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公开(公告)号：US20180084636A1
公开(公告)日：2018-03-22
申请号：US15712071
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： David A. PAKULA , Daniel W. JARVIS , Gregory N. STEPHENS , Ian A. SPRAGGS , Vu Thanh VO , Amir SALEHI , Dennis R. PYPER , Alex J. CRUMLIN , Corey S. PROVENCHER , Derek J. WALTERS , Michael V. YEH
CPC classification number: H05K7/20481 , B32B2307/302 , B32B2457/20 , G06F1/1637 , G06F1/1643 , G06F3/0412 , G06F3/0414 , G06F3/044 , G06F2203/04112 , H01M2/08 , H01M2/1016 , H01M2/1022 , H01M2220/30 , H02J7/0042 , H05K1/0216 , H05K1/144 , H05K1/148 , H05K7/20963 , H05K9/0033 , H05K2201/042 , H05K2201/10242 , H05K2201/10257
Abstract: A circuit board assembly in an electronic is disclosed. To conserve space in the electronic device, the circuit board assembly includes stacked circuit boards in electrical communication with each other, such as a first circuit board stacked over a second circuit board. Each circuit board may include multiple surfaces that carry operational components. Moreover, the first circuit board may include a first surface and the second circuit board may include a second surface facing the first surface. The first and second surfaces may include operational components in corresponding locations. Also, the operational components may include corresponding shapes such that one component is positioned in another component. The components may electrically connect to each other. Also, the circuit board assembly may include EMI shields around an outer perimeter in order to shield the operational components form EMI and to components in the electronic device from EMI emanating from the operational components.
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公开(公告)号：US20150351273A1
公开(公告)日：2015-12-03
申请号：US14821620
申请日：2015-08-07
Applicant: Apple Inc.
Inventor： Bryan P. KIPLE , Charles B. WOODHULL , David A. PAKULA , Tang Y. TAN
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
Abstract translation: 公开了电子设备外壳的各种部件及其组装方法。 壳体可以通过将两个或更多个不同部分组装并连接在一起而形成。 壳体的部分可以使用一个或多个联接构件联接在一起。 联接构件可以使用双射模制工艺来形成，其中第一射击形成联接构件的结构部分，并且第二射击形成联接构件的化妆品部分。
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13.发明申请公开(公告)号：US20220417394A1
公开(公告)日：2022-12-29
申请号：US17823495
申请日：2022-08-30
Applicant: Apple Inc.
Inventor： Ashley E. FLETCHER , David A. PAKULA , Daniel W. JARVIS , Jared M. KOLE
IPC: H04N5/225 , G06F3/03 , G06T7/55 , H04N5/372 , G01B11/25 , H04N13/25 , G06F1/16 , G06F1/20 , G06V10/75 , G06V20/64 , G06V30/144 , G06V40/16
Abstract: An electronic device that includes a vision system carried by a bracket assembly is disclosed. The vision system may include a first camera module that captures an image of an object, a light emitting element that emits light rays toward the object, and a second camera module that receives light rays reflected from the object. The light rays may include infrared light rays. The bracket assembly is designed not only carry the aforementioned modules, but to also maintain a predetermined and fixed separation between the modules. The bracket assembly may form a rigid, multi-piece bracket assembly to prevent bending, thereby maintaining the predetermined separation. The electronic device may include a transparent cover designed to couple with a housing. The transparent cover incudes an alignment module designed to engage a module and provide a moving force that aligns the bracket assembly and the modules to a desired location in the housing.
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公开(公告)号：US20190171251A1
公开(公告)日：2019-06-06
申请号：US16269507
申请日：2019-02-06
Applicant: Apple Inc.
Inventor： Ashley E. FLETCHER , David A. PAKULA , Daniel W. JARVIS , Jared M. KOLE
Abstract: An electronic device that includes a vision system carried by a bracket assembly is disclosed. The vision system may include a first camera module that captures an image of an object, a light emitting element that emits light rays toward the object, and a second camera module that receives light rays reflected from the object. The light rays may include infrared light rays. The bracket assembly is designed not only carry the aforementioned modules, but to also maintain a predetermined and fixed separation between the modules. The bracket assembly may form a rigid, multi-piece bracket assembly to prevent bending, thereby maintaining the predetermined separation. The electronic device may include a transparent cover designed to couple with a housing. The transparent cover incudes an alignment module designed to engage a module and provide a moving force that aligns the bracket assembly and the modules to a desired location in the housing.
