公开(公告)号：US5531851A

公开(公告)日：1996-07-02

申请号：US431137

申请日：1995-04-28

申请人： Ching-Bin Lin ,  Tung-Han Chuang

发明人： Ching-Bin Lin ,  Tung-Han Chuang

IPC分类号： B29B9/02 ,  B29B9/12 ,  B32B15/08 ,  B29B9/06 ,  B23B31/18 ,  B29B11/16

CPC分类号： B29B9/02 ,  B29B9/12 ,  B32B15/08 ,  Y10T156/1062 ,  Y10T156/1067

摘要： A process for making metallized plastic molding pellets comprising: first metallizing a laminated plastic sheet by sandwiching an electrically conductive metal foil in between two plastic films; secondly slicing the metallized laminated plastic sheet into a plurality of metallized plastic strips; thirdly wetting and binding the metallized plastic strips, which are radially arranged, with a thermoplastic resin matrix to form a metallized plastic bar by pultrusion processing; and finally cutting the pultruded metallized bar to obtain homogeneously metallized plastic pellets for making effective EMI shields.

摘要翻译： 一种用于制造金属化塑料模制粒料的方法，包括：首先通过将导电金属箔夹在两个塑料膜之间来对金属化层压塑料片进行金属化; 其次将金属化层压塑料片切割成多个金属化塑料条; 第三次将热塑性树脂基体径向布置的金属化塑料条进行润湿和粘合，通过拉挤成型加工形成金属化塑料棒; 并最终切割拉挤的金属化棒以获得均匀金属化的塑料颗粒，以制造有效的EMI屏蔽。

公开(公告)号：US08940403B2

公开(公告)日：2015-01-27

申请号：US13495800

申请日：2012-06-13

申请人： Jun-Der Lee ,  Hsing-Hua Tsai ,  Tung-Han Chuang

发明人： Jun-Der Lee ,  Hsing-Hua Tsai ,  Tung-Han Chuang

IPC分类号： B32B15/02 ,  B32B15/01 ,  C22F1/14 ,  C22C5/06 ,  H01L23/00

CPC分类号： B32B15/018 ,  C22C5/06 ,  C22F1/14 ,  H01L24/43 ,  H01L24/45 ,  H01L2224/43 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45664 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/12041 ,  Y10T428/12431 ,  Y10T428/12438 ,  Y10T428/12868 ,  Y10T428/12875 ,  Y10T428/12889 ,  Y10T428/12896 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/2075 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/0132 ,  H01L2924/00015 ,  H01L2924/013 ,  H01L2924/00 ,  H01L2224/45669 ,  H01L2224/45647 ,  H01L2924/01204 ,  H01L2224/48 ,  H01L2924/00013 ,  H01L2224/4321 ,  H01L2924/01049 ,  H01L2924/01006 ,  H01L2924/01045 ,  H01L2924/01004 ,  H01L2924/01005

摘要： An alloy wire made of a material selected from one of a group consisting of a silver-gold alloy, a silver-palladium alloy and a silver-gold-palladium alloy is provided. The alloy wire is with a polycrystalline structure of a face-centered cubic lattice and includes a plurality of grains. A central part of the alloy wire includes slender grains or equi-axial grains, and the other parts of the alloy wire consist of equi-axial grains. A quantity of the grains having annealing twins was 20 percent or more of the total quantity of the grains of the alloy wire.

摘要翻译： 提供由选自银 - 金合金，银 - 钯合金和银 - 钯 - 钯合金之一的材料制成的合金丝。 合金线具有面心立方晶格的多晶结构，并且包括多个晶粒。 合金线的中心部分包​​括细长晶粒或等轴晶粒，合金线的其他部分由等轴晶粒组成。 一定数量的具有退火双晶的晶粒是合金丝的晶粒总量的20％以上。

公开(公告)号：US08288280B2

公开(公告)日：2012-10-16

申请号：US11780024

申请日：2007-07-19

申请人： Yung-Tai Hung ,  Chin-Tsan Yeh ,  Chin-Ta Su ,  Ling-Wu Yang ,  Tung-Han Chuang

发明人： Yung-Tai Hung ,  Chin-Tsan Yeh ,  Chin-Ta Su ,  Ling-Wu Yang ,  Tung-Han Chuang

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/3212 ,  H01L21/32105

摘要： A conductor removal process is described, which is applied to a substrate that has thereon a plurality of patterns and a blanket conductor layer covering the patterns. An upper portion of the blanket conductor layer entirely over the patterns is oxidized to form a dielectric layer. A CMP step is performed to remove the dielectric layer and a portion of the remaining conductor layer in turn and thereby expose the patterns.

