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    Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet
    12.
    发明申请
    Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet 有权
    部分完成布线电路板组装片及使用该片的布线电路板的生产方法

    公开(公告)号：US20060027393A1

    公开(公告)日：2006-02-09

    申请号：US11195965

    申请日：2005-08-03

    申请人： Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

    发明人： Hidenori Aonuma ,  Tetsuya Ohsawa ,  Yasuhito Ohwaki

    IPC分类号： H05K1/00 ,  C25D5/02

    CPC分类号： H05K3/242 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/28 ,  H05K2201/0969

    摘要： The present invention provides a partially completed wiring circuit board assembly sheet capable of preventing deposition of a plating metal on the surface of a metal sheet, even when pinholes are produced in an insulating layer for insulating a lead wire for electroplating from a metal sheet. The assembly sheet 100 of the present invention has a metal sheet 1, multiple wiring circuit board forming area 1A in compartments on the metal sheet and area 1B for forming a lead wire for electroplating, which is in compartment on the metal sheet 1. Each area 1A has a partially completed wiring circuit board 10. The partially completed wiring circuit board 10 is equipped with a base insulating layer 2, a wiring pattern 3 and a cover insulating layer 4. In the area 1B, a first insulating layer 12, a lead wire 13 for electroplating and a second insulating layer 14 are laminated in this order. Of the metal sheet 1, an opening 16 is formed in the part under the lead wire 13.

    摘要翻译： 本发明提供了一种部分完成的布线电路板组装片，即使在用于使金属片的电镀用引线绝缘的绝缘层中产生针孔时，也能够防止电镀金属在金属片的表面上的沉积。 本发明的组装片100具有金属片1，金属片上的隔室中的多个布线电路板形成区域1A和金属片1上的隔室中形成用于电镀的导线的区域1B。 每个区域1A具有部分完成的布线电路板10。 部分完成的布线电路板10配备有基底绝缘层2，布线图案3和覆盖绝缘层4。 在区域1B中，依次层叠第一绝缘层12，电镀用引线13和第二绝缘层14。 在金属片1中，在引线13下面的部分中形成开口16。

    Production method of suspension board with circuit
    13.
    发明申请
    Production method of suspension board with circuit 审中-公开
    带电路的悬挂板的生产方法

    公开(公告)号：US20050167281A1

    公开(公告)日：2005-08-04

    申请号：US11044077

    申请日：2005-01-28

    申请人： Tetsuya Ohsawa ,  Yasuhito Ohwaki

    发明人： Tetsuya Ohsawa ,  Yasuhito Ohwaki

    IPC分类号： C23C18/42 ,  C23C14/32 ,  C23F1/28 ,  H04R31/00 ,  H05K1/03 ,  H05K1/05 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/14 ,  H05K3/18 ,  H05K3/28 ,  H05K3/38 ,  H05K3/44

    CPC分类号： H05K3/44 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K3/06 ,  H05K3/28 ,  H05K3/388 ,  H05K2201/0969 ,  H05K2203/0323

    摘要： A production method of a suspension board with circuit that can reduce variations in diameter of the location holes or like holes formed in the suspension board and can produce a trim contour of the suspension board. In the process of forming a seed film 12, zirconium is previously deposited on a surface of the suspension board 2 by sputtering a conductive material forming the seed film 12 using an electrode formed of zirconium. Or, in the process of forming a metal coating 14, palladium is previously deposited on the surface of the suspension board 2 by electroless-plating the thin metal film forming the metal coating 14 using a catalyst including palladium. Thereafter, the suspension board 2 formed of stainless is trimmed by the chemical etching. This can allow an end face 17 of the suspension board 2 to be chemically etched evenly.

    摘要翻译： 一种具有电路的悬挂板的制造方法，其可以减小形成在悬挂板中的定位孔或类似孔​​的直径的变化，并且可以产生悬挂板的修整轮廓。 在形成种子膜12的过程中，通过使用由锆形成的电极溅射形成种子膜12的导电材料，预先将锆预先沉积在悬挂板2的表面上。 或者，在形成金属涂层14的过程中，通过使用包含钯的催化剂对形成金属涂层14的金属薄膜进行无电镀，预先将钯沉积在悬挂板2的表面上。 此后，通过化学蚀刻来修整由不锈钢制成的悬挂板2。 这可以使悬挂板2的端面17被均匀化学蚀刻。

    Wired circuit board having first and second conductive patterns with respective connecting portions formed on first and second insulating layers
    14.
    发明授权
    Wired circuit board having first and second conductive patterns with respective connecting portions formed on first and second insulating layers 有权
    有线电路板，具有形成在第一和第二绝缘层上的具有相应连接部分的第一和第二导电图案

    公开(公告)号：US08809691B2

    公开(公告)日：2014-08-19

    申请号：US13554799

    申请日：2012-07-20

    申请人： Tetsuya Ohsawa

    发明人： Tetsuya Ohsawa

    IPC分类号： H05K1/03 ,  G11B5/48 ,  H05K1/05

    CPC分类号： G11B5/4853 ,  G11B5/486 ,  H05K1/056

    摘要： A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.

