公开(公告)号：US20100110649A1

公开(公告)日：2010-05-06

申请号：US12588728

申请日：2009-10-26

申请人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

发明人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

IPC分类号： H05K7/00

CPC分类号： G11B5/486 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/181 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49167

摘要： A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.

摘要翻译： 具有电路的悬挂板包括导电图案。 导电图案包括设置在具有电路的悬挂板的前表面上并与磁头电连接的第一端子; 以及设置在具有电路的悬挂板的背面上并与电子设备电连接的第二端子。

公开(公告)号：US08593823B2

公开(公告)日：2013-11-26

申请号：US12588728

申请日：2009-10-26

申请人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

发明人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida

IPC分类号： H05K7/00

CPC分类号： G11B5/486 ,  G11B5/4853 ,  H05K1/056 ,  H05K1/181 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49167

摘要： A suspension board with circuit includes a conductive pattern. The conductive pattern includes a first terminal provided on the front face of the suspension board with circuit and electrically connected with a magnetic head; and a second terminal provided on the back face of the suspension board with circuit and electrically connected with an electronic device.

摘要翻译： 具有电路的悬挂板包括导电图案。 导电图案包括设置在具有电路的悬挂板的前表面上并与磁头电连接的第一端子; 以及设置在具有电路的悬挂板的背面上并与电子设备电连接的第二端子。

公开(公告)号：US20100110590A1

公开(公告)日：2010-05-06

申请号：US12588797

申请日：2009-10-28

申请人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

发明人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

IPC分类号： G11B5/60

CPC分类号： G11B13/04 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10537 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  H05K2203/0361

摘要： A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

摘要翻译： 具有电路的悬挂板包括导电图案，包括布置在具有电路的悬挂板的表面侧上的滑块，并安装有磁头，磁头与导电图案电连接; 以及发光装置，其配置在具有电路的电路的背面侧并与导电图形电连接，其中导电图案包括设置在具有电路的悬挂板的表面上的第一端子，并与磁性电连接 头; 以及设置在所述悬挂板的后表面上并具有电路并与所述发光装置电连接的第二端子。

公开(公告)号：US20090025968A1

公开(公告)日：2009-01-29

申请号：US12219479

申请日：2008-07-23

申请人： Yasunari Ooyabu ,  Visit Thaveeprungsriporn ,  Hayato Abe ,  Kazuya Nakamura ,  Katsutoshi Kamei ,  Toshiki Naito

发明人： Yasunari Ooyabu ,  Visit Thaveeprungsriporn ,  Hayato Abe ,  Kazuya Nakamura ,  Katsutoshi Kamei ,  Toshiki Naito

IPC分类号： H05K1/09

CPC分类号： H05K3/244 ,  H05K3/28 ,  H05K2203/1105 ,  Y10T29/49117

摘要： A wired circuit board includes an insulating layer, a conductive pattern made of copper formed on the insulating layer and a covering layer made of an alloy of copper and tin to cover the conductive pattern. An existing ratio of tin in the covering layer increases in accordance with a distance from an inner surface adjacent to the conductive pattern toward an outer surface being not adjacent to the conductive pattern. An atomic ratio of copper to tin in the outer surface of the covering layer is more than 3.

摘要翻译： 布线电路板包括绝缘层，由绝缘层形成的由铜制成的导电图案和由铜和锡的合金制成的覆盖层以覆盖导电图案。 根据与导电图案相邻的内表面与不与导电图案相邻的外表面的距离，覆盖层中锡的存在比例增加。 覆盖层外表面铜与锡的原子比大于3。

公开(公告)号：US07565738B2

公开(公告)日：2009-07-28

申请号：US11138932

申请日：2005-05-25

申请人： Ryosuke Usui ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Nobuhisa Takakusaki ,  Hayato Abe

发明人： Ryosuke Usui ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Nobuhisa Takakusaki ,  Hayato Abe

IPC分类号： H01K3/10

CPC分类号： H01L21/486 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.

