公开(公告)号：US4478363A

公开(公告)日：1984-10-23

申请号：US254297

申请日：1981-04-15

申请人： Hiromichi Imahashi ,  Shigeo Turuoka ,  Keiichi Kuniya ,  Tomio Iizuka ,  Akira Kawahara

发明人： Hiromichi Imahashi ,  Shigeo Turuoka ,  Keiichi Kuniya ,  Tomio Iizuka ,  Akira Kawahara

IPC分类号： B23K20/02 ,  B21D39/04

CPC分类号： B23K20/02

摘要： A method of production of a composite billet for a nuclear fuel cladding tube wherein a hollow inner billet of zirconium is inserted in a hollow outer billet of a nuclear fuel cladding material. Following insertion of a resilient member in the hollow inner billet, pressure is applied to the resilient member axially of the billets to force the inner billet against the outer billet, to produce a pressure bonding between an inner surface of the outer billet and an outer surface of the inner billet.

摘要翻译： 一种生产用于核燃料包层管的复合坯料的方法，其中锆的中空内部坯料插入核燃料包层材料的中空外部坯料中。 在将弹性构件插入中空的内部坯料中之后，将压力作用在坯料轴向的弹性构件上以迫使内部坯料抵抗外部坯料，从而在外部坯料的内表面和外部表面之间产生压力结合 的内部钢坯。

公开(公告)号：US4091248A

公开(公告)日：1978-05-23

申请号：US589673

申请日：1975-06-24

申请人： Hideo Arakawa ,  Keiichi Kuniya

发明人： Hideo Arakawa ,  Keiichi Kuniya

IPC分类号： C22C9/00 ,  H01H1/02 ,  H01H1/025 ,  H01H33/66

CPC分类号： H01H1/0203

摘要： In a vacuum-type circuit breaker, a contact is composed of a principal component material of Cu alloy, to which a Pb-Bi alloy, containing either 18 to 45 weight % Bi or 65 to 80 weight % Bi and at least one of either cobalt or iron are added. Said contact is provided with a structure in which at least one of either cobalt phase or iron phase is dispersed in a copper matrix and Pb-Bi alloy phase is dispersed in the grain boundary, and has extremely low chopping current.

摘要翻译： 在真空型断路器中，接触由Cu合金的主要成分材料构成，Pb-Bi合金含有18-45重量％Bi或65-80重量％Bi和至少一个 加入钴或铁。 所述接触具有这样的结构，其中钴相或铁相中的至少一种分散在铜基体中，并且Pb-Bi合金相分散在晶界中，并且具有极低的切断电流。

公开(公告)号：US4482912A

公开(公告)日：1984-11-13

申请号：US344976

申请日：1982-02-02

申请人： Akio Chiba ,  Seiki Shimizu ,  Keiichi Kuniya ,  Jin Onuki

发明人： Akio Chiba ,  Seiki Shimizu ,  Keiichi Kuniya ,  Jin Onuki

IPC分类号： H01L21/52 ,  B32B15/14 ,  C22C49/14 ,  H01L21/58 ,  H01L23/373 ,  H01L23/492 ,  H01L31/0392 ,  H01L23/14 ,  H01L23/18 ,  H01L23/54

CPC分类号： H01L24/83 ,  B32B15/14 ,  C22C49/14 ,  H01L23/3733 ,  H01L23/4922 ,  H01L24/29 ,  H01L24/32 ,  H01L31/03921 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1301 ,  H01L2924/14 ,  H01L2924/15747 ,  Y02E10/50 ,  Y10T428/12444 ,  Y10T428/12486

摘要： Herein disclosed is a stacked or laminated structure which is rigidly integrated by sandwiching a metal layer between a first matrix-fiber composite layer prepared to have as a whole a thermal expansion coefficient and a second matrix-fiber layer prepared to have as a whole another thermal expansion coefficient different from that of the first matrix-fiber composite layer. The intervening metal layer acts as a buffer for the first and second matrix-fiber composite layers. The stacked structure according to the present invention can by used as the chip carrier of a semiconductor device, for example.

