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公开(公告)号：US10245767B2
公开(公告)日：2019-04-02
申请号：US15368307
申请日：2016-12-02
Applicant: Apple Inc.
Inventor： Xuesen Li , Tyler S. Bushnell , Christopher M. Werner
IPC: H05K7/00 , B29C45/14 , B29C45/26 , B29C45/16 , G01L9/00 , H04R1/44 , H04R31/00 , B29L31/34 , B29K627/18 , B29K463/00 , H04R7/20
Abstract: A bracket assembly suitable for use with an electronic device is described. The bracket assembly may include a bracket body having a channel. The bracket assembly may further include a membrane embedded in the bracket body and designed to allow air, but not liquid (such as water), to pass through the membrane. The membrane may be at least partially surrounded by a membrane support molded to the membrane. The membrane and the membrane support may be disposed in a molding tool to receive a material used to mold the bracket body over the membrane and the membrane support. During the molding operation, the membrane support may act as a buffer to shield the membrane from temperature and pressure increases associated with the molding operation of the bracket body. The bracket assembly may improve the ability of the electronic device to prevent liquid ingress.
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公开(公告)号：US20180341342A1
公开(公告)日：2018-11-29
申请号：US16055359
申请日：2018-08-06
Applicant: Apple Inc.
Inventor： Tyler S. Bushnell , Collin R. Petty , Adam T. Clavelle
IPC: G06F3/0338 , G06F1/16 , G06F3/0362
CPC classification number: G06F3/0338 , G04C3/005 , G04C3/007 , G04G21/08 , G06F1/163 , G06F3/03547 , G06F3/0362 , G06F3/044 , G06F2203/0339
Abstract: An input mechanism for a portable electronic device includes a rotational manipulation mechanism, such as a cap or shaft. The input mechanism also includes a sensor having first capacitive elements coupled to the manipulation mechanism, second capacitive elements, and a dielectric positioned between the first and second capacitive elements. Movement of the manipulation mechanism alters the positions of the first and second capacitive elements with respect to each other and is determinable based on capacitance changes resulting therefrom. In some implementations, the second capacitive elements may be part of an inner ring or partial ring nested at least partially within an outer ring or partial ring.
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公开(公告)号：US10006937B2
公开(公告)日：2018-06-26
申请号：US14641150
申请日：2015-03-06
Applicant: Apple Inc.
Inventor： Tyler S. Bushnell , Vikram Garg
Abstract: Capacitive sensor assemblies for electronic devices, and methods of forming capacitive sensor assemblies. The capacitive sensor assembly may include a top component having an intermediate layer formed on the top component, a bottom component positioned opposite the top component, a silicone layer positioned between the top component and the bottom component, and a first electrical trace positioned adjacent the silicone layer.
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公开(公告)号：US20170093085A1
公开(公告)日：2017-03-30
申请号：US15017417
申请日：2016-02-05
Applicant: APPLE INC.
Inventor： Tyler S. Bushnell , David I. Nazzaro , Benjamin J. Kallman
IPC: H01R13/52
CPC classification number: H01H13/00 , G06F1/1626 , G06F1/1656 , G06F1/1671 , H01R13/703
Abstract: An electronic device has a concealed external electrical connector that may be activated by a pin of a mating connector. When the pin applies a force to an electrically conductive and flexible region of an exterior housing of an electronic device the electrically conductive region deflects inwards coupling to a contact within the electronic device. A bi-directional communications path is then established from the pin of the connector, through the conductive portion of the housing, to the contact and to circuitry within the housing of the electronic device.
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公开(公告)号：US09557593B2
公开(公告)日：2017-01-31
申请号：US14732583
申请日：2015-06-05
Applicant: APPLE INC.
Inventor： Tyler S. Bushnell , Samuel Bruce Weiss , Benjamin J. Kallman
IPC: G02F1/1335 , H01R12/00 , G02F1/1333 , H05K9/00 , G01D5/12 , H01B7/00
CPC classification number: G02F1/133377 , G01D5/12 , G02F1/133305 , G02F1/133514 , G02F1/133528 , G02F1/1336 , G02F1/13452 , G02F1/13731 , G02F2001/133624 , H01B7/0027 , H05K9/0071
Abstract: Transparent structures containing a transparent electrically conductive fluid are used for aesthetically appealing designs and/or improved fatigue performance. Some structures have multiple isolated conductors while others have a single conductive area that may be used as a transparent antenna or a transparent EMI shield. Other embodiments employ fluids that change crystalline structure under an applied voltage such that a structure can change color and/or display a message.
