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    Method for immobilizing glycoprotein
    4.
    发明授权
    Method for immobilizing glycoprotein 有权
    糖蛋白固定方法

    公开(公告)号：US08153387B2

    公开(公告)日：2012-04-10

    申请号：US12490953

    申请日：2009-06-24

    Applicant: Chun-Cheng Lin ,  Mu-Lin Chen ,  Po-Chiao Lin ,  Yu-Ju Chen ,  Shu-Hua Chen

    Inventor： Chun-Cheng Lin ,  Mu-Lin Chen ,  Po-Chiao Lin ,  Yu-Ju Chen ,  Shu-Hua Chen

    IPC: G01N33/53

    CPC classification number: C07K16/18 ,  C07K17/14 ,  C07K2317/41 ,  C07K2317/52 ,  G01N33/54353

    Abstract: A method for immobilizing glycoprotein is disclosed. A surface is provided. Next, a boronic acid is contacted to the surface. The boronic acid is represented as Y—R—B—(OH)2 and includes a boronic acid group (B—(OH)2), a linker R, and a functional group Y, in which the boronic acid is bonded to the surface via the functional group Y. A glycoprotein is contacted to the boronic acid, wherein two spatially adjacent hydroxyl groups of a carbohydrate chain form a boronate ester with the boronic acid group of the boronic acid to immobilize the glycoprotein. The goal of site-specific and covalent protein immobilization without interfering the binding affinity of an antibody to antigen may be thus achieved with the reaction of boronic acid and the carbohydrate chain of Fc region.

    Abstract translation: 公开了一种固定糖蛋白的方法。 提供一个表面。 接下来，硼酸与表面接触。 硼酸被表示为Y-R-B-（OH）2，并且包括硼酸基团（B-（OH）2），连接体R和官能团Y，其中硼酸键合到 通过官能团Y表面。糖蛋白与硼酸接触，其中碳水化合物链的两个空间上相邻的羟基与硼酸的硼酸基团形成硼酸酯以固定糖蛋白。 因此可以通过硼酸和Fc区的碳水化合物链的反应来实现位点特异性和共价蛋白固定而不干扰抗体对抗原的结合亲和力的目标。

    Electrical connector assembly
    5.
    发明授权
    Electrical connector assembly 有权

    公开(公告)号：US12149024B2

    公开(公告)日：2024-11-19

    申请号：US17853861

    申请日：2022-06-29

    Applicant: Chun-Cheng Lin ,  Shy-Luen Chern ,  Chih-Hsiang Tang ,  Hong-Wen Lee

    Inventor： Chun-Cheng Lin ,  Shy-Luen Chern ,  Chih-Hsiang Tang ,  Hong-Wen Lee

    IPC: H01R13/62 ,  H01R13/17 ,  H01R13/24 ,  H01R13/502 ,  H01R13/629

    Abstract: An electrical connector assembly including a first connector and a second connector to be mated with each other is provided. The first connector includes a first body, and at least one first terminal and multiple second terminals disposed therein. The second terminals are symmetrically arranged at opposite sides of the first terminal. The second connector includes a second body, at least one third terminal movably disposed in the second body, multiple fourth terminals disposed in the second body and symmetrically arranged at opposite sides of the third terminal, and a driving module electrically connected to at least one of the fourth terminals and structurally connected to the third terminal. In the mating process of the first and second connector, the second terminals and the fourth terminals are electrically connected firstly, to trigger the driving module to move the third terminal to be structurally and electrically connected to the first terminal.

    Apparatus and Methods for Molded Underfills in Flip Chip Packaging
    9.
    发明申请
    Apparatus and Methods for Molded Underfills in Flip Chip Packaging 有权
    倒装芯片包装中模制底层填料的设备和方法

    公开(公告)号：US20130115735A1

    公开(公告)日：2013-05-09

    申请号：US13289719

    申请日：2011-11-04

    Applicant: Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

    Inventor： Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

    IPC: H01L21/98 ,  B29C35/08

    CPC classification number: H01L24/97 ,  B29C33/68 ,  B29C43/18 ,  H01L21/563 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00

    Abstract: Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.

    Abstract translation: 用于成型模制底部填料的方法和装置。 公开了一种方法，其包括在第一温度下将倒装芯片衬底加载到模压机的上模追逐和下模追逐中的所选择的一个中; 将模制的底部填充材料定位在上模具和下模具中的至少一个中，同时保持低于模制的底部填充材料的熔融温度的第一温度; 形成密封的模腔并在模腔中产生真空; 将模制的底部填充材料的温度提高到大于熔点的第二温度，以使模制的底部填充材料在形成底部填充层的倒装芯片衬底上流动并形成包覆成型层; 并将所述倒装芯片基板冷却至基本上低于所述模制底部填充材料的熔融温度的第三温度。 公开了一种装置。

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