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公开(公告)号：US5046110A
公开(公告)日：1991-09-03
申请号：US173322
申请日：1988-03-25
申请人： Lori A. Carucci , Don J. Weeks , William G. Manns
发明人： Lori A. Carucci , Don J. Weeks , William G. Manns
IPC分类号： G06T7/00
CPC分类号： G06T7/001 , G03F7/7065 , G06T7/0002 , G06T2207/20021 , G06T2207/30141 , G06T2207/30148
摘要： A laser pattern inspection and/or writing system which writes or inspects a pattern on a target on a stage, by raster scanning the target pixels. Inspection can also be done by substage illumination with non-laser light. A database, organized into frames and strips, represents an ideal pattern as one or more polygons. Each polygon's data description is contained within a single data frame. The database is transformed into a turnpoint polygon representation, then a left and right vector representation, then an addressed pixel representation, then a bit-mapped representation of the entire target. Most of the transformations are carried out in parallel pipelines. Guardbands around polygon sides are used for error filtering during inspection. Guardbands are polygons, and frames containing only guardband information are sent down dedicated pipelines. Error filtering also is done at the time of pixel comparisons of ideal with real patterns, and subsequently during defect area consolidation. Defect areas are viewed as color overlays of ideal and actual target areas, from data generated during real time. Defect areas can be de-zoomed to allow larger target areas to be viewed. An autofocus keeps the scanning laser beam in focus on the target. The inspection system is used to find fiducial marks to orient the target prior to raster scanning. IC bars are provided with alignment marks for locating each IC bar. Interferometers or glass scale encoders allow the stage position to be known.
摘要翻译： 激光图案检查和/或写入系统，其通过光栅扫描目标像素来写入或检查在舞台上的目标上的图案。 检查也可以通过非激光的分层照明进行。 组织成框架和条带的数据库表示作为一个或多个多边形的理想模式。 每个多边形的数据描述都包含在单个数据帧中。 将数据库转换为转折点多边形表示，然后转换为左和右向量表示，然后转换为寻址像素表示，然后是整个目标的位映射表示。 大多数转换是在并行管道中进行的。 多边形周围的保护带用于检查过程中的错误过滤。 保卫带是多边形，仅包含保护带信息的帧被发送到专用管道。 在理想与实际图案的像素比较时，随后在缺陷区域合并期间，也进行误差滤波。 缺陷区域被视为理想和实际目标区域的颜色叠加，从实时生成的数据。 缺陷区域可以去放大，以允许查看较大的目标区域。 自动对焦将扫描激光束保持在目标上。 检查系统用于在光栅扫描之前找到基准标记来定向目标。 IC条具有用于定位每个IC条的对准标记。 干涉仪或玻璃刻度尺可以让舞台位置知道。
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公开(公告)号：US5095447A
公开(公告)日：1992-03-10
申请号：US617446
申请日：1990-11-21
申请人： William G. Manns , Anthony B. Wood
发明人： William G. Manns , Anthony B. Wood
IPC分类号： G01R31/308 , H04N1/04
CPC分类号： G01R31/308 , H04N1/04 , H04N2201/0426 , Y10S715/965
摘要： A laser pattern inspection and/or writing system which writes or inspects a pattern on a target on a stage, by raster scanning the target pixels. Inspection can also be done by substage illumination with non-laser light. A database, organized into frames and strips, represents an ideal pattern as one or more polygons. Each polygon's data description is contained within a single data frame. The database is transformed into a turnpoint polygon representation, then a left and right vector representation, then an addressed pixel representation, then a bit-mapped representation of the entire target. Most of the transformations are carried out in parallel pipelines. Guardbands around polygon sides are used for error filtering during inspection. Guardbands are polygons, and frames containing only guardband information are sent down dedicated pipelines. Error filtering also is done at the time of pixel comparisons of ideal with real patterns, and subsequently during defect area consolidation. Defect areas are viewed as color overlays of ideal and actual target areas, from data generated during real time. Defect areas can be de-zoomed to allow larger target areas to be viewed. An autofocus keeps the scanning laser beam in focus on the target. The inspection system is used to find fiducial marks to orient the target prior to raster scanning. IC bars are provided with alignment marks for locating each IC bar. Interferometers or glass scale encoders allow the stage position to be known.
