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公开(公告)号：US20140349067A1
公开(公告)日：2014-11-27
申请号：US14323423
申请日：2014-07-03
Applicant: DEXERIALS CORPORATION
Inventor： Hiroyuki USUI , Keisuke ARAMAKI
CPC classification number: B29D7/01 , B26D1/08 , B26D3/28 , B26D7/086 , B29C35/02 , B29C47/0004 , B29C47/0019 , B29C47/0021 , B29C47/0066 , B29C47/1027 , B29C47/8805 , B29C70/14 , B29C70/62 , B29K2509/00 , B29K2883/00 , B29K2995/0013 , B29K2995/0044 , B29K2995/0073 , B29L2007/00 , B29L2031/18 , C08G77/12 , C08G77/20 , C08J5/18 , C08J2383/04 , C08J2383/05 , C08J2383/07 , C08K3/04 , C08K3/22 , C08K5/56 , C08K7/06 , C08K7/18 , C08K2003/2227 , C08K2201/001 , C08K2201/005 , C08L83/04 , C08L83/14 , C08L2205/025 , H01L23/3737 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/29393 , H01L2224/29499 , H01L2224/8385 , H01L2924/0002 , Y10T428/24 , Y10T428/24355 , Y10T428/24488 , Y10T428/24777 , Y10T428/268 , C08L83/00 , H01L2924/00
Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.
Abstract translation: 导热片具有低表面粗糙度的切割表面，因此在界面处显示降低的热阻，并且在厚度方向上具有高导热性。 因此，导热片可以插入在各种热源和辐射构件中的任一种之间。 制造导热片的方法至少包括：挤出成型步骤，其中使用挤出机挤出含有聚合物，各向异性导热填料和填料的导热组合物，从而模制挤出成型产品，其中 各向异性导热填料沿挤出方向取向; 固化步骤，其中挤出成型产品被固化以获得固化物体; 以及切割步骤，其中固化物体在与挤出方向垂直的方向上用超声波切割机切割成给定厚度。
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公开(公告)号：US20140346710A1
公开(公告)日：2014-11-27
申请号：US14323313
申请日：2014-07-03
Applicant: DEXERIALS CORPORATION
Inventor： Hiroyuki USUI , Keisuke ARAMAKI
IPC: B29D7/01
CPC classification number: B29D7/01 , B26D1/08 , B26D3/28 , B26D7/086 , B29C35/02 , B29C47/0004 , B29C47/0019 , B29C47/0021 , B29C47/0066 , B29C47/1027 , B29C47/8805 , B29C70/14 , B29C70/62 , B29K2509/00 , B29K2883/00 , B29K2995/0013 , B29K2995/0044 , B29K2995/0073 , B29L2007/00 , B29L2031/18 , C08G77/12 , C08G77/20 , C08J5/18 , C08J2383/04 , C08J2383/05 , C08J2383/07 , C08K3/04 , C08K3/22 , C08K5/56 , C08K7/06 , C08K7/18 , C08K2003/2227 , C08K2201/001 , C08K2201/005 , C08L83/04 , C08L83/14 , C08L2205/025 , H01L23/3737 , H01L24/27 , H01L24/29 , H01L24/83 , H01L2224/2929 , H01L2224/293 , H01L2224/29386 , H01L2224/29393 , H01L2224/29499 , H01L2224/8385 , H01L2924/0002 , Y10T428/24 , Y10T428/24355 , Y10T428/24488 , Y10T428/24777 , Y10T428/268 , C08L83/00 , H01L2924/00
Abstract: A thermally conductive sheet has cut surfaces with low surface roughness and hence shows reduced thermal resistance at the interfaces, and high thermal conductivity in the thickness direction. Thus, the thermally conductive sheet can be interposed between any of various heat sources and a radiation member. The process for producing the thermally conductive sheet includes at least: an extrusion molding step in which a thermally conductive composition containing a polymer, an anisotropic thermally conductive filler, and a filler is extruded with an extruder to thereby mold an extrusion-molded product in which the anisotropic thermally conductive filler has been oriented along the extrusion direction; a curing step in which the extrusion-molded product is cured to obtain a cured object; and a slicing step in which the cured object is sliced into a given thickness with an ultrasonic cutter in the direction perpendicular to the extrusion direction.
