公开(公告)号：US20080117622A1

公开(公告)日：2008-05-22

申请号：US11600094

申请日：2006-11-16

Applicant: Chun-Cheng Lin

Inventor： Chun-Cheng Lin

IPC: F21V33/00 ,  A47J37/07

CPC classification number: F21L4/04 ,  A47J37/0786 ,  F21V17/007 ,  F21V21/0965 ,  F21V33/008

Abstract: A lighting device for a barbecue stove includes a fixing seat mounted on a faceplate of the barbecue stove, a lamp body detachably mounted on the fixing seat, a lighting member mounted on a first end of the lamp body, a drive member mounted on a second end of the lamp body to drive the lamp body, and a magnetic member mounted on the drive member. Thus, the magnetic member of the lighting device is magnetically attached to a metallic surface located at any position of the barbecue stove so that the lighting device is arbitrarily attached to any position of the barbecue stove to provide a lighting effect.

Abstract translation: 一种用于烧烤炉的照明装置包括安装在烧烤炉的面板上的固定座，可拆卸地安装在固定座上的灯体，安装在灯体的第一端上的照明件，安装在第二个 灯体的端部以驱动灯体，以及安装在驱动构件上的磁性构件。 因此，照明装置的磁性构件被磁性地附接到位于烧烤炉的任何位置的金属表面，使得照明装置任意地附接到烧烤炉的任何位置以提供照明效果。

公开(公告)号：US20070054407A1

公开(公告)日：2007-03-08

申请号：US11487823

申请日：2006-07-17

Applicant: Yu-Ju Chen ,  Po-Chiao Lin ,  Chun-Cheng Lin ,  Shu-Hua Chen ,  Po-Hung Chou ,  Hsin Liao

Inventor： Yu-Ju Chen ,  Po-Chiao Lin ,  Chun-Cheng Lin ,  Shu-Hua Chen ,  Po-Hung Chou ,  Hsin Liao

IPC: G01N33/551

CPC classification number: B82Y15/00 ,  B82Y30/00 ,  G01N33/54333 ,  G01N33/6851

Abstract: The present invention provides methods, compositions, and systems for mass spectrometric analysis of magnetic nanoparticles displaying ligands on their surface. For example, the present invention provides methods of screening a sample for the presence of at least one analyte using ligand conjugated magnetic nanoparticles, magnetic separation, and mass spectrometric analysis. The present invention also relates to MALDI matrix compositions comprising ligand conjugated magnetic nanoparticles.

Abstract translation: 本发明提供了在其表面上显示配体的磁性纳米颗粒的质谱分析的方法，组合物和系统。 例如，本发明提供了使用配体共轭磁性纳米颗粒筛选样品以存在至少一种分析物的方法，磁分离和质谱分析。 本发明还涉及包含配体缀合的磁性纳米颗粒的MALDI基质组合物。

公开(公告)号：US20050287552A1

公开(公告)日：2005-12-29

申请号：US11091649

申请日：2005-03-28

Applicant: Chun-Cheng Lin ,  Yu-Ju Chen

Inventor： Chun-Cheng Lin ,  Yu-Ju Chen

IPC: A61K47/48 ,  C12Q1/68 ,  G01N33/53 ,  G01N33/554 ,  G01N33/569 ,  G01N33/58

CPC classification number: B82Y5/00 ,  G01N33/54346 ,  G01N33/56916 ,  G01N33/587 ,  G01N33/6851 ,  G01N2400/00

Abstract: The present invention provides methods and compositions for carbohydrate encapsulated nanoparticle based mass spectrometry. For example, the present invention provides methods of screening samples for carbohydrate binding molecules, methods of characterizing carbohydrate binding epitopes in target molecules, and MALDI matrix compositions comprising carbohydrate encapsulated nanoparticles.

