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公开(公告)号：US20190019658A1
公开(公告)日：2019-01-17
申请号：US15651791
申请日：2017-07-17
Applicant: APPLIED MATERIALS, INC.
Inventor： Irena H. Wysok , Kirankumar Savandaiah , Anthony Chih-Tung Chan , Jiao Song , Prashant Prabhu
IPC: H01J37/34
Abstract: Embodiments of a magnetron assembly and a processing system incorporating same are provided herein. In some embodiments, a magnetron assembly includes a body extending along a central axis of the magnetron assembly; a coolant feed structure extending through the body along the central axis to provide a coolant along the central axis to an area beneath the coolant feed structure; and a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets.
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公开(公告)号：US09909206B2
公开(公告)日：2018-03-06
申请号：US15201019
申请日：2016-07-01
Applicant: APPLIED MATERIALS, INC.
Inventor： William Johanson , Kirankumar Savandaiah , Adolph Miller Allen , Xin Wang , Prashant Prabhu
CPC classification number: C23C14/3407 , C23C14/564 , H01J37/32477 , H01J37/34 , H01J37/3488
Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes a deposition ring configured to be disposed on a substrate support designed to support a substrate having a given width, including: an annular band configured to rest on a lower ledge of the substrate support; an inner lip extending upwardly from an inner edge of the annular band, wherein an inner surface of the inner lip and an inner surface of the annular band together form a central opening having a width that is less than the given width, and wherein a depth between an upper surface of the annular band and an upper surface of the inner lip is between about 24 mm and about 38 mm; a channel disposed radially outward of the annular band; and an outer lip extending upwardly and disposed radially outward of the channel.
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13.发明授权公开(公告)号：US09595464B2
公开(公告)日：2017-03-14
申请号：US14752245
申请日：2015-06-26
Applicant: APPLIED MATERIALS, INC.
Inventor： Sriskantharajah Thirunavukarasu , Kirankumar Savandaiah , Cheng-Hsiung Tsai , Kai Liang Liew
IPC: H01L21/687 , H01L21/306 , C23C16/50 , C23C14/50 , C23C16/458 , H01J37/32 , H01L21/683 , H01J37/34
CPC classification number: H01L21/67069 , C23C14/50 , C23C16/458 , C23C16/4586 , C23C16/50 , H01J37/32009 , H01J37/32082 , H01J37/32577 , H01J37/3405 , H01J2237/3321 , H01J2237/334 , H01L21/306 , H01L21/67103 , H01L21/6833 , H01L21/68742 , H01L21/68757
Abstract: Methods and apparatus for processing a substrate are disclosed herein. In some embodiments, an apparatus for processing a substrate includes: a substrate support having a substrate supporting surface including an electrically insulating coating; a substrate lift mechanism including a plurality of lift pins configured to move between a first position disposed beneath the substrate supporting surface and a second position disposed above the substrate supporting surface; and a connector configured to selectively provide an electrical connection between the substrate support and the substrate lift mechanism before the plurality of lift pins reach a plane of the substrate supporting surface.
Abstract translation: 本文公开了用于处理基底的方法和装置。 在一些实施例中，用于处理衬底的设备包括：衬底支撑件，其具有包括电绝缘涂层的衬底支撑表面; 基板升降机构，其包括多个提升销，所述多个提升销构造成在布置在所述基板支撑表面下方的第一位置和设置在所述基板支撑表面之上的第二位置之间移动; 以及连接器，被配置为在所述多个提升销到达所述基板支撑表面的平面之前，选择性地在所述基板支撑件和所述基板升降机构之间提供电连接。
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公开(公告)号：US11049701B2
公开(公告)日：2021-06-29
申请号：US15823176
申请日：2017-11-27
Applicant: APPLIED MATERIALS, INC.
Inventor： Adolph Miller Allen , William Johanson , Viachslav Babayan , Zhong Qiang Hua , Carl R. Johnson , Vanessa Faune , Jingjing Liu , Vaibhav Soni , Kirankumar Savandaiah , Sundarapandian Ramalinga Vijayalaks Reddy
IPC: H01J37/34 , H01J37/32 , C23C14/34 , C23C16/458 , H01J37/02
Abstract: Apparatus and methods for reducing and eliminating accumulation of excessive charged particles from substrate processing systems are provided herein. In some embodiments a process kit for a substrate process chamber includes: a cover ring having a body and a lip extending radially inward from the body, wherein the body has a bottom, a first wall, and a second wall, and wherein a first channel is formed between the second wall and the lip; a grounded shield having a lower inwardly extending ledge that terminates in an upwardly extending portion configured to interface with the first channel of the cover ring; and a bias power receiver coupled to the body and extending through an opening in the grounded shield.
