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公开(公告)号：US20170203406A1
公开(公告)日：2017-07-20
申请号：US15394044
申请日：2016-12-29
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Fred C. REDEKER , Mahendra C. ORILALL , Boyi FU , Mayu YAMAMURA
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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公开(公告)号：US20160114458A1
公开(公告)日：2016-04-28
申请号：US14920801
申请日：2015-10-22
Applicant: APPLIED MATERIALS, INC.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava REDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
CPC classification number: B24B37/26 , B24B37/22 , B24B37/24 , B24D3/28 , B24D11/00 , B24D11/001 , B24D11/04 , B33Y10/00 , B33Y80/00
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
Abstract translation: 本公开的实施例涉及具有可调节的化学，材料和结构特性的高级抛光垫及其制造方法。 根据本公开的一个或多个实施例，已经发现可以通过诸如三维（3D）印刷工艺的添加剂制造工艺来生产具有改进性能的抛光垫。 因此，本公开的实施例可以提供具有离散特征和几何形状的先进抛光垫，其由至少两种不同的材料形成，包括功能性聚合物，功能低聚物，反应性稀释剂和固化剂。 例如，先进的抛光垫可以由多个聚合物层形成，通过至少一种树脂前体组合物的自动顺序沉积，然后至少一个固化步骤，其中各层可代表至少一种聚合物组合物和/ 或不同组成的区域。
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13.发明申请公开(公告)号：US20160107381A1
公开(公告)日：2016-04-21
申请号：US14863409
申请日：2015-09-23
Applicant: Applied Materials, Inc.
Inventor： Kasiraman KRISHNAN , Daniel REDFIELD , Russell Edward PERRY , Gregory E. MENK , Rajeev BAJAJ , Fred C. REDEKER , Nag B. PATIBANDLA , Mahendra C. ORILALL , Jason G. FUNG
CPC classification number: B29C64/112 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/001 , B29K2105/16 , B29K2995/007 , B29L2031/736
Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.
Abstract translation: 一种抛光制品制造系统，包括进料部分和卷取部分，所述卷取部分包括供料辊，所述供料辊具有设置在其上用于化学机械抛光工艺的抛光制品，所述打印部分包括设置在所述进料之间的多个打印头 以及设置在所述进料部和所述卷取部之间的固化部，所述固化部包括热固化装置和电磁固化装置中的一个或两个。
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公开(公告)号：US20160107287A1
公开(公告)日：2016-04-21
申请号：US14887240
申请日：2015-10-19
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Daniel REDFIELD , Mahendra C. ORILALL , Boyi FU , Aniruddh KHANNA , Jason G. FUNG , Mario CORNEJO , Ashwin CHOCKALINGAM , Mayu YAMAMURA , Veera Raghava Reddy KAKIREDDY , Ashavani KUMAR , Venkatachalam HARIHARAN , Gregory E. MENK , Fred C. REDEKER , Nag B. PATIBANDLA , Hou T. NG , Robert E. DAVENPORT , Amritanshu SINHA
Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.
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公开(公告)号：US20230330805A1
公开(公告)日：2023-10-19
申请号：US18138555
申请日：2023-04-24
Applicant: Applied Materials, Inc.
Inventor： Sivapackia GANAPATHIAPPAN , Nag B. PATIBANDLA , Rajeev BAJAJ , Daniel REDFIELD , Fred C. REDEKER , Mahendra C. ORILALL , Boyi FU , Mayu YAMAMURA , Ashwin CHOCKALINGAM
CPC classification number: B24B37/22 , B24D3/22 , B24D3/18 , B33Y10/00 , B24B37/24 , B24B37/26 , B33Y80/00
Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.
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Patent Agency Ranking
公开(公告)号：US20190299357A1
公开(公告)日：2019-10-03
申请号：US16442687
申请日：2019-06-17
Applicant: Applied Materials, Inc.
Inventor： Mahendra Christopher ORILALL , Timothy MICHAELSON , Kasiraman KRISHNAN , Rajeev BAJAJ , Nag B. PATIBANDLA , Daniel REDFIELD , Fred C. REDEKER , Gregory E. MENK
Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.
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公开(公告)号：US20190030678A1
公开(公告)日：2019-01-31
申请号：US16042016
申请日：2018-07-23
Applicant: Applied Materials, Inc.
Inventor： Ashavani KUMAR , Ashwin CHOCKALINGAM , Sivapackia GANAPATHIAPPAN , Rajeev BAJAJ , Boyi FU , Daniel REDFIELD , Nag B. PATIBANDLA , Mario Dagio CORNEJO , Amritanshu SINHA , Yan ZHAO , Ranga Rao ARNEPALLI , Fred C. REDEKER
IPC: B24B37/24 , B29C64/112
Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.
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18.发明申请公开(公告)号：US20180161954A1
公开(公告)日：2018-06-14
申请号：US15876436
申请日：2018-01-22
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
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19.发明申请CMP PAD CONSTRUCTION WITH COMPOSITE MATERIAL PROPERTIES USING ADDITIVE MANUFACTURING PROCESSES 有权使用添加剂制造工艺的具有复合材料特性的CMP PAD结构公开(公告)号：US20160107290A1
公开(公告)日：2016-04-21
申请号：US14695299
申请日：2015-04-24
Applicant: Applied Materials, Inc.
Inventor： Rajeev BAJAJ , Kasiraman KRISHNAN , Mahendra C. ORILALL , Daniel REDFIELD , Fred C. REDEKER , Nag B. PATIBANDLA , Gregory E. MENK , Jason G. FUNG , Russell Edward PERRY , Robert E. DAVENPORT
CPC classification number: B24B37/26 , B24B37/205 , B24B37/22 , B24B37/24 , B24D18/0045 , B29C64/112 , B33Y80/00
Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.
Abstract translation: 本公开的实施例通常提供抛光垫，其包括复合衬垫本体和用于形成抛光垫的方法。 一个实施例提供了一种包括复合衬垫本体的抛光垫。 复合衬垫本体包括由第一材料或第一组合材料形成的一个或多个第一特征以及由第二材料或第二材料组合物形成的一个或多个第二特征，其中所述一个或多个第一特征和一个 或更多的第二特征通过沉积多个层而形成，所述多个层包括第一材料或第一材料组合物和第二材料或第二材料组合物。
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公开(公告)号：US20160107288A1
公开(公告)日：2016-04-21
申请号：US14885955
申请日：2015-10-16
Applicant: Applied Materials, Inc.
Inventor： Mahendra Christopher ORILALL , Timothy MICHAELSON , Kasiraman KRISHNAN , Rajeev BAJAJ , Nag B. PATIBANDLA , Daniel REDFIELD , Fred C. REDEKER , Gregory E. MENK
Abstract: A method of fabricating a polishing layer of a polishing pad includes successively depositing a plurality of layers with a 3D printer, each layer of the plurality of polishing layers deposited by ejecting a base material from a first nozzle and an additive material from a second nozzle and solidifying the base and additive material to form a solidified pad material.
Abstract translation: 制造抛光垫的抛光层的方法包括用3D打印机连续沉积多个层，通过从第一喷嘴喷射基材并从第二喷嘴排出添加剂材料沉积多个抛光层的每一层，以及 固化基材和添加剂材料以形成固化的垫材料。
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