公开(公告)号：US20120064827A1

公开(公告)日：2012-03-15

申请号：US13229193

申请日：2011-09-09

Applicant: Yong-Hoon KIM ,  Jong-Joo Lee ,  Sang-Youb Lee ,  Young-Don Choi ,  Hee-Seok Lee

Inventor： Yong-Hoon KIM ,  Jong-Joo Lee ,  Sang-Youb Lee ,  Young-Don Choi ,  Hee-Seok Lee

IPC: H04B5/00

CPC classification number: H01L23/645 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/06558 ,  H01L2225/1023 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H04B5/0012 ,  H04B5/0031 ,  H04B5/0037 ,  H04B5/0075 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device is disclosed including a through electrode. The semiconductor device may include a first semiconductor chip including a transceiver circuit formed on a first surface, a first coupling conductive pattern which is formed on a second surface opposite the first surface, and a through electrode which connects the transceiver circuit and the first coupling conductive pattern. There may be a transceiver located on a second semiconductor chip and including a second coupling conductive pattern facing the first coupling conductive pattern which communicates wirelessly with the first coupling conductive pattern.

Abstract translation: 公开了一种包括通孔的半导体器件。 半导体器件可以包括第一半导体芯片，其包括形成在第一表面上的收发器电路，形成在与第一表面相对的第二表面上的第一耦合导体图案，以及连接收发器电路和第一耦合导电 模式。 可以存在位于第二半导体芯片上的收发器，并且包括面向与第一耦合导电图案无线通信的第一耦合导电图案的第二耦合导电图案。

公开(公告)号：US20110241168A1

公开(公告)日：2011-10-06

申请号：US13045103

申请日：2011-03-10

Applicant: YONG-HOON KIM ,  Byeong-Yeon Cho ,  Hee-Seok Lee

Inventor： YONG-HOON KIM ,  Byeong-Yeon Cho ,  Hee-Seok Lee

IPC: H01L23/58

CPC classification number: H01L25/0657 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A package on package structure includes a lower package and an upper package. The lower package includes a first semiconductor chip disposed in a chip region of an upper surface of a first substrate. The upper package includes a second semiconductor chip disposed on an upper surface of a second substrate, and a decoupling capacitor disposed in an outer region of a lower surface of the second substrate. The lower surface of the second substrate opposes the upper surface of the second substrate and faces the upper surface of the first substrate. The plane area of the second substrate is larger than the plane area of the first substrate. The outer region of the lower surface of the second substrate extends beyond a periphery of the first substrate.

Abstract translation: 包装结构上的包装包括下包装和上包装。 下封装包括设置在第一基板的上表面的芯片区域中的第一半导体芯片。 上部封装包括设置在第二基板的上表面上的第二半导体芯片和设置在第二基板的下表面的外部区域中的去耦电容器。 第二基板的下表面与第二基板的上表面相对并且面向第一基板的上表面。 第二基板的平面面积大于第一基板的平面面积。 第二基板的下表面的外部区域延伸超出第一基板的周边。

公开(公告)号：US20110027535A1

公开(公告)日：2011-02-03

申请号：US12846309

申请日：2010-07-29

Applicant: Chul Jong HAN ,  Yong Hoon KIM ,  Min Suk OH ,  Soon Hyung KWON

Inventor： Chul Jong HAN ,  Yong Hoon KIM ,  Min Suk OH ,  Soon Hyung KWON

IPC: B32B3/10 ,  B05D1/04 ,  H05K3/00

CPC classification number: H01L24/27 ,  H01L21/6835 ,  H01L24/29 ,  H01L2221/68359 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/83101 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15788 ,  H01R4/04 ,  H01R13/2414 ,  H01R43/007 ,  Y10T428/24612 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/00

Abstract: Provided are a light, thin, short and small, and multi-functional anisotropic particle-arranged structure including two electrodes having fine pitches that are repeatedly compressed to be connected to external elements, and a method of manufacturing the anisotropic particle-arranged structure. The anisotropic particle-arranged structure includes an elastic polymer layer, and elastic conductors or elastic thermal conductors formed in the elastic polymer layer so that upper and lower portions of the elastic conductors or elastic thermal conductors are exposed.

