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公开(公告)号：US20170301926A1
公开(公告)日：2017-10-19
申请号：US15339168
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Dimitrios Argyris , Byung-Sung Kwak , Lizhong Sun , Giback Park
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A method for masklessly fabricating a thin film battery, including securing a substrate to a substrate carrier of a first deposition chamber with a first clamping ring having an aperture, performing a first deposition on the substrate to form a first TFB layer, the aperture of the first clamping ring defining a footprint of the first layer, wherein areas of the substrate covered by the first clamping ring are excluded from the first blanket deposition, securing the substrate to a substrate carrier of a second deposition chamber with a second clamping ring having an aperture, and performing a second deposition on the substrate to form a second TFB layer over the first layer, the aperture of the second clamping ring defining a footprint of the second layer, wherein areas of the substrate and the first layer covered by the second clamping ring are excluded from the second blanket deposition.
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公开(公告)号：US20170301894A1
公开(公告)日：2017-10-19
申请号：US15462209
申请日：2017-03-17
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Lizhong Sun , Giback Park , Michael Yu-Tak Young , Jeffrey L. Franklin , Miaojun Wang , Dimitrios Argyris
IPC: H01M2/02
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A thin film device. The thin film device may include: an active device region, the active device region comprising a diffusant; and a thin film encapsulant disposed adjacent to the active device region and encapsulating at least a portion of the active device region, the thin film encapsulant comprising: a first layer, the first layer disposed immediately adjacent the active device region and comprising a soft and pliable material; and a second layer disposed on the first layer, the second layer comprising a rigid dielectric material or rigid metal material.
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公开(公告)号：US20170301956A1
公开(公告)日：2017-10-19
申请号：US15338996
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Byung-Sung Kwak
IPC: H01M10/0585 , H01M2/08 , H01M2/02 , H01M10/04 , H01M10/0525
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A device. The device may include: a substrate, the substrate comprising: an upper surface; and a recess extending from the upper surface into the substrate; an active device region, the active device region disposed within the recess and having a first thickness; and an encapsulant, the encapsulant disposed over the recess and over the active device region, wherein the encapsulant has a second thickness, wherein the encapsulant extends above the upper surface of the substrate to a first distance, and wherein the first distance is less than a sum of the first thickness and second thickness.
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Patent Agency Ranking
公开(公告)号：US20170301954A1
公开(公告)日：2017-10-19
申请号：US15338969
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Lizhong Sun , Giback Park , Dimitrios Argyris , Michael Yu-Tak Young , Jeffrey L. Franklin
IPC: H01M10/0585 , H01M2/08 , H01M2/02 , H01M10/04 , H01M10/0525
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A thin film battery may include: a cathode current collector, the cathode current collector being disposed in a first plane; a device stack disposed on the cathode current collector, the device stack comprising an anode current collector, the anode current collector being disposed in a second plane, above the first plane; and a thin film encapsulant, the thin film encapsulant disposed above the device stack, wherein the thin film encapsulant comprises a first portion extending along a surface of the anode current collector and a second portion extending along a plurality of sides of the device stack, wherein the cathode current collector extends under the second portion of the thin film encapsulant and outside of the thin film encapsulant; and wherein the anode current collector extends under the first portion of the thin film encapsulant and outside of the thin film encapsulant.
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公开(公告)号：US09350040B2
公开(公告)日：2016-05-24
申请号：US13898912
申请日：2013-05-21
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Stefan Bangert , Dieter Haas , Omkaram Nalamasu
IPC: H01M10/04 , H01M4/62 , H01M10/052 , H01M10/0585
CPC classification number: H01M10/0404 , H01M4/621 , H01M6/40 , H01M10/052 , H01M10/0585 , Y02E60/122 , Y02P70/54 , Y10T29/52
Abstract: Methods of and factories for thin-film battery manufacturing are described. A method includes operations for fabricating a thin-film battery. A factory includes one or more tool sets for fabricating a thin-film battery.
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公开(公告)号：US10935492B2
公开(公告)日：2021-03-02
申请号：US16258392
申请日：2019-01-25
Applicant: Applied Materials, Inc.
Inventor： Avishek Ghosh , Byung-Sung Kwak , Todd Egan , Robert Jan Visser , Gangadhar Banappanavar , Dinesh Kabra
Abstract: An apparatus for determining a characteristic of a photoluminescent (PL) layer comprises: a light source that generates an excitation light that includes light from the visible or near-visible spectrum; an optical assembly configured to direct the excitation light onto a PL layer; a detector that is configured to receive a PL emission generated by the PL layer in response to the excitation light interacting with the PL layer and generate a signal based on the PL emission; and a computing device coupled to the detector and configured to receive the signal from the detector and determine a characteristic of the PL layer based on the signal.
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公开(公告)号：US20170301955A1
公开(公告)日：2017-10-19
申请号：US15338977
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Byung-Sung Kwak , Lizhong Sun , Giback Park , Dimitrios Argyris , Michael Yu-Tak Young , Jeffrey L. Franklin
IPC: H01M10/0585 , H01M2/08 , H01M2/02 , H01M10/04 , H01M10/0525
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: A thin film battery may include: a contact layer, the contact layer disposed in a first plane and comprising a cathode current collector and an anode current collector pad; a device stack disposed on the cathode current collector, the device stack comprising a cathode and solid state electrolyte; an anode current collector disposed on the device stack; a thin film encapsulant, the thin film encapsulant disposed over the device stack, wherein the solid state electrolyte encapsulates the cathode.
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公开(公告)号：US20170301895A1
公开(公告)日：2017-10-19
申请号：US15339121
申请日：2016-10-31
Applicant: Applied Materials, Inc.
Inventor： Michael Yu-Tak Young , Jeffrey L. Franklin , Byung-Sung Kwak
CPC classification number: H01M2/1094 , B23K26/0006 , B23K26/142 , B23K26/362 , B23K2101/34 , B23K2101/36 , B23K2103/172 , B29C59/16 , B29K2995/0006 , B29L2031/3468 , C23C14/34 , C23C14/50 , H01J37/32715 , H01J37/3426 , H01M2/0207 , H01M2/026 , H01M2/0267 , H01M2/0287 , H01M2/08 , H01M4/382 , H01M4/525 , H01M6/005 , H01M6/18 , H01M6/188 , H01M6/40 , H01M10/0436 , H01M10/052 , H01M10/0525 , H01M10/0585 , H01M2220/30 , H01M2300/0065 , H01M2300/0068 , Y02T10/7011
Abstract: Approaches herein provide improved encapsulation of an energy storage device. In one approach, a thin film storage device stack is formed atop a first side of a substrate, and an encapsulant is formed over the thin film storage device stack. A recess formed in the substrate adjacent the thin film storage device stack provides an anchoring point for the encapsulant. In some approaches, the recess is provided partially through a depth of the substrate, and has a geometry to promote physical coupling between the encapsulant and the substrate.
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