摘要翻译： 本发明提供一种适于通过绝缘层将多层叠布线层彼此连接的电路装置的制造方法。 在本发明的混合集成电路器件的制造方法中，通过在第一绝缘层上层叠第一导电膜，对第一导电膜进行构图来形成第一绞合层。 在第一布线层中，形成沿厚度方向突出的第一连接部。 此外，包括第一连接部的第一布线层被第二绝缘层覆盖。 第二绝缘层由第一树脂膜和第二树脂膜形成。 第二树脂膜比第一树脂膜含有更少的无机填料。 因此，具有可以容易地形成通孔的优点。

公开(公告)号：US20050263905A1

公开(公告)日：2005-12-01

申请号：US11138932

申请日：2005-05-25

申请人： Ryosuke Usul ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Nobuhisa Takakusaki ,  Hayato Abe ,  Takeshi Nakamura

发明人： Ryosuke Usul ,  Hideki Mizuhara ,  Yusuke Igarashi ,  Nobuhisa Takakusaki ,  Hayato Abe ,  Takeshi Nakamura

IPC分类号： H01L21/48 ,  H01L23/31 ,  H01L23/48 ,  H01L23/498 ,  H01L23/538 ,  H01L25/16 ,  H05K1/02 ,  H05K1/05 ,  H05K3/00 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46

CPC分类号： H01L21/486 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5383 ,  H01L24/73 ,  H01L24/97 ,  H01L25/16 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/056 ,  H05K3/0035 ,  H05K3/284 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4655 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/0554 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.

摘要翻译： 本发明提供一种适于通过绝缘层将多层叠布线层彼此连接的电路装置的制造方法。 在本发明的混合集成电路器件的制造方法中，通过在第一绝缘层上层叠第一导电膜，对第一导电膜进行构图来形成第一绞合层。 在第一布线层中，形成沿厚度方向突出的第一连接部。 此外，包括第一连接部的第一布线层被第二绝缘层覆盖。 第二绝缘层由第一树脂膜和第二树脂膜形成。 第二树脂膜比第一树脂膜含有更少的无机填料。 因此，具有可以容易地形成通孔的优点。

公开(公告)号：US20090288862A1

公开(公告)日：2009-11-26

申请号：US12453542

申请日：2009-05-14

申请人： Yasushi Tamura ,  Hayato Abe ,  Katsuhiko Kawashima

发明人： Yasushi Tamura ,  Hayato Abe ,  Katsuhiko Kawashima

IPC分类号： H05K1/09 ,  B05D5/12 ,  B32B38/00

CPC分类号： H01L23/498 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/244 ,  H05K3/28 ,  H05K3/384 ,  H05K2201/0394 ,  H05K2203/0315 ,  H05K2203/1105 ,  Y10T156/10 ,  H01L2924/00

摘要： A wired circuit board includes an insulating base layer, a conductive pattern formed on the insulating base layer, a tin-based thin layer formed on a surface of the conductive pattern, and containing at least tin oxide, and an insulating cover layer formed on the insulating base layer so as to cover the tin-based thin layer.

摘要翻译： 布线电路板包括绝缘基底层，形成在绝缘基底层上的导电图案，形成在导电图案的表面上并至少包含氧化锡的锡基薄层，以及形成在绝缘基底层上的绝缘覆盖层 绝缘基层以覆盖锡基薄层。

公开(公告)号：US08587904B2

公开(公告)日：2013-11-19

申请号：US12588797

申请日：2009-10-28

申请人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

发明人： Tetsuya Ohsawa ,  Hayato Abe ,  Yoshinari Yoshida ,  Toshiki Naito

IPC分类号： G11B5/48 ,  G11B13/08

CPC分类号： G11B13/04 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4853 ,  G11B2005/0021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/06 ,  H05K3/445 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/10537 ,  H05K2201/10545 ,  H05K2201/10727 ,  H05K2203/0323 ,  H05K2203/0361

摘要： A suspension board with circuit includes a conductive pattern, including a slider arranged on a surface side of the suspension board with circuit and mounted with a magnetic head, the magnetic head being electrically connected with the conductive pattern; and a light emitting device arranged on the back surface side of the suspension board with circuit and electrically connected with the conductive pattern, in which the conductive pattern includes a first terminal provided on a surface of the suspension board with circuit and electrically connected with the magnetic head; and a second terminal provided on the back surface of the suspension board with circuit and electrically connected with the light emitting device.

摘要翻译： 具有电路的悬挂板包括导电图案，包括布置在具有电路的悬挂板的表面侧上的滑块，并安装有磁头，磁头与导电图案电连接; 以及发光装置，其配置在具有电路的电路的背面侧并与导电图形电连接，其中导电图案包括设置在具有电路的悬挂板的表面上的第一端子，并与磁性电连接 头; 以及设置在所述悬挂板的后表面上并具有电路并与所述发光装置电连接的第二端子。