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公开(公告)号：US20180084680A1
公开(公告)日：2018-03-22
申请号：US15712069
申请日：2017-09-21
Applicant: Apple Inc.
Inventor： Daniel W. JARVIS , David A. PAKULA , David J. DUNSMOOR , Ian A. SPRAGGS , Lee E. HOOTON , Marwan RAMMAH , Matthew D. HILL , Robert F. MEYER , James A. BERTIN , Eric M. BENNETT , Simon C. HELMORE , Melissa A. WAH , Jon F. HOUSOUR , Douglas G. FOURNIER , Christopher S. TOMASETTA
IPC: H05K7/20
CPC classification number: H05K7/20481 , B32B2307/302 , B32B2457/20 , G06F1/1637 , G06F1/1643 , G06F3/0412 , G06F3/0414 , G06F3/044 , G06F2203/04112 , H01M2/08 , H01M2/1016 , H01M2/1022 , H01M2220/30 , H02J7/0042 , H05K1/0216 , H05K1/144 , H05K7/20963
Abstract: A thermal distribution assembly for an electronic device is disclosed. The electronic device includes an enclosure defined by a metal band and a non-metal bottom wall formed by glass, sapphire, or plastic. In this regard, the enclosure may include a relatively low thermal conductivity. However, the thermal distribution assembly provides heat transfer capabilities that offset thermal conductivity losses by using a non-metal bottom wall, and also provides added structural support. The thermal distribution assembly may include a first layer, a second layer, and a third layer. The first and third layers provide structural support, while the second layer provides a relatively high thermally conductive layer. The thermal distribution assembly includes sidewalls engaging and thermally coupling to the metal band, allowing the thermal distribution assembly to draw heat from a heat-generating component, and pass the heat to the metal band while minimizing or preventing temperature increases along the non-metal bottom wall.
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Patent Agency Ranking
公开(公告)号：US20170063420A1
公开(公告)日：2017-03-02
申请号：US14842728
申请日：2015-09-01
Applicant: Apple Inc.
Inventor： Ashutosh Y. SHUKLA , Sawyer I. COHEN , Scott A. MYERS , David A. PAKULA
IPC: H04B1/3888 , H04M1/02
CPC classification number: H04B1/3888 , G06F1/16 , H04M1/026 , H04M1/0266 , H04M1/18
Abstract: An electronic device that includes a deformable feature designed to seal two or more parts of the electronic device is disclosed. The deformable feature may be designed to deform, in response to a force applied to the deformable feature, with little or no compression. The deformable feature may include a cavity or relief volume extending along the deformable feature to define a space or void in the deformable feature. In response to a force, the deformable feature may deform such that a material (or materials) defining the deformable feature occupies or extends into the space or void, or in a location previously occupied by the space or void. The deformable feature may provide a protective seal between two or more parts that prevents ingress of contaminants, such as a liquid.
Abstract translation: 公开了一种包括设计成密封电子设备的两个或多个部分的可变形特征的电子设备。 可变形特征可以被设计成响应于施加到可变形特征的力而变形，几乎没有或没有压缩。 可变形特征可以包括沿着可变形特征延伸的空腔或释放空间，以限定可变形特征中的空间或空隙。 响应于力，可变形特征可以变形，使得限定可变形特征的材料（或材料）占据或延伸到空间或空隙中，或在先前由空间或空隙占据的位置。 可变形特征可以在两个或更多个部件之间提供防止密封，防止诸如液体的污染物进入。
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公开(公告)号：US20170054129A1
公开(公告)日：2017-02-23
申请号：US14832989
申请日：2015-08-21
Applicant: Apple Inc.
Inventor： Richard A. BESEN , David A. PAKULA , Gregory N. STEPHENS
CPC classification number: H01M2/30 , G06F1/26 , H01M2/1016 , H01M2/1066 , H01M10/4257
Abstract: This application relates to batteries that are capable of routing signals that are separate from the charge supplied by the batteries. In some embodiments, a battery can incorporate a conductive trace that extends through a portion of the battery to allow for signals to be routed through the battery, as opposed to around the battery. The conductive trace can be a single wire, multiple wires, a coaxial trace, optical cable, or any other mechanism for allowing a signal to be transmitted between one or more components. By providing the conductive trace within the battery, shorter pathways to components can be created thereby reducing signal or power loss over the pathways.
