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公开(公告)号：US11171304B2
公开(公告)日：2021-11-09
申请号：US16766849
申请日：2019-12-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Shengguang Ban , Zhanfeng Cao , Ke Wang
Abstract: Disclosed are a flexible substrate, a preparation method thereof, and a display device, to improve the encapsulation effect and the product yield. The flexible substrate includes: a base substrate, where the base substrate has a plurality of sub-pixel areas arranged in an array, connection areas each for connecting adjacent sub-pixel areas; and hollow areas among the sub-pixel areas and the connection area; in each sub-pixel area, there are a pixel circuit, an isolation structure surrounding the pixel circuit, and a light-emitting functional layer covering the pixel circuit and the isolation structure; the isolation structure has a hollow pattern at a junction of the sub-pixel area and the connection area; the connection area has a signal line therein, and the signal line is electrically connected with the pixel circuit through the hollow pattern; and the isolation structure has an undercut that interrupts the light-emitting functional layer.
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12.发明申请公开(公告)号：US20210074689A1
公开(公告)日：2021-03-11
申请号：US16984511
申请日：2020-08-04
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hsuanwei MAI , Zhanfeng Cao , Ke Wang , Haixu Li , Zhiwei Liang , Zhijun Lv
IPC: H01L25/075 , H01L33/00
Abstract: Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.
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13.发明授权公开(公告)号：US10204997B2
公开(公告)日：2019-02-12
申请号：US15560724
申请日：2016-09-21
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: H01L27/12 , H01L29/45 , H01L21/02 , C23C14/35 , H01L21/027 , H01L29/66 , H01L29/24 , H01L29/786 , G03F5/16 , H01L21/443 , G02F1/1343 , G02F1/13363 , H01L21/77
Abstract: The present application discloses a thin film transistor, a display substrate and display panel having the same, and a fabricating method thereof. The thin film transistor includes a base substrate; an active layer on the base substrate having a channel region, a first electrode contact region, and a second electrode contact region; and a first electrode on a side of the first electrode contact region distal to the base substrate; and a second electrode on a side of the second electrode contact region distal to the base substrate; the first electrode and the second electrode being made of an amorphous carbon material.
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14.发明申请公开(公告)号：US20180254328A1
公开(公告)日：2018-09-06
申请号：US15560724
申请日：2016-09-21
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
IPC: H01L29/45 , H01L27/12 , H01L21/02 , H01L21/443 , H01L21/027 , H01L29/66 , H01L29/24 , H01L29/786 , G03F5/16 , C23C14/35
CPC classification number: H01L29/45 , C23C14/35 , G02F1/13363 , G02F1/1343 , G03F5/16 , H01L21/02565 , H01L21/02631 , H01L21/0274 , H01L21/443 , H01L21/77 , H01L27/1225 , H01L27/127 , H01L27/1288 , H01L29/24 , H01L29/66969 , H01L29/78633 , H01L29/7869
Abstract: The present application discloses a thin film transistor, a display substrate and display panel having the same, and a fabricating method thereof. The thin film transistor includes a base substrate; an active layer on the base substrate having a channel region, a first electrode contact region, and a second electrode contact region; and a first electrode on a side of the first electrode contact region distal to the base substrate; and a second electrode on a side of the second electrode contact region distal to the base substrate; the first electrode and the second electrode being made of an amorphous carbon material.
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公开(公告)号：US12127447B2
公开(公告)日：2024-10-22
申请号：US17502052
申请日：2021-10-15
Applicant: BOE Technology Group Co., Ltd.
Inventor： Dapeng Xue , Shuilang Dong , Ke Wang , Zhanfeng Cao
IPC: H01L51/52 , H01L25/075 , H01L25/16 , H01L51/56 , H10K50/858 , H10K59/124 , H10K59/80 , H10K71/00 , H01L33/44
CPC classification number: H10K59/124 , H01L25/0753 , H01L25/167 , H10K50/858 , H10K59/879 , H10K71/00 , H01L33/44
Abstract: A display substrate is provided, which includes a base substrate and a plurality of sub-pixels disposed on the base substrate. At least one sub-pixel includes a light transmittance region and a display region. The display region includes a circuit structure layer and a light-emitting element which are disposed on a base substrate, and the light-emitting element is connected with the circuit structure layer. The display substrate further includes a plurality of insulating layers disposed on the base substrate, and at least one insulating layer is hollowed out in the light transmittance region.
