Abstract:
Systems and methods are provided for matching the impedance of a load to an impedance of a power generator. Embodiments include a matching network with a dynamically configurable component assembly array couplable to the variable impedance load and the RF power generator, wherein the component assembly array includes one or more tune and load electrical components. The component assembly array is adapted to be configured for each recipe step, and at least one of the electrical components is a variable impedance component adjustable to reduce RF energy reflected from the variable impedance load for each recipe step. Numerous other aspects are provided.
Abstract:
Systems and methods are provided for matching the impedance of a load to an impedance of a power generator. Embodiments include a matching network with a dynamically configurable component assembly array couplable to the variable impedance load and the RF power generator, wherein the component assembly array includes one or more tune and load electrical components. The component assembly array is adapted to be configured for each recipe step, and at least one of the electrical components is a variable impedance component adjustable to reduce RF energy reflected from the variable impedance load for each recipe step. Numerous other aspects are provided.
Abstract:
A compact configurable radio frequency (RF) matching network for matching RF energy output from an RF generator to a variable impedance load is disclosed. The matching network includes an input connector; an output connector; and a component assembly array including one or more tune and load electrical components. At least one of the electrical components is coupled to the input connector, at least one of the electrical components is coupled to the output connector, the component assembly array is adapted to be arranged in a selected topology, and the selected topology is adapted to reduce RF energy reflected from the variable impedance load. Numerous other aspects are provided.
Abstract:
A transmission line RF applicator apparatus and method for coupling RF power to a plasma in a plasma chamber. The apparatus comprises two conductors, one of which has a plurality of apertures. In one aspect, apertures in different portions of the conductor have different sizes, spacing or orientations. In another aspect, adjacent apertures at successive longitudinal positions are offset along the transverse dimension. In another aspect, the apparatus comprises an inner conductor and one or two outer conductors. The main portion of each of the one or two outer conductors includes a plurality of apertures that extend between an inner surface and an outer surface of the outer conductor.
Abstract:
Embodiments of the present invention generally relates to substrate supports for use in a plasma processing chamber. The substrate supports, which are metallic, have ceramic inserts to prevent arcing between the substrate support and the shadow frame used to protect the edges of the substrate support during processing. In large area substrate processing chambers, the shadow frame may comprise multiple pieces. The individual pieces may be coupled together, but spaced slightly apart by a gap to permit thermal expansion. Ceramic inserts are positioned on the substrate support so that when a shadow frame is positioned adjacent thereto, the ceramic inserts are located adjacent the gaps in the shadow frame. The ceramic inserts adjacent the gap prevent and/or reduce the arcing because the gaps are located over electrically insulating material rather than electrically conductive material.
Abstract:
A compact configurable radio frequency (RF) matching network for matching RF energy output from an RF generator to a variable impedance load is disclosed. The matching network includes an input connector; an output connector; and a component assembly array including one or more tune and load electrical components. At least one of the electrical components is coupled to the input connector, at least one of the electrical components is coupled to the output connector, the component assembly array is adapted to be arranged in a selected topology, and the selected topology is adapted to reduce RF energy reflected from the variable impedance load. Numerous other aspects are provided.