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    OLED panel with trench overhang structures
    16.
    发明授权
    OLED panel with trench overhang structures 有权

    公开(公告)号：US11552143B1

    公开(公告)日：2023-01-10

    申请号：US17661320

    申请日：2022-04-29

    Applicant: Applied Materials, Inc.

    Inventor： Ji-young Choung ,  Jungmin Lee ,  Chung-Chia Chen ,  Yusin Lin ,  Dieter Haas ,  Si Kyoung Kim

    IPC: H01L27/32 ,  H01L51/52

    Abstract: Embodiments described herein generally relate to sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes substrate, pixel-defining layer (PDL) structures disposed over the section of the substrate, inorganic or metal overhang structures disposed on an upper surface of the PDL structures, and a plurality of sub-pixels. The PDL structures include a trench disposed in the top surface of the PDL structure. Each sub-pixel includes an anode, an OLED material disposed over and in contact with the anode, and a cathode disposed over the OLED material. The inorganic or metal overhang structures have an overhang extension that extends laterally over the trench. An encapsulation layer is disposed over the cathode and extends under at least a portion of the inorganic or metal overhang structures and along a top surface of the PDL structures.

    Conductive oxide overhang structures for OLED devices
    17.
    发明授权
    Conductive oxide overhang structures for OLED devices 有权

    公开(公告)号：US11348983B1

    公开(公告)日：2022-05-31

    申请号：US17647214

    申请日：2022-01-06

    Applicant: Applied Materials, Inc.

    Inventor： Ji-Young Choung ,  Chung-Chia Chen ,  Yu Hsin Lin ,  Jungmin Lee ,  Dieter Haas ,  Si Kyoung Kim

    IPC: H01L27/32 ,  H01L51/52 ,  H01L51/00

    Abstract: Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in an organic light-emitting diode (OLED) display are described herein. The overhang structures are permanent to the sub-pixel circuit. The overhang structures include a conductive oxide. A first configuration of the overhang structures includes a base portion and a top portion with the top portion disposed on the base portion. In a first sub-configuration, the base portion includes the conductive oxide of at least one of a TCO material or a TMO material. In a second sub-configuration, the base portion includes a metal alloy material and the conductive oxide of a metal oxide surface. A second configuration of the overhang structures includes the base portion and the top portion with a body portion disposed between the base portion and the top portion. The body portion includes the metal alloy body and the metal oxide surface.

    Descending etching resistance in advanced substrate patterning
    19.
    发明授权
    Descending etching resistance in advanced substrate patterning 有权

    公开(公告)号：US12120925B2

    公开(公告)日：2024-10-15

    申请号：US18301805

    申请日：2023-04-17

    Applicant: Applied Materials, Inc.

    Inventor： Chung-chia Chen ,  Ji Young Choung ,  Dieter Haas ,  Yu-hsin Lin ,  Jungmin Lee ,  Wen-Hao Wu ,  Si Kyoung Kim

    IPC: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K102/00

    CPC classification number: H10K59/122 ,  H10K50/844 ,  H10K71/00 ,  H10K2102/00

    Abstract: Embodiments described herein relate to a device comprising a substrate, a pixel-defining layer (PDL) structures disposed over the substrate and defining sub-pixels of the device, and a plurality overhang structures. Each overhang structure is defined by a top structure extending laterally past a body structure. Each body structure is disposed over an upper surface of each PDL structure. Overhang structures define a plurality of sub-pixels including a first sub-pixel and a second sub-pixel. Each sub-pixel includes an anode, an organic light-emitting diode (OLED) material, a cathode, and an encapsulation layer. The OLED materials are disposed over the first anode and extends under the overhang structures. The cathodes are disposed over the OLED materials and under the overhang structures. The encapsulation layers are disposed over the first cathode. The first encapsulation layer has a first thickness and the second encapsulation layer has a second thickness different from the first thickness.

    Methods of fabricating OLED panel with inorganic pixel encapsulating barrier
    20.
    发明授权
    Methods of fabricating OLED panel with inorganic pixel encapsulating barrier 有权

    公开(公告)号：US11610952B2

    公开(公告)日：2023-03-21

    申请号：US17193347

    申请日：2021-03-05

    Applicant: Applied Materials, Inc.

    Inventor： Ji-young Choung ,  Dieter Haas ,  Yu Hsin Lin ,  Jungmin Lee ,  Seong Ho Yoo ,  Si Kyoung Kim

    IPC: H01L27/32 ,  H01L51/56 ,  H01L51/52

    Abstract: Embodiments described herein relate to sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. The device includes a plurality of sub-pixels, each sub-pixel of the plurality of sub-pixels defined by adjacent pixel-defining layer (PDL) structures with inorganic overhang structures disposed on the PDL structures, each sub-pixel having an anode, organic light-emitting diode (OLED) material disposed on the anode, and a cathode disposed on the OLED material. The device is made by a process including the steps of: depositing the OLED material and the cathode by evaporation deposition, and depositing an encapsulation layer disposed over the cathode.

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