摘要翻译： 激光图案检查和/或写入系统，其通过光栅扫描目标像素来写入或检查在舞台上的目标上的图案。 检查也可以通过非激光的分层照明进行。 组织成框架和条带的数据库表示作为一个或多个多边形的理想模式。 每个多边形的数据描述都包含在单个数据帧中。 将数据库转换为转折点多边形表示，然后转换为左和右向量表示，然后转换为寻址像素表示，然后是整个目标的位映射表示。 大多数转换是在并行管道中进行的。 多边形周围的保护带用于检查过程中的错误过滤。 保卫带是多边形，仅包含保护带信息的帧被发送到专用管道。 在理想与实际图案的像素比较时，随后在缺陷区域合并期间，也进行误差滤波。 缺陷区域被视为理想和实际目标区域的颜色叠加，从实时生成的数据。 缺陷区域可以去放大，以允许查看较大的目标区域。 自动对焦将扫描激光束保持在目标上。 检查系统用于在光栅扫描之前找到基准标记来定向目标。 IC条具有用于定位每个IC条的对准标记。 干涉仪或玻璃刻度尺可以让舞台位置知道。
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公开(公告)号：US4912487A
公开(公告)日：1990-03-27
申请号：US173775
申请日：1988-03-25
CPC分类号： G03F7/70633 , B23K26/0853 , G01N21/956 , G03F7/704 , G03F7/70641 , G03F7/70725 , G01N21/9501
摘要： A laser pattern inspection and/or writing system which writes or inspects a pattern on a target on a stage, by raster scanning the target pixels. Inspection can also be done by substage illumination with non-laser light. A database, organized into frames and strips, represents an ideal pattern as one or more polygons. Each polygon's data description is contained within a single data frame. The database is transformed into a turnpoint polygon representation, then a left and right vector representation, then an addressed pixel representation, then a bit-mapped representation of the entire target. Most of the transformations are carried out in parallel pipelines. Guardbands around polygon sides are used for error filtering during inspection. Guardbands are polygons, and frames containing only guardband information are sent down dedicated pipelines. Error filtering also is done at the time of pixel comparisons of ideal with real patterns, and subsequently during defect area consolidation. Defect areas are viewed as color overlays of ideal and actual target areas, from data generated during real time. Defect areas can be de-zoomed to allow larger target areas to be viewed. An autofocus keeps the scanning laser beam in focus on the target. The inspection system is used to find fiducial marks to orient the target prior to raster scanning. IC bars are provided with alignment marks for locating each IC bar. Interferometers or glass scale encoders allow the stage position to be known.
摘要翻译： 激光图案检查和/或写入系统，其通过光栅扫描目标像素来写入或检查在舞台上的目标上的图案。 检查也可以通过非激光的分层照明进行。 组织成框架和条带的数据库表示作为一个或多个多边形的理想模式。 每个多边形的数据描述都包含在单个数据帧中。 将数据库转换为转折点多边形表示，然后转换为左和右向量表示，然后转换为寻址像素表示，然后是整个目标的位映射表示。 大多数转换是在并行管道中进行的。 多边形周围的保护带用于检查过程中的错误过滤。 保卫带是多边形，仅包含保护带信息的帧被发送到专用管道。 在理想与实际图案的像素比较时，随后在缺陷区域合并期间，也进行误差滤波。 缺陷区域被视为理想和实际目标区域的颜色叠加，从实时生成的数据。 缺陷区域可以去放大，以允许查看较大的目标区域。 自动对焦将扫描激光束保持在目标上。 检查系统用于在光栅扫描之前找到基准标记来定向目标。 IC条具有用于定位每个IC条的对准标记。 干涉仪或玻璃刻度尺可以让舞台位置知道。
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公开(公告)号：US4160310A
公开(公告)日：1979-07-10
申请号：US746910
申请日：1976-12-02
申请人： William G. Manns
发明人： William G. Manns
CPC分类号： H01J9/14 , H01J31/125 , H01J2329/00
摘要： A metal-dielectric electron beam scanning stack and method for making the same is disclosed. The electron beam scanning stack subassembly is fabricated from a series of metal plates, each having a plurality of apertures defined therein at least one plate comprising a spacer plate. Individual apertures are aligned with corresponding apertures of all other plates to form a plurality of electron beam channels. These plates are electrically isolated from and bonded together by spacer plates coated with dielectric material. By etching isolation channels in a selected pattern in these plates, control plates are fabricated having a plurality of isolated conductive portions arranged in selected patterns. Subassemblies are bonded together using either dielectric material or dielectrically coated metal spacer plates having a plurality of correspondingly aligned apertures. Contact leads from the plurality of isolated conductive portions are isolation etched into the inactive peripheral area of the plate. These leads extend along the periphery of the plate where they terminate in the form of multiple contact means protruding from the edge of the plate.