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Patent Agency Ranking
公开(公告)号：US11929358B2
公开(公告)日：2024-03-12
申请号：US18137857
申请日：2023-04-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Qi Yao , Huijuan Wang , Haixu Li , Zhanfeng Cao , Guangcai Yuan , Xue Dong , Guoqiang Wang , Zhijun Lv
CPC classification number: H01L25/167 , H01L24/13 , H01L27/124 , H01L2224/13016 , H01L2224/13083 , H01L2224/13124 , H01L2224/13147 , H01L2224/1319
Abstract: Provided is a display backplate including an array substrate and a plurality of pairs of connection structures on the array substrate, wherein the array substrate includes a plurality of thin-film transistors and a common electrode signal line, wherein at least one of the plurality of thin-film transistors is connected to one of a pair of connection structures and the common electrode signal line is connected to the other of the pair of connection structures; and an area of a first section of the connection structure is negatively correlated with a distance between the first section and a surface of the array substrate, and the first section is parallel to the surface of the array substrate.
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17.发明授权公开(公告)号：US11848408B2
公开(公告)日：2023-12-19
申请号：US17054746
申请日：2019-12-02
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke Wang
CPC classification number: H01L33/62 , G09G3/32 , H01L25/0753 , H01L33/387 , H01L33/0066
Abstract: A drive circuit substrate, an LED display panel and a method of forming the same and a display device are provided, relates to the field of display technologies. The drive circuit substrate includes a base substrate and a plurality of drive electrodes arranged in an array on a surface of the base substrate. The driving electrodes include a first driving electrode and a second driving electrode, a horizontal height of the first driving electrode is greater than a horizontal height of the second driving electrode. The conductive structure includes a first conductive structure on a surface of the first driving electrode away from the base substrate and a second conductive structure on a surface of the second driving electrode away from the base substrate, a height of the second conductive structure is greater than a height of the first conductive structure.
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18.发明授权公开(公告)号：US11798919B2
公开(公告)日：2023-10-24
申请号：US16984511
申请日：2020-08-04
Applicant: BOE Technology Group Co., Ltd.
Inventor： Hsuanwei Mai , Zhanfeng Cao , Ke Wang , Haixu Li , Zhiwei Liang , Zhijun Lv
IPC: H01L33/00 , H01L25/075
CPC classification number: H01L25/0753 , H01L33/0095
Abstract: Disclosed are a transfer carrier and a manufacturing method thereof, and a method for transferring a light-emitting diode chip. The transfer carrier includes: a substrate having a plurality of via holes penetrating a thickness of the substrate, the substrate having a first surface and second surface which are opposite to each other; and thermoplastic structures filling corresponding ones of the via holes, one end of the thermoplastic structures protruding from the second surface of the substrate, and the other end covering a surrounding area on the first surface, of the corresponding via holes.
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公开(公告)号：US11768403B2
公开(公告)日：2023-09-26
申请号：US16958564
申请日：2019-12-11
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Shengguang Ban , Zhanfeng Cao , Ke Wang
IPC: H01L33/00 , G02F1/1335 , G02F1/13357 , H01L25/075 , H01L33/62
CPC classification number: G02F1/133612 , G02F1/133603 , G02F1/133608 , H01L25/0753 , H01L33/62
Abstract: A backlight assembly, a manufacturing method thereof, and a display device are provided. The backlight assembly includes: a substrate, an anode trace and a cathode trace of an LED on the substrate, a planarization layer on a layer where the anode trace and the cathode trace of the LED are located, and an anode connection pad and a cathode connection pad on the planarization layer. The anode trace of the LED is coupled to the anode connection pad through a first via hole penetrating through the planarization layer, and the cathode trace of the LED is coupled to the cathode connection pad through a second via hole penetrating through the planarization layer. An exhaust channel is further arranged on the planarization layer to discharge gas accumulated in the planarization layer.
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公开(公告)号：US11742467B2
公开(公告)日：2023-08-29
申请号：US16920401
申请日：2020-07-02
Applicant: BOE Technology Group Co., Ltd.
Inventor： Zhiwei Liang , Wenqian Luo , Yingwei Liu , Ke Wang , Shengguang Ban , Zhanfeng Cao
CPC classification number: H01L33/62 , H01L24/16 , H01L2224/16225 , H01L2933/0066
Abstract: A preparation method of a backplane includes: forming an insulating structure layer having a groove on a base substrate by a mask exposure process, the groove being used for accommodating a metal trace; and repeating a metal sub-layer forming step including an ashing process and a wet etching process multiple times to form the metal trace positioned in the groove.
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