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公开(公告)号：US20240116146A1
公开(公告)日：2024-04-11
申请号：US18276497
申请日：2022-02-03
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke MUKASA , Yusuke KUBO , Keisuke ARAMAKI
CPC classification number: B23P15/26 , B29C43/003 , B29C43/56 , F28F3/00 , B29C2043/561 , F28F2255/06 , F28F2255/14
Abstract: A method for producing a heat transfer sheet, includes: (A1) forming a mixture including at least one of a carbon fiber and a boron nitride flake, an inorganic filler, and a binder resin into a molded body in which the at least one of the carbon fiber and the boron nitride flake is oriented in a thickness direction of the molded body; (B1) slicing the molded body into a sheet shape to obtain a molded sheet; (C1) pressing the molded sheet; and (D1), after the pressing, inserting the molded sheet between films and performing a vacuum packing of the molded sheet with the films such that an uncured component of the binder resin present inside the molded sheet is exuded to a surface of the molded sheet, which is the heat transfer sheet.
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公开(公告)号：US20220262702A1
公开(公告)日：2022-08-18
申请号：US17617238
申请日：2021-04-23
Applicant: DEXERIALS CORPORATION
Inventor： Yuma SATO , Keisuke ARAMAKI , Yusuke KUBO
Abstract: A thermally conductive sheet having a binder resin, a first thermally conductive filler, and a second thermally conductive filler, wherein the first thermally conductive filler and the second thermally conductive filler are dispersed in the binder resin, and the specific permittivity and the thermal conductivity are different in the thickness direction B and the surface direction A of the thermally conductive sheet. A thermally conductive sheet includes step A of preparing a resin composition for forming a thermally conductive sheet by dispersing a first thermally conductive filler and a second thermally conductive filler in a binder resin, step B of forming a molded block from the resin composition for forming a thermally conductive sheet, and step C of slicing the molded block into a sheet and obtaining a thermally conductive sheet having different relative permittivity and thermal conductivity in the thickness direction and the surface direction.
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公开(公告)号：US20220098462A1
公开(公告)日：2022-03-31
申请号：US17430146
申请日：2020-12-09
Applicant: DEXERIALS CORPORATION
Inventor： Marina TOBATA , Keisuke ARAMAKI
Abstract: A thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet, the sheet includes: a sheet body formed by curing a thermally conductive resin composition containing at least a polymer matrix component and a thermally conductive filler, wherein the volume ratio of the thermally conductive filler to the polymer matrix component is 1.00 to 1.70, the thermally conductive filler contains a fibrous thermally conductive filler, and the fibrous thermally conductive filler projects from the surface of the sheet body and is coated with an uncured component of the polymer matrix component.
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Patent Agency Ranking
公开(公告)号：US20220089919A1
公开(公告)日：2022-03-24
申请号：US17424617
申请日：2020-01-21
Applicant: DEXERIALS CORPORATION
Inventor： Yusuke KUBO , Keisuke ARAMAKI
Abstract: A thermally conductive sheet includes a sheet body and an adhesive layer. The sheet body is obtained by curing a thermally conductive resin composition. The thermally conductive resin composition includes a polymer matrix component and a fibrous thermally conductive filler. The adhesive layer is formed on at least one surface of the sheet body and imparts tackiness to the at least one surface of the sheet body. A volume of the adhesive layer is 0.0002 cm3 or more and 0.001 cm3 or less per 1 cm2 of the sheet body.