摘要翻译： 公开了一种金属 - 电介质电子束扫描堆叠及其制造方法。 电子束扫描堆叠子组件由一系列金属板制成，每个金属板具有限定在其中的多个孔，其中至少一个板包括间隔板。 单独的孔与所有其它板的相应孔对准以形成多个电子束通道。 这些板通过用电介质材料涂覆的间隔板电隔离并且结合在一起。 通过在这些板中蚀刻选定图案中的隔离通道，制造具有以选定图案排列的多个隔离导电部分的控制板。 子组件使用介电材料或具有多个相应对准的孔的介电涂覆的金属间隔板结合在一起。 来自多个隔离导电部分的接触引线被隔离蚀刻到板的不活动外围区域中。 这些引线沿着板的周边延伸，其中它们以从板的边缘突出的多个接触装置的形式终止。
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公开(公告)号：US4546406A
公开(公告)日：1985-10-08
申请号：US602792
申请日：1984-05-07
IPC分类号： H01L21/48 , H01L23/14 , H01L23/538 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/42 , H05K3/46
CPC分类号： C03C29/00 , C03C8/02 , H01L21/4857 , H01L23/142 , H01L23/538 , H05K1/0207 , H05K1/053 , H05K3/202 , H05K3/4629 , H05K3/4641 , H01L2224/48247 , H01L2224/49171 , H01L24/48 , H01L24/49 , H01L2924/00014 , H01L2924/01014 , H01L2924/01025 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/14 , H05K1/0206 , H05K1/0306 , H05K2201/068 , H05K2201/09054 , H05K2201/09309 , H05K2201/09781 , H05K2201/10969 , H05K2203/0323 , H05K2203/0369 , H05K2203/1476 , H05K3/429 , H05K3/4611 , Y10T428/12528
摘要： An electronic circuit interconnection system provides high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.
摘要翻译： 电子电路互连系统提供高密度安装陶瓷芯片载体集成电路器件或其他射束引线，双列直插（DIP），带自动键合（TAB），倒装芯片或直接安装的直流 在具有高散热特性的经济，尺寸稳定的互连基板上具有引线接合互连件的装置等。 衬底具有熔合到蚀刻金属图案上并且相对于金属图案成比例的玻璃成分，使得衬底的热膨胀特性对应于直流电的那些。 保持i.c.之间的债券完整性的设备。 引线和电路路径，使基板具有足够的散热特性，以允许高密度直流电。 安装。 这些基板在被选择厚度的多金属层压金属板中的蚀刻图案中包含电路路径，器件安装焊盘，边缘端子，引脚安装孔和其它典型的衬底特征，其在一侧或两侧上用与玻璃板熔合的玻璃料一起涂覆。 在需要多于一层的基材的情况下，玻璃涂覆的板堆叠，销钉安装孔等对齐，并且玻璃涂层熔合在一起。 金属通孔在需要时延伸穿过玻璃涂层以互连基底的金属层。
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公开(公告)号：US4472762A
公开(公告)日：1984-09-18
申请号：US438137
申请日：1982-11-01
IPC分类号： H01L21/48 , H01L23/14 , H01L23/538 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/42 , H05K3/46 , H05K1/09
CPC分类号： H05K3/4629 , H01L21/4857 , H01L23/142 , H01L23/538 , H05K1/0207 , H05K1/053 , H05K3/202 , H05K3/4641 , H01L2224/49171 , H01L2924/09701 , H05K1/0206 , H05K1/0306 , H05K2201/068 , H05K2201/09054 , H05K2201/09309 , H05K2201/09781 , H05K2201/10969 , H05K2203/0323 , H05K2203/0369 , H05K2203/1476 , H05K3/429 , H05K3/4611
摘要： An electronic circuit interconnection system provides high density mounting on ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like on an economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.