摘要翻译： 本文公开了一种层叠或层压结构，其通过将金属层夹在准备具有整体热膨胀系数的第一基质 - 纤维复合材料层和制备成具有另一种热膨胀系数的第二基质 - 纤维层之间而被刚性地整合 膨胀系数与第一基质纤维复合层不同。 中间金属层用作第一和第二基质 - 纤维复合层的缓冲剂。 根据本发明的堆叠结构可以例如用作半导体器件的芯片载体。

公开(公告)号：US4470063A

公开(公告)日：1984-09-04

申请号：US322699

申请日：1981-11-18

申请人： Hideo Arakawa ,  Keiichi Kuniya ,  Takashi Namekawa ,  Masabumi Ohashi

发明人： Hideo Arakawa ,  Keiichi Kuniya ,  Takashi Namekawa ,  Masabumi Ohashi

IPC分类号： H01L21/52 ,  H01L21/58 ,  H01L23/049 ,  H01L23/051 ,  H01L23/31 ,  H01L23/492 ,  H01L23/48 ,  H01L23/02 ,  H01L29/40 ,  H01L29/46

CPC分类号： H01L24/83 ,  H01L23/049 ,  H01L23/051 ,  H01L23/3107 ,  H01L23/3171 ,  H01L23/4928 ,  H01L24/33 ,  H01L2224/2919 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/12036 ,  H01L2924/13033 ,  H01L2924/181 ,  H01L2924/351

摘要： A semiconductor device includes a semiconductor substrate having electrodes brazed thereto. The electrode is made of a Cu-C composite material in which carbon fibers are embedded in copper matrix. The carbon fibers are so disposed as to be in a ring-like shape or a loop shape substantially in parallel with a surface of the semiconductor substrate onto which the electrode is brazed. The carbon fibers disposed in an outer peripheral portion have a higher longitudinal elastic modulus than that of the carbon fibers positioned at a central portion of the electrode. The electrode thus has a thermal expansion coefficient approximating to that of the semiconductor substrate. Content of copper can be increased at the central portion of the electrode for attaining a high thermal conductivity.

摘要翻译： 半导体器件包括具有钎焊到其上的电极的半导体衬底。 电极由Cu-C复合材料制成，其中碳纤维嵌入铜基体中。 碳纤维被布置为与电极钎焊在其上的半导体衬底的表面基本上平行的环形形状或环形。 布置在外周部分中的碳纤维具有比位于电极的中心部分的碳纤维更高的纵向弹性模量。 因此，电极的热膨胀系数接近于半导体衬底的热膨胀系数。 在电极的中心部分可以增加铜的含量以获得高导热性。

公开(公告)号：US4226917A

公开(公告)日：1980-10-07

申请号：US895590

申请日：1978-04-12

申请人： Masao Tsuruoka ,  Hideyuki Yagi ,  Keiichi Morita ,  Keiichi Kuniya

发明人： Masao Tsuruoka ,  Hideyuki Yagi ,  Keiichi Morita ,  Keiichi Kuniya

IPC分类号： H01L21/52 ,  B23K35/00 ,  B60L5/20 ,  F16C33/12 ,  H01L21/60 ,  H01L23/48 ,  H01L23/492 ,  H01L29/861 ,  H01R39/08 ,  H01R41/00 ,  H01R43/02 ,  B32B15/14 ,  B32B15/20 ,  B60M5/00

CPC分类号： H01L24/01 ,  B23K35/007 ,  B60L5/20 ,  F16C33/12 ,  H01L23/4928 ,  H01R39/08 ,  H01R41/00 ,  B60L2200/26 ,  F16C2204/20 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12036 ,  H01L2924/1301 ,  H01L2924/351 ,  H01R43/02 ,  Y10T428/12486 ,  Y10T428/12625 ,  Y10T428/12812 ,  Y10T428/12833 ,  Y10T428/12854 ,  Y10T428/1291 ,  Y10T428/12944

摘要： A composite joint system is disclosed in which a composite structure containing carbon fibers embedded in a copper matrix in any configuration, e.g. in one direction, in random directions, in mesh form, spirally or radially is joined to another structure through a brazing material such as solder, Al brazer or Ag brazer. A film of metal such as Ni, Cr, Mo, W, Ta, Ti, Zr, V, an alloy of one or some of such metals, or the combination of some thereof is interposed between the composite structure and the brazing material. The metal film has a good wettability to both the composite structure material and the brazing material.

