile memory are improved. A memory cell of the non-volatile memory includes, over an upper portion of a semiconductor substrate, a select gate electrode formed via a first dielectric film and a memory gate electrode formed via a second dielectric film formed of an ONO multilayered film having a charge storing function. The first dielectric film functions as a gate dielectric film, and includes a third dielectric film made of silicon oxide or silicon oxynitride and a metal-element-containing layer made of a metal oxide or a metal silicate formed between the select gate electrode and the third dielectric film. A semiconductor region positioned under the memory gate electrode and the second dielectric film has a charge density of impurities lower than that of a semiconductor region positioned under the select gate electrode and the first dielectric film.

    摘要翻译: 提高了包括非易失性存储器的半导体器件的性能和可靠性。 非易失性存储器的存储单元包括在半导体衬底的上部上的经由第一电介质膜形成的选择栅电极和通过由具有电荷的ONO多层膜形成的第二电介质膜形成的存储栅电极 存储功能。 第一电介质膜用作栅极电介质膜,并且包括由氧化硅或氮氧化硅制成的第三电介质膜和由选择栅电极和第三电极之间形成的金属氧化物或金属硅酸盐构成的含金属元素层 电介质膜。 位于存储栅电极下方的半导体区域和第二电介质膜的电荷密度低于位于选择栅电极和第一电介质膜下方的半导体区域的电荷密度。

    NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE
    13.
    发明申请
    NON-VOLATILE SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING EMBEDDED NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE WITH SIDEWALL GATE 有权
    非挥发性半导体器件及其制造嵌入式非易失性半导体存储器件的方法

    公开(公告)号:US20100105199A1

    公开(公告)日:2010-04-29

    申请号:US12652517

    申请日:2010-01-05

    IPC分类号: H01L21/28

    摘要: A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation.

    摘要翻译: 提供一种制造非挥发性半导体存储器件的方法,其克服了由于最佳栅极高度的不同而引入的注入离子的问题,同时形成利用侧壁结构的自对准分裂栅型存储单元和 缩放MOS晶体管。 形成在存储区域中形成侧壁的选择栅电极比逻辑区域中的栅电极高,使得自对准分离栅极存储单元的侧壁栅电极的高度大于 在逻辑区域的栅电极。 栅极电极的高度降低在栅电极形成之前的逻辑区域中进行。

    Nonvolatile memory device and semiconductor device
    15.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号:US07529126B2

    公开(公告)日:2009-05-05

    申请号:US11472993

    申请日:2006-06-23

    IPC分类号: G11C11/34 G11C16/04

    CPC分类号: G11C16/10 G11C16/0433

    摘要: Disclosed here is a method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1iA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1iA to flow a current in the memory cell.

    摘要翻译: 这里公开了一种通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入并降低功耗的方法。 当在存储单元中写入数据时,约8V的电压被施加到存储器栅极线,大约5V的电压被施加到源极线,大约1.5V的电压分别施加到所选择的栅极线。 此时,在写入电路中,写入脉冲为0,写入锁存器输出高电平信号,NAND电路输出低电平信号。 并且,在恒定电流源晶体管中流动约1iA的恒定电流,并且通过约1iA的恒定电流放电位线以使存储单元中的电流流动。

    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    16.
    发明申请
    SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    半导体存储器件及其制造方法

    公开(公告)号:US20090050956A1

    公开(公告)日:2009-02-26

    申请号:US12191958

    申请日:2008-08-14

    IPC分类号: H01L29/792 H01L21/336

    摘要: In a memory cell including an nMIS for memory formed on the sides of an nMIS for select and an nMIS for select via dielectric films and a charge storage layer, the thickness of a gate dielectric under the gate longitudinal direction end of a select gate electrode is formed thicker than that of the gate dielectric under the gate longitudinal direction center and the thickness of the lower layer dielectric film that is positioned between the select gate electrode and the charge storage layer and is nearest to a semiconductor substrate is formed 1.5 times or below of the thickness of the lower layer dielectric film positioned between the semiconductor substrate and the charge storage layer.