Abstract translation: 含有透明导电流体的透明结构被用于美学吸引设计和/或改善的疲劳性能。 一些结构具有多个隔离导体，而其它结构具有可用作透明天线或透明EMI屏蔽的单个导电区域。 其它实施例采用在施加的电压下改变晶体结构的流体，使得结构可以改变颜色和/或显示消息。
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Patent Agency Ranking
公开(公告)号：US20170027058A1
公开(公告)日：2017-01-26
申请号：US14804486
申请日：2015-07-21
Applicant: Apple Inc.
Inventor： Ryan C. Perkins , Trevor J. Ness , Tyler S. Bushnell , Steven P. Cardinali
CPC classification number: H05K1/0218 , H01L23/28 , H01L23/564 , H01L23/60 , H01L31/048 , H01L2224/16225 , H01L2924/181 , H05K1/147 , H05K1/167 , H05K1/185 , H05K3/284 , H05K9/0022 , H05K2201/0133 , H05K2201/0707 , H05K2201/10098 , H05K2201/10151 , H05K2201/10371 , H05K2201/10977 , H05K2203/1316 , H01L2924/00012
Abstract: Electrical components such as integrated circuits and other components may be mounted on a substrate such as a printed circuit substrate. A molded plastic cap may cover the components and a portion of the printed circuit substrate to form a packaged electrical device. Metal structures such as springs, posts, and other metal members may be insert molded within the plastic cap. A metal layer on the surface of the cap may be patterned to from electromagnetic shielding, signal paths, contact pads, sensor electrodes, antennas, and other structures. Multiple substrates each with a respective set of mounted electrical components may be joined using a flexible printed circuit. The flexible printed circuit may be covered with a rigid cap portion or an elastomeric material or may be left uncovered.
Abstract translation: 诸如集成电路和其他部件的电气部件可以安装在诸如印刷电路基板的基板上。 模制塑料帽可以覆盖部件和印刷电路基板的一部分以形成封装的电气装置。 诸如弹簧，柱和其它金属构件的金属结构可以嵌入模塑在塑料盖内。 盖的表面上的金属层可以被图案化为电磁屏蔽，信号路径，接触焊盘，传感器电极，天线和其他结构。 可以使用柔性印刷电路连接各自具有相应的一组安装的电气部件的多个基板。 柔性印刷电路可以用刚性盖部分或弹性体材料覆盖，或者可以不被覆盖。
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17.发明授权Electronic device structures joined using shrinking and expanding attachment structures 有权使用收缩和扩展的附接结构连接的电子装置结构公开(公告)号：US09454188B2
公开(公告)日：2016-09-27
申请号：US14295051
申请日：2014-06-03
Applicant: Apple Inc.
Inventor： Tyler S. Bushnell , Jason C. Sauers
CPC classification number: G06F1/181 , G06F1/1679 , G06F1/183 , H01R4/726 , H05K13/00 , Y10T29/49119
Abstract: An electronic device has structures that are assembled using attachment structures. The attachment structures change shape to help join the electronic device structures together. Structures that may be joined together can include electronic device housing structures, display structures, internal device components, electrical components, and other portions of an electronic device. The attachment structures can include heat-activated attachment structures, structures that are activated using other types of applied energy, and structures that change shape due the application of chemicals or other treatments.
Abstract translation: 电子设备具有使用附接结构组装的结构。 附件结构改变形状以帮助将电子设备结构连接在一起。 可以连接在一起的结构可以包括电子设备外壳结构，显示结构，内部设备部件，电气部件以及电子设备的其它部分。 附接结构可以包括热激活附着结构，使用其他类型的施加能量激活的结构，以及由于施加化学物质或其它处理而改变形状的结构。
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公开(公告)号：US20160190719A1
公开(公告)日：2016-06-30
申请号：US14843905
申请日：2015-09-02
Applicant: APPLE INC.