摘要翻译： 公开了一种复合结构体系，其中包含嵌入铜基体中的任何构型的碳纤维的复合结构，例如。 在一个方向上，以任意方向，以网状形式，螺旋状或径向地通过诸如焊料，Al钎焊剂或Ag钎焊剂的钎焊材料连接到另一结构。 在复合结构和钎焊材料之间插入有诸如Ni，Cr，Mo，W，Ta，Ti，Zr，V的金属，一种或一种这样的金属的合金或其组合。 金属膜对复合结构材料和钎焊材料都具有良好的润湿性。

公开(公告)号：US4664727A

公开(公告)日：1987-05-12

申请号：US506393

申请日：1983-06-21

申请人： Masahisa Inagaki ,  Ryutaro Jinbo ,  Keiichi Kuniya ,  Isao Masaoka ,  Hideo Maki

发明人： Masahisa Inagaki ,  Ryutaro Jinbo ,  Keiichi Kuniya ,  Isao Masaoka ,  Hideo Maki

IPC分类号： C22C16/00 ,  C22F1/18

CPC分类号： C22F1/186

摘要： A zirconium alloy having superior corrosion resistance, containing Sn of a small amount not less than the amount of Sn existing in the solid-solution of the zirconium alloy at a room temperature, and at least one kind of Fe and Cr each of a small amount not less than the amount of each of Fe and Cr existing in the solid-solution of the zirconium alloy at a room temperature,the zirconium alloy being annealed after the solution heat treatment at a temperature at which both the .alpha. phase and .beta. phase thereof are included in the zirconium alloy,the total amount of said at least one kind of Fe and Cr existing in the solid-solution of the zirconium alloy being not less than 0.26%.

摘要翻译： 具有优异的耐腐蚀性的锆合金，其含有少量不小于室温下的锆合金的固溶体中的Sn的量的Sn和至少一种少量的Fe和Cr 不少于在室温下锆合金固溶体中存在的Fe和Cr中的每一种，锆合金在固溶热处理后在其α相和β相均为 包含在锆合金中，锆合金固溶体中存在的所述至少一种Fe和Cr的总量不小于0.26％。

公开(公告)号：US4497875A

公开(公告)日：1985-02-05

申请号：US464945

申请日：1983-02-08

申请人： Hideo Arakawa ,  Keiichi Kuniya ,  Akio Chiba ,  Seiki Shimizu

发明人： Hideo Arakawa ,  Keiichi Kuniya ,  Akio Chiba ,  Seiki Shimizu

IPC分类号： H05K3/44 ,  B23K35/30 ,  B32B15/04 ,  C04B37/00 ,  C04B37/02 ,  H01L21/52 ,  H01L23/14 ,  H01L23/15 ,  H05K3/38 ,  H05K7/20 ,  H05K1/02

CPC分类号： H01L23/142 ,  B23K35/302 ,  C04B37/026 ,  H01L23/15 ,  H05K3/38 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/126 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/38 ,  C04B2237/407 ,  C04B2237/708 ,  C04B2237/86 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01078 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T428/12528 ,  Y10T428/12535

摘要： A ceramic substrate with metal plate, wherein a metal plate consisting mainly of copper is bonded to a ceramic substrate through a brazing layer consisting of a mixture of copper oxide and copper.

摘要翻译： 具有金属板的陶瓷基板，其中主要由铜组成的金属板通过由氧化铜和铜的混合物构成的钎焊层与陶瓷基板接合。

公开(公告)号：US4347413A

公开(公告)日：1982-08-31

申请号：US062117

申请日：1979-07-30

申请人： Ryuji Watanabe ,  Keiichi Kuniya

发明人： Ryuji Watanabe ,  Keiichi Kuniya

IPC分类号： H01H33/66 ,  C22C9/00 ,  H01H1/02

CPC分类号： C22C9/00 ,  H01H1/0203

摘要： An electrode of a vacuum circuit breaker, having a high dielectric strength, large breaking current and superior non-welding characteristic. The electrode is made of a cast alloy comprising copper, 20 wt% or less of rare earth metal such as lanthanum, cerium or an alloy of either one of these rare earth metal with another rare earth metal, 10 wt% or less of a metal such as lead and bismuth having a lower melting point and a higher vapor pressure than copper, and 0.1 to 30 wt% of a metal of iron group. A part of the rare earth metal and a part of the metal having the lower melting point and higher vapor pressure than copper are crystallized in the grain boundary and in the grains of copper.