Abstract translation: 本发明提供一种轻，薄，短，小，多功能的各向异性粒子排列结构，包括具有重复压缩以连接到外部元件的细间距的两个电极，以及制造各向异性粒子排列结构的方法。 各向异性粒子排列结构包括弹性聚合物层，以及形成在弹性聚合物层中的弹性导体或弹性热导体，使得弹性导体或弹性热导体的上部和下部暴露。

公开(公告)号：US20100185876A1

公开(公告)日：2010-07-22

申请号：US12410403

申请日：2009-03-24

Applicant: Yong Hoon Kim

Inventor： Yong Hoon Kim

IPC: G06F11/30 ,  G06F11/00 ,  G06F12/14 ,  G06F12/16 ,  G06F3/00

CPC classification number: G06F3/023 ,  G06F21/55 ,  G06F2221/031

Abstract: A keyboard-input information-security apparatus and method are provided. The apparatus includes an interrupt-descriptor table for storing a list of addresses of functions for handling interrupts, and storing an address of a secure input interrupt-service routine at a specific location in an address area for an operating-system input interrupt-service routine supported by an operating system; a secure input-device driver for changing keyboard-interrupt-vector information to invoke the address of the secure input interrupt-service routine when a keyboard interrupt is generated by a keyboard, and receiving and encoding data input via the keyboard based on the address of the secure input interrupt-service routine; and a secure input unit for delivering the encoded data from the secure input-device driver to an application program, thereby providing higher-level security than a conventional keyboard-security scheme, and particularly, effectively blocking a port-polling attack or an action trying to change a setting in a debug register.

Abstract translation: 提供了键盘输入信息安全装置和方法。 该装置包括用于存储用于处理中断的功能的地址列表的中断描述符表，并且在操作系统输入中断服务程序的地址区中的特定位置处存储安全输入中断服务程序的地址 由操作系统支持; 一种安全的输入设备驱动器，用于当键盘产生键盘中断时，用于改变键盘中断向量信息以调用安全输入中断服务程序的地址，并且基于键盘的地址接收和编码经由键盘输入的数据 安全输入中断服务程序; 以及用于将编码数据从安全输入设备驱动程序传送到应用程序的安全输入单元，从而提供比常规键盘安全方案更高级别的安全性，特别是有效地阻止端口轮询攻击或动作尝试 更改调试寄存器中的设置。

公开(公告)号：US07547940B2

公开(公告)日：2009-06-16

申请号：US11623829

申请日：2007-01-17

Applicant: Yong-hoon Kim

Inventor： Yong-hoon Kim

IPC: H01L29/788

CPC classification number: H01L27/115 ,  H01L27/11519

Abstract: Non-volatile memory devices according to embodiments of the present invention include an EEPROM transistor in a first portion of a semiconductor substrate, an access transistor in a second portion of the semiconductor substrate and an erase transistor in a third portion of the semiconductor substrate. The second portion of the semiconductor substrate extends adjacent a first side of the first portion of the semiconductor substrate and the third portion of the semiconductor substrate extends adjacent a second side of the first portion of the semiconductor substrate. The first and second sides of the first portion of the semiconductor substrate may be opposite sides of the first portion of the semiconductor substrate. The access transistor has a first source/drain terminal electrically connected to a first source/drain terminal of the EEPROM transistor and the erase transistor has a first source/drain terminal electrically connected to a second source/drain terminal of the access transistor.