Abstract translation: 本申请涉及能够路由与电池提供的电荷分离的信号的电池。 在一些实施例中，电池可以包括延伸穿过电池的一部分的导电迹线，以允许信号通过电池被路由，而不是电池周围。 导电迹线可以是单线，多条线，同轴线，光缆或用于允许信号在一个或多个部件之间传输的任何其它机构。 通过在电池内提供导电迹线，可以创建到组件的较短路径，从而减少路径上的信号或功率损耗。
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公开(公告)号：US20160380663A1
公开(公告)日：2016-12-29
申请号：US15263259
申请日：2016-09-12
Applicant: Apple Inc.
Inventor： Ashutosh Y. SHUKLA , Tyler B. CATER , Sawyer I. COHEN , Edward S. HUO , David A. PAKULA , Benjamin Shane BUSTLE , Dhaval N. SHAH , Yaocheng ZHANG , Vivek KATIYAR
IPC: H04B1/3888 , H04M1/02
CPC classification number: H04B1/3888 , H01H13/06 , H01H2205/016 , H01H2207/032 , H01H2213/00 , H01H2213/002 , H01H2213/016 , H01H2223/002 , H04B2001/3894 , H04M1/0249 , H04M1/026 , H04M1/236
Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.
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公开(公告)号：US20160330852A1
公开(公告)日：2016-11-10
申请号：US15217605
申请日：2016-07-22
Applicant: Apple Inc.
Inventor： Lucy Elizabeth BROWNING , Charles B. WOODHULL , Bryan Patrick KIPLE , David A. PAKULA , Tang Yew TAN , Julie HANCHAK-CONNORS , John Murray THORNTON, III , Thomas JOHANNESSEN , Peter RUSSELL-CLARKE , Masashige TATEBE , Napthaneal Y. TAN
CPC classification number: H05K5/04 , B23C5/00 , B23C5/1081 , B23C2220/04 , B23C2220/16 , B23C2220/20 , B23C2220/28 , B23C2220/48 , B23C2226/31 , B23C2226/315 , B23P11/00 , B23P17/00 , B23P17/02 , C25D7/00 , C25D11/02 , C25D11/022 , C25D11/12 , C25D11/246 , C25D11/34 , G03F1/38 , H01Q1/243 , H01Q1/42 , H04M1/0249 , H04M1/0254 , H04M1/11 , H05K5/02 , H05K5/0217 , H05K5/0243 , H05K5/0247 , H05K5/03 , H05K13/00 , Y10T29/47 , Y10T29/49002 , Y10T29/49826 , Y10T156/10 , Y10T156/1064 , Y10T407/1906 , Y10T409/300896 , Y10T409/303752 , Y10T409/30952
Abstract: Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.
Abstract translation: 描述了用于形成保护和美容地增强金属表面的阳极氧化层的方法和结构。 在一些实施方案中，方法包括在下面的金属上形成阳极氧化层，其允许下面的金属表面是可见的。 在一些实施例中，方法包括在倾斜表面上形成第一阳极氧化层和相邻的第二阳极氧化层，两个阳极氧化层之间的界面是规则的和均匀的。 描述的是光掩模技术和工具，用于在金属表面上阳极化和纹理化图案上提供锐利定义的角。 还描述了在电子设备的制造中提供耐阳极化部件的技术和工具。
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公开(公告)号：US20230211625A1
公开(公告)日：2023-07-06
申请号：US18183825
申请日：2023-03-14
Applicant: Apple Inc.
Inventor： Bryan P. KIPLE , Charles B. WOODHULL , David A. PAKULA , Tang Y. TAN
IPC: H04M1/02
CPC classification number: H04M1/0249
Abstract: Various components of an electronic device housing and methods for their assembly are disclosed. The housing can be formed by assembling and connecting two or more different sections together. The sections of the housing may be coupled together using one or more coupling members. The coupling members may be formed using a two-shot molding process in which the first shot forms a structural portion of the coupling members, and the second shot forms cosmetic portions of the coupling members.
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