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公开(公告)号：US20120133471A1
公开(公告)日：2012-05-31
申请号：US12955527
申请日：2010-11-29
Applicant: Jun-De Jin , Tzu-Jin Yeh
Inventor： Jun-De Jin , Tzu-Jin Yeh
IPC: H01F5/00
CPC classification number: H01F5/003 , H01F27/2804 , H01F2017/0046 , H01F2027/2809
Abstract: A device includes a first plurality of dielectric layers over a substrate and a second plurality of dielectric layers over the first plurality of dielectric layers. A metal inductor includes a first metal portion, a second metal portion, a third metal portion, and a fourth metal portion, wherein each of the first, the second, the third, and the fourth metal portions extends into the first and the second plurality of dielectric layers. A first metal bridge connects the first metal portion to the second metal portion, wherein the first metal bridge extends into the first plurality of dielectric layers and not into the second plurality of dielectric layers. A second metal bridge connects the third metal portion to the fourth metal portion, wherein the second metal bridge extends into the second plurality of dielectric layers and not into the first plurality of dielectric layers.
Abstract translation: 一种器件包括在衬底上的第一多个电介质层和在第一多个电介质层上的第二多个电介质层。 金属电感器包括第一金属部分，第二金属部分，第三金属部分和第四金属部分，其中第一，第二，第三和第四金属部分中的每一个延伸到第一和第二金属部分 的介电层。 第一金属桥将第一金属部分连接到第二金属部分，其中第一金属桥延伸到第一多个电介质层中，而不延伸到第二多个电介质层中。 第二金属桥将第三金属部分连接到第四金属部分，其中第二金属桥延伸到第二多个介电层中，而不延伸到第一多个电介质层中。
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公开(公告)号：US20110265051A1
公开(公告)日：2011-10-27
申请号：US12766732
申请日：2010-04-23
Applicant: Tzu-Jin Yeh , Kal-Wen Tan , Chewn-Pu Jou , Sally Liu , Fu-Lung Hsueh
Inventor： Tzu-Jin Yeh , Kal-Wen Tan , Chewn-Pu Jou , Sally Liu , Fu-Lung Hsueh
IPC: G06F17/50
CPC classification number: G06F17/5036 , G06F2217/82
Abstract: In accordance with an embodiment, a method for substrate noise analysis comprises using a first processor based system, creating and simulating a circuit schematic comprising a multi-terminal model of a transistor, and thereafter, creating a layout based on properties represented in the circuit schematic and simulation results of the simulating. The multi-terminal model comprises a source terminal, a gate terminal, a drain terminal, a body terminal, and a guard-ring terminal.
Abstract translation: 根据实施例，用于衬底噪声分析的方法包括使用基于第一处理器的系统，创建和模拟包括晶体管的多端子模型的电路原理图，然后基于电路原理图中所示的特性创建布局 和仿真结果的模拟。 多端子模型包括源极端子，栅极端子，漏极端子，主体端子和保护环端子。
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公开(公告)号：US20090224791A1
公开(公告)日：2009-09-10
申请号：US12042606
申请日：2008-03-05
Applicant: Hsiao-Tsung Yen , Tzu-Jin Yeh , Sally Liu
Inventor： Hsiao-Tsung Yen , Tzu-Jin Yeh , Sally Liu
IPC: G01R31/27
CPC classification number: G01R31/2884 , H01L22/34
Abstract: A method and system for de-embedding an on-wafer device is disclosed. The method comprises representing the intrinsic characteristics of a test structure using a set of ABCD matrix components; determining the intrinsic characteristics arising from the test structure; and using the determined intrinsic characteristics of the test structure to produce a set of parameters representative of the intrinsic characteristics of a device-under-test (“DUT”).