    摘要翻译: 在包括形成在用于选择的nMIS的侧面上的存储器的nMIS和通过电介质膜和电荷存储层进行选择的nMIS的存储单元中,选择栅电极的栅极纵向端的栅极电介质的厚度为 在栅极纵向中心处形成得比栅极电介质厚,并且位于选择栅电极和电荷存储层之间并且最靠近半导体衬底的下层电介质膜的厚度形成为1.5倍以下 位于半导体衬底和电荷存储层之间的下层电介质膜的厚度。

    SEMICONDUCTOR NONVOLATILE MEMORY DEVICE
    17.
    发明申请
    SEMICONDUCTOR NONVOLATILE MEMORY DEVICE 有权
    半导体非易失性存储器件

    公开(公告)号:US20090014775A1

    公开(公告)日:2009-01-15

    申请号:US12233670

    申请日:2008-09-19

    IPC分类号: H01L29/00

    摘要: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

    摘要翻译: 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时,使用不随时间变化的交叉点来验证热孔注入。 因此,可以验证擦除状态,而不知道任何时变变化。 此外,通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

    NONVOLATILE SEMICONDUCTOR MEMORY DEVICES WITH CHARGE INJECTION CORNER
    18.
    发明申请
    NONVOLATILE SEMICONDUCTOR MEMORY DEVICES WITH CHARGE INJECTION CORNER 有权
    带电荷注射角的非线性半导体存储器件

    公开(公告)号:US20080290401A1

    公开(公告)日:2008-11-27

    申请号:US12124143

    申请日:2008-05-20

    IPC分类号: H01L29/792

    摘要: An erase method where a corner portion on which an electric field concentrates locally is provided on the memory gate electrode, and charges in the memory gate electrode are injected into a charge trap film in a gate dielectric with Fowler-Nordheim tunneling operation is used. Since current consumption at the time of erase can be reduced by the Fowler-Nordheim tunneling, a power supply circuit area of a memory module can be reduced. Since write disturb resistance can be improved, a memory array area can be reduced by adopting a simpler memory array configuration. Owing to both the effects, an area of the memory module can be largely reduced, so that manufacturing cost can be reduced. Further, since charge injection centers of write and erase coincide with each other, so that (program and erase) endurance is improved.

    摘要翻译: 在存储栅电极上设置有局部集中电场的角部的擦除方法,并且使用Fowler-Nordheim隧道操作将存储栅电极中的电荷注入栅极电介质中的电荷陷阱膜。 由于通过Fowler-Nordheim隧道可以减少擦除时的电流消耗,因此可以减少存储器模块的电源电路区域。 由于可以提高写入干扰电阻,所以可以通过采用更简单的存储器阵列配置来减少存储器阵列区域。 由于这两个效果,可以大大减少存储器模块的面积,从而可以降低制造成本。 此外,由于写入和擦除的电荷注入中心彼此一致,所以(编程和擦除)耐久性得到改善。

    Semiconductor nonvolatile memory device
    19.
    发明申请
    Semiconductor nonvolatile memory device 失效
    半导体非易失性存储器件

    公开(公告)号:US20070183206A1

    公开(公告)日:2007-08-09

    申请号:US11727592

    申请日:2007-03-27

    IPC分类号: G11C11/34 G11C16/04

    摘要: An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

    摘要翻译: 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时,使用不随时间变化的交叉点来验证热孔注入。 因此,可以验证擦除状态,而不知道任何时变变化。 此外,通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

    Nonvolatile memory device and semiconductor device
    20.
    发明授权
    Nonvolatile memory device and semiconductor device 有权
    非易失性存储器件和半导体器件

    公开(公告)号:US07085157B2

    公开(公告)日:2006-08-01

    申请号:US10805365

    申请日:2004-03-22

    IPC分类号: G11C11/34 G11C16/04

    CPC分类号: G11C16/10 G11C16/0433

    摘要: A method for speeding up data writing and reducing power consumption by reducing the variation of the threshold voltage of each of non-volatile memory cells at data writing. When writing data in a memory cell, a voltage of about 8V is applied to the memory gate line, a voltage of about 5V is applied to the source line, a voltage of about 1.5V is applied to the selected gate line respectively. At that time, in the writing circuit, the writing pulse is 0, the writing latch output a High signal, and a NAND-circuit outputs a Low signal. And, a constant current of about 1 ìA flows in a constant current source transistor and the bit line is discharged by a constant current of about 1 ìA to flow a current in the memory cell.

    摘要翻译: 一种用于通过在数据写入时减小每个非易失性存储单元的阈值电压的变化来加速数据写入和降低功耗的方法。 当在存储单元中写入数据时,约8V的电压被施加到存储器栅极线,大约5V的电压被施加到源极线,大约1.5V的电压分别施加到所选择的栅极线。 此时,在写入电路中,写入脉冲为0,写入锁存器输出高电平信号,NAND电路输出低电平信号。 并且,在恒定电流源晶体管中流动约1AA的恒定电流,并且通过约1μA的恒定电流放电位线以使存储器单元中的电流流动。