摘要翻译： 描述了导体去除工艺，其应用于其上具有多个图案的基板和覆盖图案的覆盖层导体层。 橡皮布导体层的整个图案上方的上部被氧化以形成电介质层。 执行CMP步骤以依次去除电介质层和剩余导体层的一部分，从而暴露图案。

公开(公告)号：US5449109A

公开(公告)日：1995-09-12

申请号：US151855

申请日：1993-11-15

申请人： Tung-Han Chuang ,  Jing-Shin Shyu

发明人： Tung-Han Chuang ,  Jing-Shin Shyu

IPC分类号： B21D26/055 ,  B21D39/00

CPC分类号： B21D26/055 ,  Y10S72/709 ,  Y10T29/49805

摘要： A high gas pressure material capable of producing 50-300 psi gas pressure at forming temperature is placed in an enclosed area surrounding and sealing the blanks to be superplastically formed, without the use of argon gas. The blanks are formed under tensile stress by the internal pressure produced by the high gas pressure material. The method can be performed concurrently with diffusion bonding to obtain a metallic structure from a plurality of workpieces, and also can be used to manufacture perfectly spherical hollow bodies by a dieless method.

摘要翻译： 能够在成形温度下产生50-300psi气体压力的高气体压力材料被放置在围绕并密封坯料的封闭区域中，而不需要使用氩气。 坯料通过高气体压力材料产生的内部压力在拉伸应力下形成。 该方法可以与扩散接合同时进行以从多个工件获得金属结构，并且还可以用于通过无用的方法制造完美的球形中空体。

公开(公告)号：US09997488B2

公开(公告)日：2018-06-12

申请号：US14157413

申请日：2014-01-16

申请人： Tung-Han Chuang ,  Jun-Der Lee ,  Hsing-Hua Tsai

发明人： Tung-Han Chuang ,  Jun-Der Lee ,  Hsing-Hua Tsai

IPC分类号： H01L23/00

CPC分类号： H01L24/43 ,  H01L24/45 ,  H01L2224/4321 ,  H01L2224/43848 ,  H01L2224/43986 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2224/45157 ,  H01L2224/45565 ,  H01L2224/45644 ,  H01L2224/45647 ,  H01L2224/45664 ,  H01L2224/45669 ,  H01L2924/00011 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/01079 ,  H01L2924/01046 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/013 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033

摘要： A copper-based alloy wire made of a material selected from the group consisting of a copper-gold alloy, a copper-palladium alloy and a copper-gold-palladium alloy is provided. The alloy wire has a polycrystalline structure of a face-centered cubic lattice and consists of a plurality of equi-axial grains. The quantity of grains having annealing twins is 10 percent or more of the total quantity of the grains of the copper-based alloy wire.

公开(公告)号：US06202276B1

公开(公告)日：2001-03-20

申请号：US09304027

申请日：1999-05-03

申请人： Tung-Han Chuang

发明人： Tung-Han Chuang

IPC分类号： B23P1700

CPC分类号： B32B15/08 ,  B21D26/055 ,  B29C45/1418 ,  B29C45/14221 ,  B29C45/14311 ,  B29C2045/14188 ,  B29C2045/14983 ,  B29K2705/00 ,  B29K2715/006 ,  B29K2995/0011 ,  B32B7/12 ,  B32B2037/1215 ,  B32B2331/04 ,  B32B2355/02 ,  H05K9/0084 ,  Y10T29/302 ,  Y10T29/49805 ,  Y10T29/49906

摘要： The present invention provides a process for manufacturing an electromagnetic interference shielding metallic foil cladded plastic outer shell product. A first side of a superplastic alloy foil is coated with an adhesive and then the foil is placed foil in a first half mold to allow the foil to be initially superplastically formed. A second half mold attached to a nozzle of an injection machine is covered onto the first half mold, and the two half molds are closed to further deform superplastic alloy foil. Softened plastic is introduced from the injection machine to a mold cavity between the foil and the second half mold, such that the superplastic alloy foil covered on the first half mold is completely formed and the softened plastic adheres on the adhesive-coated side of the superplastic alloy foil to form an electromagnetic interference shielding metallic foil cladded plastic outer shell product. Two types of products can be obtained, that is, the superplastic alloy foil can be either the outer wall or inner wall. Moreover, the final metallic plastic product can not only have as intricate a shape as an ordinary plastic product, but also a shielding effectiveness as high as an ordinary metallic shield.

摘要翻译： 本发明提供一种制造电磁干扰屏蔽金属箔包覆塑料外壳产品的方法。 用粘合剂涂覆超塑性合金箔的第一面，然后将箔置于第一半模中，以允许箔最初超塑性地形成。 附着在注射机的喷嘴上的第二半模被覆盖在第一半模上，两个半模封闭以进一步使超塑性合金箔变形。 将软化的塑料从注射机引入到箔和第二半模之间的模腔中，使得覆盖在第一半模上的超塑性合金箔完全形成，并且软化的塑料粘附在超塑性的粘合剂涂层侧 合金箔形成电磁干扰屏蔽金属箔包层塑料外壳产品。 可以获得两种类型的产品，即超塑性合金箔可以是外壁或内壁。 此外，最终的金属塑料制品不仅具有与普通塑料制品相同的复杂形状，而且还具有与普通金属屏蔽一样高的屏蔽效果。