Abstract translation: 公开了一种用于去嵌入晶片装置的方法和系统。 该方法包括使用一组ABCD矩阵分量表示测试结构的固有特性; 确定测试结构产生的内在特性; 并且使用确定的测试结构的固有特性来产生表示待测器件（“DUT”）的固有特性的一组参数。
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公开(公告)号：US20070257339A1
公开(公告)日：2007-11-08
申请号：US11382202
申请日：2006-05-08
Applicant: Hsien-Wei Chen , Victor Chang , Tzu-Jin Yeh , Shu-Ying Cho , Keh-Jeng Chang , Kwang-Leei Young
Inventor： Hsien-Wei Chen , Victor Chang , Tzu-Jin Yeh , Shu-Ying Cho , Keh-Jeng Chang , Kwang-Leei Young
IPC: H01L23/62
CPC classification number: H01L23/552 , H01L23/5225 , H01L2924/0002 , H01L2924/3011 , H05K1/0219 , H05K1/0298 , H05K2201/09236 , H05K2201/09618 , H01L2924/00
Abstract: Shield structures are provided. A first and second shield lines are formed over a substrate and coupled with a first voltage. A conductive line is formed between the first and the second shield lines, and coupled with a second voltage. The first shield layer is formed over the substrate and coupled to the first and the second shield lines via at least one first conductive structure.
Abstract translation: 提供盾构结构。 第一和第二屏蔽线形成在衬底上并与第一电压耦合。 在第一和第二屏蔽线之间形成导线，并与第二电压耦合。 第一屏蔽层形成在衬底上并且经由至少一个第一导电结构耦合到第一屏蔽线和第二屏蔽线。
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15.发明授权Through-chip interface (TCI) structure for wireless chip-to-chip communication 有权用于无线芯片到芯片通信的片上接口（TCI）结构公开(公告)号：US09064631B2
公开(公告)日：2015-06-23
申请号：US13350206
申请日：2012-01-13
Applicant: Jun-De Jin , Tzu-Jin Yeh
Inventor： Jun-De Jin , Tzu-Jin Yeh
IPC: H01F38/14 , H01F37/00 , H01F27/28 , H01L23/522 , H01L23/64 , H01L25/065 , H01L23/48
CPC classification number: H01F38/14 , H01F27/2804 , H01F37/00 , H01L23/48 , H01L23/5227 , H01L23/64 , H01L25/0657 , H01L2224/32145 , H01L2225/06531
Abstract: A transformer for RF and other frequency through-chip-interface (TCI) applications includes multiple chips in wireless electronic communication with one another in three-dimensional integrated circuit, 3DIC, technology. Each of the chips includes an inductor coil and a matching network that matches the impedance of the inductor coil. The matching network is electrically coupled between the inductor coil and further components and circuits formed on the chip.
Abstract translation: 用于RF和其他频率通过芯片接口（TCI）应用的变压器包括在三维集成电路，3DIC技术中彼此无线电子通信的多个芯片。 每个芯片包括电感线圈和与电感线圈的阻抗匹配的匹配网络。 匹配网络电耦合在电感线圈和形成在芯片上的其它部件和电路之间。
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Patent Agency Ranking
公开(公告)号：US20130328623A1
公开(公告)日：2013-12-12
申请号：US13494263
申请日：2012-06-12
Applicant: Jun-De Jin , Tzu-Jin Yeh
Inventor： Jun-De Jin , Tzu-Jin Yeh
CPC classification number: H03H7/0115 , H03H7/1758 , H03H11/48
Abstract: Some embodiments relate to a band-pass filter arranged in a ladder-like structure. The band-pass filter includes respective inductor-capacitor (LC) resonators arranged on respective rungs of the ladder-like structure. Respective matching circuits are arranged on a leg of the ladder-like structure between neighboring rungs.
Abstract translation: 一些实施例涉及布置成阶梯状结构的带通滤波器。 带通滤波器包括布置在阶梯状结构的各个梯级上的相应的电感器 - 电容器（LC）谐振器。 相应的匹配电路布置在相邻梯级之间的梯状结构的腿上。
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公开(公告)号：US08502620B2
公开(公告)日：2013-08-06
申请号：US12944847
申请日：2010-11-12
Applicant: Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
Inventor： Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
CPC classification number: H01F21/12 , H01F27/2804 , H01F2027/2809 , H03H7/42 , Y10T29/49117
Abstract: A system and method for transmitting signals is disclosed. An embodiment comprises a balun, such as a Marchand balun, which has a first transformer with a primary coil and a first secondary coil and a second transformer with the primary coil and a second secondary coil. The first secondary coil and the second secondary coil are connected to a ground plane, and the ground plane has slot lines located beneath the separation of the coils in the first transformer and the second transformer. The slot lines may also have fingers.