Abstract translation: 根据本发明的实施例的非易失性存储器件包括在半导体衬底的第一部分中的EEPROM晶体管，半导体衬底的第二部分中的存取晶体管和半导体衬底的第三部分中的擦除晶体管。 半导体衬底的第二部分在半导体衬底的第一部分的第一侧附近延伸，并且半导体衬底的第三部分相邻于半导体衬底的第一部分的第二侧延伸。 半导体衬底的第一部分的第一和第二侧可以是半导体衬底的第一部分的相对侧。 存取晶体管具有电连接到EEPROM晶体管的第一源极/漏极端子的第一源极/漏极端子，并且擦除晶体管具有电连接到存取晶体管的第二源极/漏极端子的第一源极/漏极端子。

公开(公告)号：US07310520B2

公开(公告)日：2007-12-18

申请号：US10334531

申请日：2002-12-30

Applicant: Yong-Hoon Kim

Inventor： Yong-Hoon Kim

IPC: H04M3/00

CPC classification number: G06F21/10 ,  G06F2221/2135 ,  G06F2221/2137

Abstract: The present invention relates to a file construction for mobile communication device including an execution segment in form of machine language codes and a file execution method using the same, whereby a file in accordance with the present invention comprises a header, a file execution segment formed in machine language codes, and a resource segment to be selected by languages; wherein the header includes data for performing one or more of the functions of: 1) verifying reliability/validity of the file, 2) restricting use of the file (by period of the use, by times of the use), and 3) automatic updating of the file.

Abstract translation: 本发明涉及一种移动通信设备的文件结构，该文件结构包括机器语言代码形式的执行段和使用该执行段的文件执行方法，由此根据本发明的文件包括标题，文件执行段 机器语言代码和由语言选择的资源段; 其特征在于，所述头部包括用于执行以下功能的一个或多个功能的数据：1）验证所述文件的可靠性/有效性; 2）限制所述文件的使用（按使用时间，使用时间），以及3）自动 更新文件。

公开(公告)号：US6101037A

公开(公告)日：2000-08-08

申请号：US90220

申请日：1998-06-04

Applicant: Young Jun Park ,  Jung Ho Park ,  Young Mo Hwang ,  Yong Hoon Kim

Inventor： Young Jun Park ,  Jung Ho Park ,  Young Mo Hwang ,  Yong Hoon Kim

IPC: G02B27/10 ,  G02B27/14

CPC classification number: G02B27/145

Abstract: A light combining apparatus using two flat plates combines three separate light beams having blue, green and red wavelengths to a single combined light beam for a light source by an easier and simple small-sized device and makes the combined light beam smoothly enter the place for implementing the final information. The apparatus includes a reflection mirror for reflecting light beams with all of the wavelengths, at least one filter for transmitting only at least one light beam with a specific wavelength and reflecting light beams with the other wavelengths, and a medium located between the reflection mirror and the filter, through which the incident light beams and the reflected light beams pass, wherein the three light beams are combined into a single light beam within the medium which single light beam then exits the apparatus. A method of combining separate light beams having different wavelengths is also disclosed.

Abstract translation: 使用两个平板的光合并装置将具有蓝色，绿色和红色波长的三个单独的光束通过更简单和简单的小尺寸装置组合成用于光源的单个组合光束，并使组合的光束平稳地进入 实施最终信息。 该装置包括用于反射具有所有波长的光束的反射镜，至少一个用于仅传输至少一个具有特定波长的光束并且反射具有其它波长的光束的滤光器，以及位于反射镜和 入射光束和反射光束通过的滤光器，其中三个光束组合成介质内的单个光束，单个光束然后离开设备。 还公开了组合具有不同波长的分离光束的方法。

