Abstract:
An electronic device display may have a color filter layer and a thin film transistor layer. A layer of liquid crystal material may be interposed between the color filter layer and the thin film transistor layer. A layer of polarizer may be laminated onto the surface of the color filter layer. Laser trimming may ensure that the edges of the polarizer are even with the edges of the color filter layer. The thin film transistor layer may have an array of thin film transistors that control pixels of the liquid crystal material in the display. Driver circuitry may be used to control the array. The driver circuitry may be encapsulated in a planarized encapsulant on the thin film transistor layer or may be mounted to the underside of the color filter layer. Conductive structures may connect driver circuitry on the color filter layer to the thin film transistor layer.
Abstract:
Components may have substrates with metal traces that form mating contacts. The components may be bonded together using anisotropic conductive adhesive bonding techniques. During bonding, conductive particles may be concentrated over the contacts by application of magnetic or electric fields or by using a template transfer process. Gaps between the contacts may be at least partially free of conductive particles to help isolate adjacent contacts. Polymer between the substrates may attach the substrates together. The conductive particles may be embedded in the polymer and crushed or melted to short opposing contacts together.
Abstract:
Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.
Abstract:
A sensor includes a patterned compliant layer positioned between two substrates. Each substrate can include one or more conductive electrodes, with each electrode of one substrate paired with a respective electrode of the other substrate. Each pair of conductive electrodes forms a capacitor. Several methods are disclosed that can be used to produce the patterned compliant layer.
Abstract:
An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.
Abstract:
A lamination system (110) may be provided for attaching together display layers (45,46) for an electronic device display. The system may include one or more pressure-sensing lamination stages (124, 126) for temporarily mounting the display layers during lamination operations. A pressure-sensing lamination stage (124) may include one or more pressure sensors (130) configured to sense pressures that are applied to the display layers during lamination operations. The pressure-sensing lamination stages may include a fixed mounting stage (126) and a movable mounting stage (124). The movable mounting stage may be moved so that a first set of display layers is pressed against a second set of display layers to attach the first and second sets of display layers. The pressure with which the first set of display layers (45;46) is pressed against the second set of display layers may be adjusted based on pressure data gathered using the pressure sensors (130).
Abstract:
An assembly system may be provided for attaching together display layers for an electronic device display. The system may include substrate cleaning equipment that includes one or more pressure-sensing cleaning rollers (124) for removing debris from the display layers during assembly operations. A pressure-sensing cleaning roller (124) may include a cylindrical roller member having a tacky surface and one or more pressure sensors (136) configured to sense pressures that are applied to the display layers during cleaning operations. The position and orientation of the cleaning rollers (124) may be adjusted before or during cleaning operations based on pressure data gathered using the pressure sensors. The pressure sensors (136) may be attached to the tacky surface of the cylindrical roller member, attached to an edge of the roller member, embedded within the roller member, or attached to other equipment that moves with the roller member.
Abstract:
An electronic device may have display layers and other structures. A layer of liquid adhesive may be patterned onto a structure. The liquid adhesive may be pre-cured to increase the viscosity of the liquid adhesive and to partially shrink the liquid adhesive. The structure to which the liquid adhesive has been applied may be laminated to another structure. During lamination, the pre-cured liquid adhesive may be compressed between the structures that are being laminated. The adhesive may then be fully cured to bond the structures together. The thickening of the liquid adhesive during pre-curing helps control the spread of the adhesive. The shrinking of the liquid adhesive helps prevent stresses from developing that could lead to visible stress-induced artifacts following curing.
Abstract:
An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing conductive structures that pass through polymer layers of the display and/or conductive structures that wrap around an edge of the display and couple conductive traces on the display to conductive traces on additional circuitry that is mounted behind the display.
Abstract:
A sensor includes a patterned compliant layer positioned between two substrates. Each substrate can include one or more conductive electrodes, with each electrode of one substrate paired with a respective electrode of the other substrate. Each pair of conductive electrodes forms a capacitor. Several methods are disclosed that can be used to produce the patterned compliant layer.