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公开(公告)号：US20140191653A1
公开(公告)日：2014-07-10
申请号：US13951206
申请日：2013-07-25
Applicant: Cree, Inc.
Inventor： Mark Edmond , Shaow B. Lin , Gerald H. Negley , Paul Kenneth Pickard
CPC classification number: H05B33/22 , F21K9/232 , F21K9/64 , F21V3/12 , F21V25/02 , G02B5/206 , H01L33/52
Abstract: The present disclosure discloses LED lamps and enclosures comprising light transparent polymer coatings comprising light diffusing particles as well as methods for providing improved luminous intensity distribution. More particularly, the present disclosure relates to enclosures comprising light-transparent polymer coatings comprising a light diffusing particles on at least one surfaces of the enclosure of an LED lamp.
Abstract translation: 本公开公开了包括包含光漫射颗粒的透明聚合物涂层的LED灯和外壳以及用于提供改进的发光强度分布的方法。 更具体地说，本公开内容涉及包括透光聚合物涂层的外壳，其包括在LED灯的外壳的至少一个表面上的光漫射颗粒。
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公开(公告)号：US20140036497A1
公开(公告)日：2014-02-06
申请号：US14010868
申请日：2013-08-27
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye , Charles M. Swoboda , Antony Paul van de Ven , Paul Kenneth Pickard , Bart P. Reier , James Michael Lay , Peter E. Lopez
IPC: F21K99/00
CPC classification number: F21V29/77 , F21K9/232 , F21V19/003 , F21V23/06 , F21V29/004 , F21V29/773 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10 , H05K1/05 , H05K2201/10106 , Y02B20/30
Abstract: A lamp comprises an enclosure comprising a reflector and a lens where the reflector is made of thermally conductive material. A base is coupled to the enclosure. An LED is located in the enclosure and emits light when energized through an electrical path from the base. A heat sink comprises a heat dissipating portion that may be at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the LED. The reflector is thermally coupled to the heat sink and is exposed to the exterior of the lamp such that heat from the heat sink may be dissipated to the ambient environment at least partially through the reflector.
Abstract translation: 灯包括包括反射器和透镜的外壳，其中反射器由导热材料制成。 基座连接到外壳。 一个LED位于外壳中，并通过电路从基座通电时发光。 散热器包括可以至少部分地暴露于周围环境的散热部分和热耦合到LED的导热部分。 反射器热耦合到散热器并且暴露于灯的外部，使得来自散热器的热量可以至少部分地通过反射器消散到周围环境。
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公开(公告)号：USD696800S1
公开(公告)日：2013-12-31
申请号：US29454771
申请日：2013-05-14
Applicant: Cree, Inc.
Designer： Paul Kenneth Pickard , Gerald H. Negley , Mark Edmond
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公开(公告)号：US20130294092A1
公开(公告)日：2013-11-07
申请号：US13939827
申请日：2013-07-11
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye , Charles M. Swoboda , Antony Paul van de Ven , Paul Kenneth Pickard , Bart P. Reier , James Michael Lay , Peter E. Lopez , Ed Adams
IPC: F21V29/00
CPC classification number: F21V29/77 , F21K9/232 , F21K9/238 , F21V19/003 , F21V23/004 , F21V23/006 , F21V23/06 , F21V29/004 , F21V29/773 , F21Y2101/02 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10 , H05K1/0284 , H05K1/05 , H05K1/181 , H05K2201/10106 , Y02B20/30
Abstract: A lamp has an optically transmissive enclosure and a base defining a longitudinal axis of the lamp extending from the base to the free end of the enclosure. A heat sink is at least partially located in the enclosure and includes a tower that extends along the longitudinal axis of the lamp. An LED assembly is positioned in the optically transmissive enclosure. The LED assembly comprises a lead frame circuit or a flex circuit where LEDs are attached to the circuits. The lead frame and flex circuit are formed into a three-dimensional shape and are thermally coupled to the tower.
Abstract translation: 灯具有光学透射外壳和限定灯的纵向轴线的基座，从基座延伸到外壳的自由端。 散热器至少部分地位于外壳中并且包括沿着灯的纵向轴线延伸的塔架。 LED组件位于光学透射外壳中。 LED组件包括引线框架电路或柔性电路，其中LED连接到电路。 引线框架和柔性电路形成三维形状并且热耦合到塔架。
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公开(公告)号：US20130271990A1
公开(公告)日：2013-10-17
申请号：US13781844
申请日：2013-03-01
Applicant: CREE, INC.
Inventor： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye , Charles M. Swoboda , Antony Paul van de Ven , Paul Kenneth Pickard , Bart P. Reier , James Michael Lay , Peter E. Lopez
IPC: F21V29/02
CPC classification number: F21V29/65 , F21K9/232 , F21V3/061 , F21V3/10 , F21V29/004 , F21V29/74 , F21V29/75 , F21V29/85 , F21Y2107/00 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10
Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.