    摘要翻译： 布线电路板包括绝缘层和形成在绝缘层上的导电层。 绝缘层包括第一绝缘层和形成在第一绝缘层上的第二绝缘层。 导电层包括第一导电图案和第二导电图案。 第一导电图案包括形成在第一绝缘层上且在第二绝缘层下方的第一连接部分，以及连续配置到第一连接部分的至少一对第一端子，以便电连接到外部电子元件并间隔开 彼此之间允许电子元件在其间延伸。 第二导电图案包括形成在第二绝缘层上的第二连接部分和连接到第二连接部分的第二端子，以电连接到设置在外部滑块上的磁头。

    Wired circuit board
    15.
    发明授权
    Wired circuit board 有权
    有线电路板

    公开(公告)号：US08664535B2

    公开(公告)日：2014-03-04

    申请号：US12285837

    申请日：2008-10-15

    申请人： Katsutoshi Kamei ,  Tetsuya Ohsawa ,  Voon Yee Ho

    发明人： Katsutoshi Kamei ,  Tetsuya Ohsawa ,  Voon Yee Ho

    IPC分类号： H05K1/00 ,  H05K1/03

    CPC分类号： H05K1/0248 ,  H05K1/0245 ,  H05K1/056 ,  H05K3/4644 ,  H05K2201/09672 ,  H05K2201/09845

    摘要： A wired circuit board includes a first insulating layer, a first wire formed on the first insulating layer, a second insulating layer formed on the first insulating layer so as to cover the first wire, and a second wire placed opposite to the first wire in a thickness direction and formed in a smaller width than that of the first wire.

    摘要翻译： 布线电路板包括第一绝缘层，形成在第一绝缘层上的第一布线，形成在第一绝缘层上以覆盖第一布线的第二绝缘层，以及与第一布线相对放置的第二布线 厚度方向形成为比第一线宽小的宽度。

    Suspension board with circuit
    17.
    发明授权
    Suspension board with circuit 有权
    悬挂板带电路

    公开(公告)号：US08508888B2

    公开(公告)日：2013-08-13

    申请号：US13553107

    申请日：2012-07-19

    申请人： Tetsuya Ohsawa

    发明人： Tetsuya Ohsawa

    IPC分类号： G11B5/60

    CPC分类号： H05K1/056 ,  G11B5/4833 ,  G11B5/4846 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/111 ,  H05K3/4092 ,  Y02P70/611

    摘要： A suspension board with circuit includes an external slider on which a magnetic head is mounted and an external electronic element provided in its vicinity. The suspension board with circuit includes a metal supporting board, a first insulating layer laminated on a top surface thereof, a first conductive pattern including a first terminal and laminated on the top surface side of the first insulating layer, a second insulating layer laminated on a back surface of the metal supporting board, and a second conductive pattern including a second terminal and laminated on the back surface side of the second insulating layer. The suspension board with circuit is formed with a communication space extending therethrough in a top-back direction and respective end edges of the first insulating layer and the second insulating layer protrude into the communication space to positions inner than that of an end edge of the metal supporting board.

    摘要翻译： 具有电路的悬挂板包括安装磁头的外部滑块和设置在其附近的外部电子元件。 具有电路的悬挂板包括金属支撑板，层叠在其顶表面上的第一绝缘层，包括第一端子并层叠在第一绝缘层的顶表面侧上的第一导电图案，层压在第一绝缘层上的第二绝缘层 金属支撑板的后表面和包括第二端子并层压在第二绝缘层的背表面侧上的第二导电图案。 具有电路的悬挂板形成有在顶后方向上延伸穿过的连通空间，并且第一绝缘层和第二绝缘层的相应端边缘突出到连通空间中，使其位于内部而不是金属端部边缘的位置 支撑板

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    19.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号：US20110048791A1

    公开(公告)日：2011-03-03

    申请号：US12862338

    申请日：2010-08-24

    申请人： Tetsuya OHSAWA ,  Mitsuru HONJO ,  Daisuke YAMAUCHI

    发明人： Tetsuya OHSAWA ,  Mitsuru HONJO ,  Daisuke YAMAUCHI

    IPC分类号： H05K1/11 ,  C25D5/02

    CPC分类号： C25D5/02 ,  C25D5/06 ,  H05K1/0237 ,  H05K1/056 ,  H05K3/242 ,  H05K2201/09727

    摘要： A plurality of wiring traces and a plurality of lead wires for plating are formed on a base insulating layer. Each wiring trace and each lead wire for plating are integrally formed with each other. An electrode pad is provided at an end of each wiring trace, and the lead wire for plating is provided to extend from each electrode pad toward the opposite side to the wiring trace. A width of each lead wire for plating is set larger than a width of each wiring trace.

    摘要翻译： 在基底绝缘层上形成多个布线迹线和多个用于电镀的引线。 每个布线迹线和每个用于电镀的引线彼此一体形成。 电极焊盘设置在每个布线迹线的端部，并且提供用于电镀的引线以从每个电极焊盘朝着与布线迹线相反的一侧延伸。 用于电镀的每个引线的宽度被设定为大于每个布线迹线的宽度。