Abstract translation: 本发明提供了用于碳水化合物包封的纳米颗粒的质谱法的方法和组合物。 例如，本发明提供筛选碳水化合物结合分子的样品的方法，表征靶分子中碳水化合物结合表位的方法，以及包含碳水化合物包封的纳米颗粒的MALDI基质组合物。

公开(公告)号：US20050046204A1

公开(公告)日：2005-03-03

申请号：US10653267

申请日：2003-09-03

Applicant: Chun-Cheng Lin

Inventor： Chun-Cheng Lin

IPC: E05B1/00 ,  E05B3/00 ,  E05B55/00

CPC classification number: E05B3/003 ,  E05B1/0007 ,  E05B55/005 ,  Y10T292/93

Abstract: A latching axle assembly includes an axle having a head formed at an end of the axle. Multiple recesses are defined at an outer periphery of the head. A cap has multiple protrusions formed at an inner wall of the cap and respectively positioned in the recesses to detachably mount the cap on the head. The cap can be easily and quickly mounted on the axle, and can be detached from an axle found to be defective.

Abstract translation: 锁定轴组件包括具有在轴的端部处形成的头部的车轴。 多个凹口限定在头部的外周。 帽在盖的内壁处形成有多个突出部，并且分别定位在凹部中以将帽可拆卸地安装在头部上。 盖可以方便快捷地安装在轴上，并且可以从发现有缺陷的轴上拆下。

公开(公告)号：US09412717B2

公开(公告)日：2016-08-09

申请号：US13289719

申请日：2011-11-04

Applicant: Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/00 ,  H01L23/00 ,  B29C43/18 ,  H01L21/56 ,  B29C33/68

CPC classification number: H01L24/97 ,  B29C33/68 ,  B29C43/18 ,  H01L21/563 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00

Abstract: Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.

Abstract translation: 用于成型模制底部填料的方法和装置。 公开了一种方法，其包括在第一温度下将倒装芯片衬底加载到模压机的上模追逐和下模追逐中的所选择的一个中; 将模制的底部填充材料定位在上模具和下模具中的至少一个中，同时保持低于模制的底部填充材料的熔融温度的第一温度; 形成密封的模腔并在模腔中产生真空; 将模制的底部填充材料的温度提高到大于熔点的第二温度，以使模制的底部填充材料在形成底部填充层的倒装芯片衬底上流动并形成包覆成型层; 并将所述倒装芯片基板冷却至基本上低于所述模制底部填充材料的熔融温度的第三温度。 公开了一种装置。

公开(公告)号：US09233307B2

公开(公告)日：2016-01-12

申请号：US13588166

申请日：2012-08-17

Applicant: Hsing-Yuan Shen ,  Chun-Cheng Lin

Inventor： Hsing-Yuan Shen ,  Chun-Cheng Lin

IPC: G06F9/44 ,  G06F13/10 ,  G06F13/12 ,  A63F13/22 ,  G06F3/038

CPC classification number: A63F13/22 ,  G06F3/038

Abstract: A fully automatic simulation system for an input device permits storage in advance of executable applications and associated simulation setting flies into a database, and then combination of the detection, automatic data searching and matching, transmission and conversion, enabling rapid and convenient operation by the users, whenever they operate various applications or whether they adopt a keyboard, mouse or joystick as the simulation controller.

Abstract translation: 用于输入设备的全自动仿真系统允许在可执行应用程序之前进行存储，并将相关的仿真设置进入数据库，然后组合检测，自动数据搜索和匹配，传输和转换，使用户能够快速方便地进行操作 ，每当他们操作各种应用程序，或者他们是否采用键盘，鼠标或操纵杆作为模拟控制器。

公开(公告)号：US08895497B2

公开(公告)日：2014-11-25

申请号：US12960805

申请日：2010-12-06

Applicant: Chun-Cheng Lin ,  Wun-Shaing Wayne Chang ,  Biing-Jiun Uang ,  Jang-Yang Chang ,  Jo-Chun Chen ,  Hsing-Pang Hsieh

Inventor： Chun-Cheng Lin ,  Wun-Shaing Wayne Chang ,  Biing-Jiun Uang ,  Jang-Yang Chang ,  Jo-Chun Chen ,  Hsing-Pang Hsieh

IPC: C07D295/215 ,  C07D307/68

CPC classification number: C07C261/04 ,  C07C237/22 ,  C07C2601/02 ,  C07C2601/04 ,  C07C2601/14 ,  C07C2601/18 ,  C07C2603/18 ,  C07D209/42 ,  C07D217/26 ,  C07D241/24 ,  C07D249/18 ,  C07D295/215 ,  C07D307/68 ,  C07D309/32 ,  C07D319/18 ,  C07D333/24

Abstract: Cathepsin S inhibitors having formula (I), (II), (III) or (IV) as shown in the specification. These inhibitors can be used to treat cancer and autoimmune/inflammatory diseases.