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公开(公告)号：US10648071B2
公开(公告)日：2020-05-12
申请号：US15814696
申请日：2017-11-16
Applicant: APPLIED MATERIALS, INC.
Inventor： William Johanson , Siew Kit Hoi , John Mazzocco , Kirankumar Savandaiah , Prashant Prabhu
Abstract: Embodiments of process kits and process chambers incorporating same are provided herein. In some embodiments, a process kit includes an adapter having an adapter body and a shield portion radially inward of the adapter body; a heat transfer channel formed in the adapter body; a shadow ring coupled to the adapter such that the shield portion of the adapter extends over a portion of the shadow ring; and a ceramic insulator disposed between the shadow ring and the adapter to electrically isolate the shadow ring from the adapter.
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Patent Agency Ranking
公开(公告)号：US10546733B2
公开(公告)日：2020-01-28
申请号：US14960890
申请日：2015-12-07
Applicant: APPLIED MATERIALS, INC.
Inventor： Kirankumar Savandaiah , Ryan Hanson , Ruxiao An
Abstract: Embodiments of process kit shields and process chambers incorporating same are provided herein. In some embodiments, a one-piece process kit shield includes a cylindrical body having an upper portion and a lower portion; a heat transfer channel extending through the upper portion; and a cover ring section extending radially inward from the lower portion.
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公开(公告)号：US09978569B2
公开(公告)日：2018-05-22
申请号：US15280075
申请日：2016-09-29
Applicant: Applied Materials, Inc.
Inventor： Lara Hawrylchak , Kirankumar Savandaiah
IPC: H01J37/34 , C23C16/458 , C23C14/34 , C23C14/56 , H01J37/32 , H01L21/687
CPC classification number: H01J37/3411 , C23C14/34 , C23C14/564 , C23C16/4585 , H01J37/32477 , H01J37/32623 , H01L21/68714 , H01L21/68721 , Y10T428/12528
Abstract: Embodiments of the invention generally provide a process kit for use in a physical deposition chamber (PVD) chamber. In one embodiment, the process kit provides adjustable process spacing, centering between the cover ring and the shield, and controlled gas flow between the cover ring and the shield contributing to uniform gas distribution, which promotes greater process uniformity and repeatability along with longer chamber component service life.
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公开(公告)号：US09960021B2
公开(公告)日：2018-05-01
申请号：US14182831
申请日：2014-02-18
Applicant: APPLIED MATERIALS, INC.
Inventor： Martin Lee Riker , Uday Pai , William Fruchterman , Keith A. Miller , Muhammad M. Rasheed , Thanh X. Nguyen , Kirankumar Savandaiah
CPC classification number: H01J37/3414 , C23C14/3407 , H01J37/3411 , H01J37/3423 , H01J37/3435
Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
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公开(公告)号：US09957601B2
公开(公告)日：2018-05-01
申请号：US13836996
申请日：2013-03-15
Applicant: APPLIED MATERIALS, INC.
Inventor： Muhammad Rasheed , Kirankumar Savandaiah , Alan A. Ritchie , Isaac Porras , Keith A. Miller
CPC classification number: C23C14/0063 , C23C14/35 , H01J37/3244 , H01J37/3405
Abstract: Apparatus for physical vapor deposition are provided herein. In some embodiments, a shield for use in a physical vapor deposition chamber, comprises an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, an annular groove formed in an inner wall of the one-piece body, and a plurality of gas distribution vents disposed along the annular feature and formed through the one-piece body, wherein the plurality of gas distribution vents are spaced apart from each other to distribute gases into the inner volume in a desired pattern.
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公开(公告)号：US09464349B2
公开(公告)日：2016-10-11
申请号：US14187585
申请日：2014-02-24
Applicant: Applied Materials, Inc.
Inventor： Lara Hawrylchak , Kirankumar Savandaiah
IPC: C23C16/00 , C25B9/00 , C23C14/00 , C25B11/00 , C25B13/00 , H01L29/12 , C23C14/34 , C23C16/458 , H01L21/687 , C23C14/56 , H01J37/32
CPC classification number: H01J37/3411 , C23C14/34 , C23C14/564 , C23C16/4585 , H01J37/32477 , H01J37/32623 , H01L21/68714 , H01L21/68721 , Y10T428/12528
Abstract: Embodiments of the invention generally provide a process kit for use in a physical deposition chamber (PVD) chamber. In one embodiment, the process kit provides adjustable process spacing, centering between the cover ring and the shield, and controlled gas flow between the cover ring and the shield contributing to uniform gas distribution, which promotes greater process uniformity and repeatability along with longer chamber component service life.
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