LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING
    17.
    发明申请
    LIQUID COOLING MEDIUM FOR ELECTRONIC DEVICE COOLING 审中-公开
    用于电子设备冷却的液体冷却介质

    公开(公告)号:US20150319889A1

    公开(公告)日:2015-11-05

    申请号:US14648015

    申请日:2013-12-17

    Abstract: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.

    Abstract translation: 用于浸入冷却电子硬件设备的液体冷却介质。 如根据ASTM D92测定的,这样的液体冷却介质的闪点为至少190℃,根据ASTM D445确定,在40℃下的粘度为27厘沲(“cSt”)或更小。 这种液体冷却介质可用于浸入冷却诸如计算机服务器,服务器主板和微处理器的设备。

    Thermoplastic, Semiconductive Compositions
    18.
    发明申请
    Thermoplastic, Semiconductive Compositions 有权
    热塑性,半导体组合物

    公开(公告)号:US20150200038A1

    公开(公告)日:2015-07-16

    申请号:US14374112

    申请日:2013-01-29

    CPC classification number: H01B1/24 C08L101/10

    Abstract: Crosslinkable, semiconductive, peroxide-free thermoplastic compositions having a stable volume resistivity of less than 1000 ohm-cm comprise, based on the weight of the composition: A. 60-90 wt % silane-functionalized polyethylene; B. 0.5-20 wt % organopolysiloxane containing two or more functional end groups; C. 10-20 wt % high conductivity carbon black, e.g., a carbon black having an average particle size of 50 nm or less, a surface area (BET) of 700-1250 m2/g, and an oil absorption (DBP) of 300-500 ml/100 g; and D. 0.05-0.2 wt % crosslinking catalyst.

    Abstract translation: 基于组合物的重量,具有小于1000欧姆 - 厘米的稳定体积电阻率的可交联的,半导电的,无过氧化物的热塑性组合物包括:A.60-90重量%的硅烷官能化聚乙烯; B.含有两个或更多个官能端基的0.5-20wt%有机聚硅氧烷; C.10-20重量%的高导电率炭黑,例如平均粒度为50nm以下的炭黑,700-1250m 2 / g的表面积(BET)和70-1250m 2 / g的吸油量(DBP) 300-500ml / 100g; 和D. 0.05-0.2重量%的交联催化剂。

    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER
    19.
    发明申请
    ELECTRONIC DEVICE MODULE COMPRISING POLYOLEFIN COPOLYMER 有权
    包含聚烯烃共聚物的电子器件模块

    公开(公告)号:US20130118583A1

    公开(公告)日:2013-05-16

    申请号:US13667744

    申请日:2012-11-02

    Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.

    Abstract translation: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点小于约95℃,(d)基于聚合物的重量,至少约15至小于约50重量%的烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。

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