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公开(公告)号：US20220080718A1
公开(公告)日：2022-03-17
申请号：US17424596
申请日：2020-01-21
Applicant: DEXERIALS CORPORATION
Inventor： Yusuke KUBO , Keisuke ARAMAKI
Abstract: A method for producing a thermally conductive sheet, includes forming a molded body sheet having thermal conductivity and comprising a fibrous thermally conductive filler. A silicone resin film is formed by applying a silicone resin to a supporting body. At least one surface of the molded body sheet is directly affixed to a silicone resin side of the silicone resin film. The silicone resin is transferred to the at least one surface of the molded body sheet to form a silicone resin layer on the molded body sheet. The silicone resin layer is to be attached to a heat source or a heat dissipating member. The molded body sheet has a change in thermal resistance due to the transferring of the silicone resin of 0.5° C.·cm2/W or less.
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公开(公告)号：US20210296207A1
公开(公告)日：2021-09-23
申请号：US17259621
申请日：2019-07-04
Applicant: DEXERIALS CORPORATION
Inventor： Marina TOBATA , Keisuke ARAMAKI
IPC: H01L23/373 , C09K5/14 , C08J5/18 , C08K7/06 , C08K3/04 , H01L23/367 , H01L21/48
Abstract: A thermally conductive sheet excellent in adhesiveness to an electronic component, handleability and reworkability, a method for manufacturing the same, and a method for mounting a thermally conductive sheet. The sheet includes: a sheet body obtained by curing a binder resin containing at least a polymer matrix component and a fibrous thermally conductive filler, wherein the volume ratio of the fibrous thermally conductive filler to the binder resin is 0.6 or less considering the binder resin as 1, and the fibrous thermally conductive filler projects from the surface of the sheet body and is coated with an uncured component of the binder resin.
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公开(公告)号：US20190080978A1
公开(公告)日：2019-03-14
申请号：US16085263
申请日：2017-03-24
Applicant: Dexerials Corporation
Inventor： Tatsuo KUMURA , Yusuke KUBO , Keisuke ARAMAKI , Hiroyuki RYOSON
Abstract: Disclosed is an electromagnetic wave absorbing heat conductive sheet having superior heat conductivity and electromagnetic wave absorbency. The electromagnetic wave absorbing heat conductive sheet comprises a polymer matrix component; a magnetic metal power; and a fibrous heat conductive filler oriented in one direction.
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20.发明申请公开(公告)号：US20160150680A1
公开(公告)日：2016-05-26
申请号：US14898858
申请日：2014-06-27
Applicant: DEXERIALS CORPORATION
Inventor： Keisuke ARAMAKI , Atsuya YOSHINARI , Takuhiro ISHII , Shinichi UCHIDA , Masahiko ITO
IPC: H05K7/20 , H01L23/433 , F28F21/02 , F28F13/18 , B32B38/00 , B29C65/00 , B32B25/08 , B32B27/28 , B32B37/10 , H01L21/48 , B29C69/00
CPC classification number: H05K7/20481 , B29C65/002 , B29C66/45 , B29C69/001 , B29K2683/00 , B29K2995/0013 , B29L2031/18 , B29L2031/3481 , B32B25/08 , B32B27/283 , B32B37/10 , B32B38/0004 , B32B2250/24 , B32B2307/302 , B32B2383/00 , B32B2457/00 , F28F13/18 , F28F21/02 , H01L21/4871 , H01L21/4878 , H01L23/3737 , H01L23/42 , H01L23/433 , H01L2224/16225 , H01L2224/73253 , H01L2924/0002 , H01L2924/16152 , H05K7/2049 , H01L2924/00
Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.
Abstract translation: 提供一种具有改进的粘附性和导热性的导热片的制造方法。 该方法包括将包含导热填料和粘合剂树脂的导热性树脂组合物成型为规定形状，使导热性树脂组合物固化，得到导热性树脂组合物的成型体，切断成型体 制成片材，得到成型品片材，并压制成型品片材。
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