摘要翻译： 真空断路器的电极，具有高介电强度，大断流和非焊接特性。 电极由含有20重量％以下的稀土金属如镧，铈或这些稀土金属与另一种稀土金属的合金的20重量％以下的金属的铸造合金构成，10重量％以下的金属 例如具有比铜低的熔点和更高的蒸气压的铅和铋，以及0.1-30wt％的铁基金属。 稀土金属的一部分和具有比铜低的熔点和较高蒸气压的金属的一部分在晶界和铜的晶粒中结晶。

公开(公告)号：US4254548A

公开(公告)日：1981-03-10

申请号：US37025

申请日：1979-05-08

申请人： Hideo Arakawa ,  Keiichi Kuniya ,  Masabumi Ohashi

发明人： Hideo Arakawa ,  Keiichi Kuniya ,  Masabumi Ohashi

IPC分类号： C22C49/00 ,  H01L21/48 ,  H01L21/52 ,  H01L23/492 ,  H01R43/02

CPC分类号： H01L23/4928 ,  H01L21/4871 ,  H01L2924/0002 ,  Y10T29/49213

摘要： A bundle of carbon fibers each coated with copper or copper alloy is uniformly wound around a core rod under tension, and subjected to a hot press treatment in a non-oxidizing atmosphere. The core rod is then cut off along the surface of a plate formed by the hot-press to form a supporting electrode plate for a semiconductor device. The electrode plate thus fabricated incorporates therein carbon fibers in a spiral and concentric circular array around the core rod.

摘要翻译： 各自涂覆有铜或铜合金的一束碳纤维在张力下均匀地缠绕在芯棒上，并在非氧化气氛中进行热压处理。 然后沿着由热压机形成的板的表面切断芯棒，以形成用于半导体器件的支撑电极板。 如此制造的电极板在其中包含围绕芯棒的螺旋和同心圆形阵列中的碳纤维。

公开(公告)号：US4231814A

公开(公告)日：1980-11-04

申请号：US013807

申请日：1979-02-22

申请人： Ryuji Watanabe ,  Hideo Arakawa ,  Keiichi Kuniya

发明人： Ryuji Watanabe ,  Hideo Arakawa ,  Keiichi Kuniya

IPC分类号： H01H1/02 ,  C21D1/44

CPC分类号： H01H1/0203 ,  Y10T29/49105

摘要： A method of producing a vacuum circuit breaker, the breaker contacts of which are made of a cast alloy which contains copper or a copper alloy as its main component and, as the sub-component, a metal having a lower melting point and a higher vapor pressure than the main component and having a solubility limit to the main component at room temperature, e.g. lead, bismuth or an alloy of lead and bismuth, the sub-component being contained in excess of said solubility limit. The cast alloy is heated at a temperature not lower than 800.degree. C. but not so high as to cause a melting of the cast alloy, in a vacuum atmosphere which ranges in a pressure between 10.sup.-4 and 10.sup.-6 Torr, before the alloy is mounted as the breaker contacts in the vacuum circuit breaker. A plastic working may be imparted to the cast alloy before the mounting, by, for example, forging. Further, a second heat treatment may be effected on the cast alloy to which the plastic working has been imparted, under the same condition as the first heating. The heating is effective in promoting the spheroidization of the sub-component, and contributes to the prevention of exudation of sub-component to the surface of the breaker contact.

摘要翻译： 一种制造真空断路器的方法，其断路器触点由含有铜或铜合金作为其主要成分的铸造合金制成，并且作为副组分，具有较低熔点和较高蒸气的金属 压力高于主要组分，并且在室温下具有对主要组分的溶解度极限，例如 铅，铋或铅和铋的合金，所述子成分含有超过所述溶解度极限。 将铸造合金在不低于800℃的温度下加热，但不高于在10-4和10-6托之间的压力范围内的真空气氛中引起熔融的铸造合金， 合金作为断路器触点安装在真空断路器中。 可以通过例如锻造在安装之前对铸造合金施加塑性加工。 此外，在与第一加热相同的条件下，可以对已经施加塑性加工的铸造合金进行第二热处理。 加热有利于促进副成分的球化，有助于防止副成分向断路器接触面的渗出。