摘要翻译： 电子电路互连系统提供高密度安装在陶瓷芯片载体集成电路器件或其他射束引线，双列直插式（DIP），带自动键合（TAB），倒装芯片或直接安装的直流电。 在具有高散热特性的经济，尺寸稳定的互连基板上具有引线接合互连件的装置等。 衬底具有熔合到蚀刻金属图案上并且相对于金属图案成比例的玻璃成分，使得衬底的热膨胀特性对应于直流电的那些。 保持i.c.之间的债券完整性的设备。 引线和电路路径，使基板具有足够的散热特性，以允许高密度直流电。 安装。 这些基板在被选择厚度的多金属层压金属板中的蚀刻图案中包含电路路径，器件安装焊盘，边缘端子，引脚安装孔和其它典型的衬底特征，其在一侧或两侧上用与玻璃板熔合的玻璃料一起涂覆。 在需要多于一层的基材的情况下，玻璃涂覆的板堆叠，销钉安装孔等对齐，并且玻璃涂层熔合在一起。 金属通孔在需要时延伸穿过玻璃涂层以互连基底的金属层。
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公开(公告)号：US4385202A
公开(公告)日：1983-05-24
申请号：US191039
申请日：1980-09-25
IPC分类号： H05K1/18 , H01L21/48 , H01L23/14 , H01L23/538 , H05K1/00 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/06 , H05K3/20 , H05K3/42 , H05K3/46 , H05K1/09
CPC分类号： H05K3/4641 , H01L21/4857 , H01L23/142 , H01L23/538 , H01L23/5383 , H05K1/0207 , H05K1/053 , H05K3/06 , H05K3/202 , H05K3/4629 , H01L2224/48227 , H01L2224/48472 , H01L2224/49171 , H01L2924/09701 , H05K1/0206 , H05K1/0306 , H05K2201/068 , H05K2201/09054 , H05K2201/09309 , H05K2201/09781 , H05K2201/10969 , H05K2203/0323 , H05K2203/0369 , H05K2203/1476 , H05K3/429 , H05K3/4611
摘要： An electronic circuit interconnection system permitting high density mounting of ceramic chip-carrier integrated circuit devices or other beam-lead, dual-in-line (DIP), tape-automated-bonded (TAB), flip-chip, or direct-mounted i.c. devices with wire-bonded interconnects or the like has economical, dimensionally-stable, interconnection substrate which has high heat dissipating properties. The substrate has glass components which are fused onto etched metal patterns and which are proportioned relative to the metal patterns so that the heat-expansion properties of the substrate correspond to those of the i.c. devices to maintain bond integrity between the i.c. leads and circuit paths on the substrate and so that the substrate has sufficient heat-dissipating properties to permit the high density i.c. mounting. The substrates incorporate circuit paths, device mounting pads, edge terminals, pin mounting holes and other typical substrate features in the etched patterns in multimetal laminated metal plates of selected thickness which are coated on one or both sides with glass frit fused to the plates. Where substrates with more than one layer are desired, glass-coated plates are stacked with pin mounting holes and the like aligned and the glass coatings are fused together. Metal vias extend through the glass coatings where desired to interconnect metal layers of the substrate.