Abstract translation: 具有式（I），（II），（III）或（IV）的组织蛋白酶S抑制剂，如说明书所示。 这些抑制剂可用于治疗癌症和自身免疫/炎性疾病。

公开(公告)号：US08884431B2

公开(公告)日：2014-11-11

申请号：US13228768

申请日：2011-09-09

Applicant: Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

Inventor： Chih-Wei Lin ,  Ming-Da Cheng ,  Wen-Hsiung Lu ,  Hsiu-Jen Lin ,  Bor-Ping Jang ,  Chung-Shi Liu ,  Mirng-Ji Lii ,  Chen-Hua Yu ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Kuei-Wei Huang ,  Wei-Hung Lin

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/683 ,  H01L23/498 ,  H01L21/56 ,  H01L25/065 ,  H01L23/538 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10 ,  H01L25/03 ,  H01L21/768

CPC classification number: H01L25/0657 ,  H01L21/52 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/03 ,  H01L24/05 ,  H01L24/09 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68377 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/06515 ,  H01L2224/09181 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/73259 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/9202 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15322 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2224/03 ,  H01L2924/014 ,  H01L2924/00

Abstract: Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.

Abstract translation: 公开了用于半导体器件的封装方法和结构。 在一个实施例中，封装的半导体器件包括具有第一表面和与第一表面相对的第二表面的再分配层（RDL）。 至少一个集成电路耦合到RDL的第一表面，并且多个金属凸块耦合到RDL的第二表面。 模制化合物设置在RDL的至少一个集成电路和第一表面上。

公开(公告)号：US08755180B2

公开(公告)日：2014-06-17

申请号：US13431235

申请日：2012-03-27

Applicant: Shu-Hua Yeh ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

Inventor： Shu-Hua Yeh ,  Chi-Fu Chen ,  Fang-Hsiang Tseng ,  Chun-Cheng Lin

IPC: G06F1/16

CPC classification number: G06F1/1679 ,  G06F1/1618 ,  G06F1/1675

Abstract: A foldable electric device comprises a first member, a second member and a pivot portion. The pivot portion is used to pivot the first member and the second member. The first member comprises a first cushion pad and a first magnetic component. The first cushion pad is retractably disposed on a surface of the first member. The first magnetic component is installed in the first member, and synchronously moves with the first cushion pad. The second member comprises a second magnetic component. When the first member and the second member are covered together, with the magnetic effect between the first magnetic component and the second magnetic component, the first cushion pad is linked by the first magnetic unit to protrude from or retract into the first member.

Abstract translation: 可折叠电气装置包括第一构件，第二构件和枢转部分。 枢转部分用于枢转第一构件和第二构件。 第一构件包括第一缓冲垫和第一磁性部件。 第一缓冲垫可收缩地设置在第一构件的表面上。 第一磁性部件安装在第一部件中，与第一缓冲垫同步移动。 第二构件包括第二磁性部件。 当第一构件和第二构件被覆盖在一起时，利用第一磁性构件和第二磁性构件之间的磁效应，第一缓冲垫通过第一磁性单元连接以从第一构件和第二构件突出或缩回到第一构件中。

公开(公告)号：US20130234317A1

公开(公告)日：2013-09-12

申请号：US13416805

申请日：2012-03-09

Applicant: Meng-Tse Chen ,  Wei-Hung Lin ,  Yu-Peng Tsai ,  Chun-Cheng Lin ,  Chih-Wei Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Wei-Hung Lin ,  Yu-Peng Tsai ,  Chun-Cheng Lin ,  Chih-Wei Lin ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L25/07 ,  H01L21/60

CPC classification number: H01L24/32 ,  B23K35/24 ,  B23K35/3612 ,  H01L23/49816 ,  H01L24/17 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/16237 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2224/48227 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.

Abstract translation: 公开了封装方法和封装的半导体器件。 在一个实施例中，包装方法包括提供第一模具，部分地包装第一模具，以及在部分封装的第一模具的表面上形成多个焊球。 环氧助焊剂设置在多个焊球上。 提供第二模具，并且第二模具被部分包装。 多个焊球与部分封装的第二管连接。