Inventor： Makiko K. Brzezinski , Tyler S. Bushnell , David I. Nazzaro
CPC classification number: H01R12/716 , H01R12/73 , H01R13/5216 , H01R13/5219 , H01R43/005 , H01R43/205
Abstract: Board-to-board connectors that may provide durable and reliable connections, may save board space, and may be easy to manufacture. One example may provide board-to-board connectors that provide durable connections by providing a seal between board-to-board plugs and receptacles. The seal may be an O-ring, gasket, or other seal. The seal may protect contacts on the board-to-board connectors from exposure to fluids, such as water or other corrosive fluids. This seal may provide a level of redundancy with one or more seals protecting a device from external fluids, such as a seal at or in the device enclosure.
Abstract translation: 可提供持久可靠连接的板对板连接器可节省电路板空间，并且可以容易地制造。 一个示例可以提供板对板连接器，其通过在板对板插头和插座之间提供密封来提供耐用的连接。 密封件可以是O形圈，垫圈或其他密封件。 密封可以保护板对板连接器上的触点暴露于流体，如水或其他腐蚀性液体。 该密封件可以提供一种冗余度，其中一个或多个密封件可保护设备免受外部流体的影响，例如设备外壳处或设备外壳处的密封。
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公开(公告)号：US20160016395A1
公开(公告)日：2016-01-21
申请号：US14805276
申请日：2015-07-21
Applicant: APPLE INC.
Inventor： Tyler S. Bushnell , Erik G. de Jong , Peter J. Kardassakis , Shih-Min Hsu
CPC classification number: B32B37/1207 , B32B37/06 , B32B37/1045 , B32B37/18 , B32B2037/1215 , B32B2307/41 , B32B2307/412 , B32B2310/028 , B32B2310/0825 , B32B2310/0831 , B32B2457/00 , G06F1/16 , G06F11/3058
Abstract: Adhesive may be used to bond electronic device structures together. The adhesive may be a heat activated film. Heat to activate the film may be produced by vibrating electronic device structures so that they rub against each other. An ohmic heating element may be used to produce heat under the control of circuitry inside an electronic device and may be adjusted based on temperature sensor data. Infrared light may pass through a display cover layer to activate the heat activated film. Radio-frequency signals may heat the heat activated film and may be absorbed by fibers in the film or resonant elements such as metal traces. Exothermic reactions may be used to activate the film. An ultraviolet light source may initiate curing of a solid adhesive film layer before the layer is pressed between structures to be joined. A display may produce light that cures adhesive in an electronic device.
Abstract translation: 粘合剂可用于将电子器件结构粘合在一起。 粘合剂可以是热活化膜。 可以通过振动电子器件结构使其彼此摩擦来产生热激活膜。 欧姆加热元件可用于在电子设备内的电路控制下产生热量，并且可以基于温度传感器数据进行调整。 红外光可以通过显示器覆盖层以激活热活化膜。 射频信号可以加热热活化膜并且可以被膜中的纤维或诸如金属迹线的谐振元件吸收。 可以使用放热反应来活化膜。 紫外光源可以在层被压接在待连接的结构之前引发固体粘合剂膜层的固化。 显示器可以产生固化电子设备中的粘合剂的光。
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公开(公告)号：US20150357733A1
公开(公告)日：2015-12-10
申请号：US14300855
申请日：2014-06-10
Applicant: Apple Inc.
Inventor： Emery A. Sanford , Tyson B. Manullang , David G. Havskjold , Tyler S. Bushnell , Eric S. Jol , Anthony S. Montevirgen , John Raff
IPC: H01R12/61
CPC classification number: H01R12/62 , H01R12/52 , H05K1/14 , H05K1/142 , H05K1/147 , H05K1/148 , H05K2201/046 , H05K2201/05 , H05K2201/10325 , H05K2201/1034 , H05K2201/10681
Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.
Abstract translation: 一种电路板对板连接器，包括具有低轮廓或尺寸减小的构造的柔性电缆组件。 电缆组件的连接器主体可以被加宽以提供足以支持焊锡引线连接阵列的结构刚度。 可以从电缆组件中省略其它支撑元件，这导致减小的高度尺寸。 柔性电缆组件还可以包括用于将电缆组件保持抵靠电路板的整流罩。 整流罩也可以被配置成减小连接的尺寸或尺寸。
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