摘要翻译： 一种电子电路互连系统，允许陶瓷芯片载体集成电路器件或其他射束引线，双列直插（DIP），带自动键合（TAB），倒装芯片或直接安装的直流安装的高密度安装。 具有导线接合互连件的装置等具有经济的尺寸稳定的互连基板，其具有高的散热性能。 衬底具有熔合到蚀刻金属图案上并且相对于金属图案成比例的玻璃成分，使得衬底的热膨胀特性对应于直流电的那些。 保持i.c.之间的债券完整性的设备。 引线和电路路径，使基板具有足够的散热特性，以允许高密度直流电。 安装。 这些基板在被选择厚度的多金属层压金属板中的蚀刻图案中包含电路路径，器件安装焊盘，边缘端子，引脚安装孔和其它典型的衬底特征，其在一侧或两侧上用与玻璃板熔合的玻璃料一起涂覆。 在需要多于一层的基材的情况下，玻璃涂覆的板堆叠，销钉安装孔等对齐，并且玻璃涂层熔合在一起。 金属通孔在需要时延伸穿过玻璃涂层以互连基底的金属层。
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公开(公告)号：US4135281A
公开(公告)日：1979-01-23
申请号：US746909
申请日：1976-12-02
申请人： William G. Manns
发明人： William G. Manns
CPC分类号： H01J9/02 , H01J29/467
摘要： A metal-dielectric electron beam scanning stack and method for making the same is disclosed. The electron beam scanning stack subassembly is fabricated from at least a pair of metal plates, each having a plurality of apertures defined therein. Individual apertures are aligned with corresponding apertures of the other plate to form a plurality of electron beam channels. These plates are electrically isolated from and bonded to each other by a layer of dielectric material without the use of a spacer plate. By etching isolation channels in each of these plates in a selected pattern, control plates are fabricated having a plurality of isolated conductive portions arranged in selected patterns. These subassemblies are bonded together using either dielectric material or dielectrically coated metal spacer plates having a plurality of corresponding aligned apertures. Contact leads from the plurality of isolated conductive portions are isolation etched into the inactive peripheral area of the plate. These leads extend along the periphery of the plate where they terminate in the form of multiple contact means protruding from the edge of the plate.
摘要翻译： 公开了一种金属 - 电介质电子束扫描堆叠及其制造方法。 电子束扫描堆叠子组件由至少一对金属板制成，每个金属板具有限定在其中的多个孔。 单独的孔与另一个板的相应孔对准以形成多个电子束通道。 这些板通过介电材料层彼此电隔离并且彼此结合，而不使用间隔板。 通过以选定的图案蚀刻每个这些板中的隔离通道，制造具有以选定图案排列的多个隔离导电部分的控制板。 这些子组件使用电介质材料或具有多个对应的对准的孔的介电涂覆的金属间隔板结合在一起。 来自多个隔离导电部分的接触引线被隔离蚀刻到板的不活动外围区域中。 这些引线沿着板的周边延伸，其中它们以从板的边缘突出的多个接触装置的形式终止。
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公开(公告)号：US4008950A
公开(公告)日：1977-02-22
申请号：US593409
申请日：1975-07-07
CPC分类号： G02F1/161 , G02F1/1533
摘要： An electrochromic display cell having a transparent front panel with an internal conductive coating providing a pleasing external appearance, and masking a counter-electrode affixed thereto; said internal coating having a window area to permit external viewing of display electrodes affixed to the back panel, which is sealed to the front panel with a ring spacer to provide an electrolyte chamber about five to ten mils thick; external electrode contacts to the electrical leads to the display electrodes are arranged on the back or front panel.
摘要翻译： 一种电致变色显示单元，具有具有内部导电涂层的透明前面板，提供令人愉快的外观，并且掩蔽附着在其上的对电极; 所述内部涂层具有窗口区域，以允许外部观察固定到后面板的显示电极，所述显示电极用环形间隔件密封到前面板，以提供约5至10密耳厚的电解质室; 与显示电极的电引线的外部电极接触设置在背面或前面板上。
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