Abstract translation: 在一个实施例中，灯包括光学透射外壳。 LED阵列设置在透光外壳中，可操作以在通过电连接通电时发光。 外壳中装有气体，以提供与LED阵列的热耦合。 气体可以包括氧气。
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Patent Agency Ranking
公开(公告)号：US09810379B2
公开(公告)日：2017-11-07
申请号：US15229218
申请日：2016-08-05
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye , Charles M. Swoboda , Antony Paul van de Ven , Paul Kenneth Pickard , Bart P. Reier , James Michael Lay , Peter E. Lopez
IPC: F21V19/00 , F21K9/232 , F21V29/77 , F21V7/00 , F21V21/00 , F21V29/00 , F21V23/06 , F21V29/70 , F21V29/503 , F21K9/238 , H05K1/05 , F21Y101/00 , F21Y115/10 , F21Y107/30 , F21Y107/40
CPC classification number: F21K9/232 , F21K9/238 , F21V7/00 , F21V19/003 , F21V19/004 , F21V21/00 , F21V23/06 , F21V29/004 , F21V29/503 , F21V29/70 , F21V29/773 , F21V29/777 , F21Y2101/00 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10 , H05K1/05 , H05K2201/10106 , Y10T29/49826
Abstract: A lamp has an optically transmissive enclosure and a base. A tower extends from the base into the enclosure and supports an LED assembly in the enclosure. The LED assembly comprises a plurality of LEDs operable to emit light when energized through an electrical path from the base. The tower and the LED assembly are arranged such that the plurality of LEDs are disposed about the periphery of the tower in a band and face outwardly toward the enclosure to create a source of the light that appears as a glowing filament. The tower forms part of a heat sink that transmits heat from the LED assembly to the ambient environment. The LED assembly has a three-dimensional shape. An electrical interconnect connects a conductor to the heat sink where the conductor is in the electrical path between the LED assembly and the base.
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公开(公告)号：US20170018538A1
公开(公告)日：2017-01-19
申请号：US14802655
申请日：2015-07-17
Applicant: Cree, Inc.
Inventor： Nishant Tiwari , Colin Kelly Blakely , Jesse Colin Reiherzer , Mark Edmond , Arthur Fong-Yuen Pun , Michael Bergmann
CPC classification number: H01L25/0753 , H01L25/50 , H01L33/486 , H01L33/507 , H01L33/52 , H01L33/62 , H01L2224/48137 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: Solid state light emitter devices and methods are provided. A solid state light emitter device can include a submount having an upper surface and a bottom surface. At least first pair and a second pair of electrically conductive contacts can be disposed on the bottom surface of the submount. The first pair of contacts can be electrically independent from the second pair of contacts. The device can further include multiple light emitters provided on the upper surface of the submount. The multiple light emitters can be configured into at least a first light emitter zone that is electrically independent from a second light emitter zone upon electrical communication to a respective pair of contacts.
Abstract translation: 提供固态发光器件和方法。 固态发光器件可以包括具有上表面和底表面的底座。 至少第一对和第二对导电触点可以设置在底座的底表面上。 第一对触点可以与第二对触点电独立。 该装置还可以包括设置在底座的上表面上的多个发光体。 多个光发射器可以配置成至少第一光发射区，其在与相应的一对触点通电时与第二光发射区电独立。
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公开(公告)号：USD748296S1
公开(公告)日：2016-01-26
申请号：US29484541
申请日：2014-03-11
Applicant: Cree, Inc.
Designer： Bart P. Reier , Curt Progl , Mark Edmond
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公开(公告)号：US20150362168A1
公开(公告)日：2015-12-17
申请号：US14306342
申请日：2014-06-17
Applicant: Cree, Inc.
Inventor： David Power , Daniel J. VanEpps, JR. , Bart P. Reier , Mark Edmond
CPC classification number: F21V23/06 , F21K9/23 , F21K9/238 , F21K9/60 , F21V23/006 , F21V29/773 , F21Y2101/00 , F21Y2115/10
Abstract: A LED lamp comprises an enclosure containing a reflective surface and an optically transmissive exit surface and a base. A LED assembly is mounted on a submount, is located in the enclosure and is operable to emit light when energized through an electrical path from the base. The submount comprises a connector portion having a first electrical contact that is in the electrical path. A first spring contact is electrically coupled to lamp electronics where the lamp electronics and the first spring contact are in the electrical path. A heat sink comprises a heat dissipating portion that is at least partially exposed to the ambient environment and a heat conducting portion that is thermally coupled to the LED assembly. The connector portion is inserted into the heat sink such that the first electrical contact creates an electrical contact coupling with the first spring contact.
Abstract translation: LED灯包括包含反射表面和光学透射出射表面和基底的外壳。 LED组件安装在基座上，位于外壳中，并且当通过从基座的电路通电时可操作以发光。 底座包括具有位于电气路径中的第一电触头的连接器部分。 第一弹簧触头电耦合到灯电子器件，其中灯电子器件和第一弹簧触点处于电路径中。 散热器包括至少部分地暴露于周围环境的散热部分和热耦合到LED组件的导热部分。 连接器部分插入到散热器中，使得第一电触点产生与第一弹簧触头的电接触。
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公开(公告)号：US08757839B2
公开(公告)日：2014-06-24
申请号：US13774193
申请日：2013-02-22
Applicant: Cree, Inc.
Inventor： Christopher P. Hussell , John Adam Edmond , Gerald H. Negley , Curt Progl , Mark Edmond , Praneet Athalye , Charles M. Swoboda , Anthony Paul van de Ven , Paul Kenneth Pickard , Bart P. Reier , James Michael Lay , Peter E. Lopez
IPC: F21V5/00
CPC classification number: F21V29/65 , F21K9/232 , F21V3/061 , F21V3/10 , F21V29/004 , F21V29/74 , F21V29/75 , F21V29/85 , F21Y2107/00 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10
Abstract: In one embodiment, a lamp comprises an optically transmissive enclosure. An LED array is disposed in the optically transmissive enclosure operable to emit light when energized through an electrical connection. A gas is contained in the enclosure to provide thermal coupling to the LED array. The gas may include oxygen.
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