公开(公告)号：US5771075A

公开(公告)日：1998-06-23

申请号：US567689

申请日：1995-12-05

Applicant: Chai Yeol Rim ,  Yong Hoon Kim

Inventor： Chai Yeol Rim ,  Yong Hoon Kim

IPC: H04N7/52 ,  H04N9/475

CPC classification number: H04N21/4341 ,  H04N21/4305 ,  H04N21/4307

Abstract: An audio/video synchronizer for a digital TV is disclosed including: a system decoder for parsing an input data packet and outputting compressed data of audio and video signals and PTS/DTS and PCR or SCR; an audio/video decoder for decoding the compressed data output from the system decoder, outputting a DTS for the video or audio frame to be decoded, and outputting a decoding ready signal indicating that decoding of the video or audio frame is finished, and a PTS of corresponding data; a frame memory for storing the audio/video data from the audio/video decoder; a clock generator for dividing an input clock into a predetermined value to generate horizontal and vertical sync signals and a PCM clock of the audio signal; an audio/video playing portion for playing the data decoded in the audio/video decoder according to the decoding ready signal in synchronization with the vertical and horizontal sync signals from the clock generator and the audio PCM clock, and outputting the PTS of a picture played and the audio frame; and a PTS/DTS controller for comparing the PTS input from the audio/video playing portion or the DTS from the audio/video decoder with the PCR or SCR input from the system decoder, thereby controlling the audio/video decoder and audio/video playing portion according to their difference.

Abstract translation: 公开了一种用于数字电视的音频/视频同步器，包括：用于解析输入数据分组并输出音频和视频信号以及PTS / DTS和PCR或SCR的压缩数据的系统解码器; 用于解码从系统解码器输出的压缩数据的音频/视频解码器，输出用于要解码的视频或音频帧的DTS，并且输出指示视频或音频帧的解码的解码就绪信号完成，以及PTS 的相应数据; 用于存储来自音频/视频解码器的音频/视频数据的帧存储器; 时钟发生器，用于将输入时钟分为预定值，以产生音频信号的水平和垂直同步信号和PCM时钟; 音频/视频播放部分，用于根据来自时钟发生器和音频PCM时钟的垂直和水平同步信号同步地根据解码就绪信号播放音频/视频解码器中解码的数据，并输出播放的图像的PTS 和音频帧; 以及PTS / DTS控制器，用于将来自音频/视频播放部分的PTS输入或来自音频/视频解码器的DTS与来自系统解码器的PCR或SCR输入进行比较，从而控制音频/视频解码器和音频/视频播放 部分根据他们的差异。

公开(公告)号：US20160172286A1

公开(公告)日：2016-06-16

申请号：US14746247

申请日：2015-06-22

Applicant: Jin-Kyung KIM ,  Yong-hoon KIM ,  Seong-Ho SHIN

Inventor： Jin-Kyung KIM ,  Yong-hoon KIM ,  Seong-Ho SHIN

IPC: H01L23/498 ,  H05K1/18

CPC classification number: H01L23/49816 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/181 ,  H05K2201/09218 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Semiconductor packages, module substrates and semiconductor package modules having the same are provided. The semiconductor package module includes a module substrate provided with a plurality of signal wires on an upper surface thereof, a package substrate disposed on the module substrate, a semiconductor chip disposed on one surface of the package substrate, and a plurality of external connection terminals disposed on another surface of the package substrate.

Abstract translation: 提供半导体封装，模块基板和具有该半导体封装的半导体封装模块。 半导体封装模块包括在其上表面上设置有多个信号线的模块基板，设置在模块基板上的封装基板，设置在封装基板的一个表面上的半导体芯片，以及设置在多个外部连接端子 在封装衬底的另一个表面上。

公开(公告)号：US09142478B2

公开(公告)日：2015-09-22

申请号：US14102430

申请日：2013-12-10

Applicant: Yong-Hoon Kim ,  Ji-Chul Kim ,  Seong-Ho Shin ,  In-Ho Choi

Inventor： Yong-Hoon Kim ,  Ji-Chul Kim ,  Seong-Ho Shin ,  In-Ho Choi

IPC: H01L23/367 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/36 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/49816 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package stack may include a lower semiconductor package and an upper semiconductor package stacked on a lower package board. The upper semiconductor package may include an upper semiconductor chip mounted on an upper package board with an opening configured to expose a lower surface of the upper semiconductor chip and a first heat slug disposed within the opening, contacting the lower surface of the upper semiconductor chip, and contacting an upper surface of a lower semiconductor chip.

Abstract translation: 半导体封装堆叠可以包括下半导体封装和堆叠在下封装板上的上半导体封装。 上半导体封装可以包括安装在上封装板上的上半导体芯片，其具有用于暴露上半导体芯片的下表面的开口和设置在开口内的第一热芯，接触上半导体芯片的下表面， 并接触下半导体芯片的上表面。