Abstract translation: 公开了一种用于发送信号的系统和方法。 一个实施例包括一个平衡 - 不平衡变换器，例如Marchand平衡 - 不平衡转换器，其具有带初级线圈的第一变压器和第一次级线圈，以及具有初级线圈的第二变压器和第二次级线圈。 第一次级线圈和第二次级线圈连接到接地平面，并且接地平面具有位于第一变压器和第二变压器中的线圈分离下方的槽线。 缝线也可以具有手指。
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公开(公告)号：US20120126630A1
公开(公告)日：2012-05-24
申请号：US12952429
申请日：2010-11-23
Applicant: Jun-De JIN , Fan-Ming KUO , Huan-Neng CHEN , Ming Hsien TSAI , Hsieh-Hung HSIEH , Tzu-Jin YEH
Inventor： Jun-De JIN , Fan-Ming KUO , Huan-Neng CHEN , Ming Hsien TSAI , Hsieh-Hung HSIEH , Tzu-Jin YEH
CPC classification number: H02J5/005 , H01F5/00 , H01F17/0006 , H01F38/14 , H01F2017/0086 , H02J17/00 , H02J50/12
Abstract: A transformer includes first and second semiconductor substrates. The first semiconductor substrate includes a first circuit, a first coil providing a first impedance, and a first capacitor coupled in parallel with the first coil. The second semiconductor substrate includes a second circuit, a second coil providing a second impedance and inductively coupled with the first coil, and a second capacitor coupled in parallel with the second coil.
Abstract translation: 变压器包括第一和第二半导体衬底。 第一半导体衬底包括第一电路，提供第一阻抗的第一线圈和与第一线圈并联耦合的第一电容器。 第二半导体衬底包括第二电路，提供第二阻抗并与第一线圈感应耦合的第二线圈以及与第二线圈并联耦合的第二电容器。
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公开(公告)号：US20120119845A1
公开(公告)日：2012-05-17
申请号：US12944847
申请日：2010-11-12
Applicant: Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
Inventor： Jhe-Ching Lu , Hsiao-Tsung Yen , Sally Liu , Tzu-Jin Yeh , Min-Chie Jeng
CPC classification number: H01F21/12 , H01F27/2804 , H01F2027/2809 , H03H7/42 , Y10T29/49117
Abstract: A system and method for transmitting signals is disclosed. An embodiment comprises a balun, such as a Marchand balun, which has a first transformer with a primary coil and a first secondary coil and a second transformer with the primary coil and a second secondary coil. The first secondary coil and the second secondary coil are connected to a ground plane, and the ground plane has slot lines located beneath the separation of the coils in the first transformer and the second transformer. The slot lines may also have fingers.
Abstract translation: 公开了一种用于发送信号的系统和方法。 一个实施例包括一个平衡 - 不平衡变换器，例如Marchand平衡 - 不平衡转换器，其具有带初级线圈的第一变压器和第一次级线圈，以及具有初级线圈的第二变压器和第二次级线圈。 第一次级线圈和第二次级线圈连接到接地平面，并且接地平面具有位于第一变压器和第二变压器中的线圈分离下方的槽线。 缝线也可以具有手指。
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公开(公告)号：US20090195327A1
公开(公告)日：2009-08-06
申请号：US12023184
申请日：2008-01-31
Applicant: Shu-Ying Cho , Tzu-Jin Yeh , Sally Liu
Inventor： Shu-Ying Cho , Tzu-Jin Yeh , Sally Liu
IPC: H01P3/08
CPC classification number: H01P3/003 , H01P3/06 , H05K1/0219 , H05K1/0242 , H05K1/025 , H05K2201/09236 , H05K2201/09727 , H05K2201/09781
Abstract: A semiconductor device for transmitting a radio frequency signal along a signal line includes a signal line that extends along a principal axis. On one side of the signal line is a first dielectric, and on the opposite side of the signal line is a second dielectric. First and second ground lines are proximate to the first and second dielectrics, respectively, and the ground lines are approximately parallel to the signal line. The device has a transverse cross-section that varies along the principal axis.
Abstract translation: 沿着信号线发送射频信号的半导体装置包括沿主轴延伸的信号线。 在信号线的一侧是第一电介质，信号线的相对侧是第二电介质。 第一和第二接地线分别靠近第一和第二电介质，并且接地线近似平行于信号线。 该装置具有沿主轴变化的横截面。
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