摘要:
A tunable resonator is provided. The tunable resonator includes a film bulk acoustic resonator (FBAR) for performing a resonance, and at least one driver which is arranged at a side of the FBAR and is deformed and brought into contact with the FBAR by an external signal, thereby changing a resonance frequency of the FBAR. Accordingly, a multiband integration and a one-chip manufacture can be implemented simply using a micro electro mechanical system (MEMS) technology and a mass production is possible.
摘要:
We describe and claim an internal signal replication device and method. A circuit comprising a selector to select one of a plurality of internally generated clock signals, and a compensation circuit to replicate the selected clock signal from a reference clock signal.
摘要:
Devices, circuits and methods synchronize the inputting and outputting of groups of data into a memory cell array and out of a device. Synchronizing is performed by internal clock signals, both of which are derived from a single delay feedback loop.
摘要:
Column select circuits and methods for read/write memory devices logically combine and delay an enable signal and a read/write control signal, to produce a column select control signal which has a first enable interval during a read operation and a second enable interval during a write operation. The first enable interval is preferably shorter than the second enable interval. The column select control signal preferably ends at the same time for both the read and write operations, but begins at different times for the read and write operations. Accordingly, the enable interval for the control signal can be different during read and write operations, to allow sufficient time for each of these operations while increasing access speed and preventing errors.
摘要:
A semiconductor memory device with a plurality of column select lines and a column driving method therefore are disclosed. In a semiconductor memory device including memory blocks each having a plurality of column lines and including a column decoder for receiving a plurality of column predecoding signals and selecting the column lines, the column lines contained in each of the memory blocks are divided into a plurality of column groups. Divided column predecoding lines for selecting the column lines contained in the column groups are arranged in a corresponding memory block, and the divided column predecoding line groups adjacently extend over any one side of the corresponding memory block.
摘要:
Disclosed are a substrate level bonding method and a substrate level package formed thereby. The substrate level package includes a plurality of unit substrate sections, a base substrate, and a plurality of substrate adhesion sections. The unit substrate sections are separated from each other by holes. The base substrate is disposed to face the unit substrate sections. The substrate adhesion sections are interposed between the unit substrate sections and the base substrate to bond the unit substrate sections to the base substrate and which are formed of DFR material, whose at least one portion is uncured.
摘要:
A semiconductor memory device includes a plurality of memory cell array blocks, a bit line sense amplifier, a local sense amplifier that can be controlled to be turned on or off, a data sense amplifier, and a controller. The controller activates a local sense control signal for a predetermined duration in response to first and second signals. The first signal is a bit line sense enable signal that activates the bit line sense amplifier, and the local sense amplifier is activated for a predetermined duration after the bit line sense enable signal is activated. The second signal is activated or deactivated in phase with a column selection line signal that connects a pair of bit lines and a pair of local input/output lines. Accordingly, it is possible to turn on or off the local sense amplifier according to operating conditions, thereby increasing a tRCD parameter and reducing the consumption of current. The operating speed of the semiconductor memory device can be improved by combining the local sense amplifier with a current type data sense amplifier that does not require precharging and equalization during a read operation.
摘要:
Semiconductor memory devices, block select decoding circuits and a method of activating a word line are provided. An example semiconductor memory device may include a plurality of memory banks. Each of the plurality of memory banks may include memory blocks which may be arranged in different addressable orders. If two edge memory blocks are activated in a given one of the plurality of memory banks, a non-edge memory block may be concurrently activated in at least one of remaining memory banks other than the given one memory bank. Accordingly, a number of concurrently activated memory blocks, a voltage required to enable a word line and noise may be reduced. The example semiconductor device may include the example block select decoding circuit, and likewise may perform the example method of activating a word line with an activation of a reduced number of memory blocks.
摘要:
A semiconductor memory device includes a plurality of banks. A data path may be divided into a read data path and a write data path, therefore, parallel processing of write and read commands are possible. The semiconductor memory device may include an address bank buffer, address buffer, column predecoder and/or a decoder. The semiconductor memory device may begin execution of a write command in a bank in one clock cycle and begin execution of a read command in the following clock cycle, therefore, bus efficiency is increased and/or write-to-read turn around time is reduced.
摘要:
A semiconductor device may include a control signal generator configured to generate a test control signal in response to an externally applied test command signal. First and second transmission gates may be configured to open and close together in response to a test clock signal pulse and the test control signal. A delay circuit may be coupled between the first and second transmission gates so that the delay circuit is configured to receive a test input signal through the first transmission gate and to transmit a delayed test input signal to the second transmission gate, and the delayed test input signal may correspond to the test input signal. A latch may be coupled between the second transmission gate and an output of the semiconductor device, and the latch may be configured to latch a first logic value when a duration of the test clock signal pulse is less than a delay of the delay circuit and to latch a second logic value when a duration of the test clock signal pulse is greater than the delay of the delay circuit, and the first and second logic values be different. Related methods are also discussed.