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公开(公告)号:US10093794B2
公开(公告)日:2018-10-09
申请号:US15322239
申请日:2014-06-27
Applicant: DOW GLOBAL TECHNOLOGIES LLC , Haiyang Yu , Yanli Huo
Inventor: Haiyang Yu , Yanli Huo , Mohamed Esseghir , Saurav Sengupta , Jeffrey Cogen
Abstract: A cold shrink article made from a composition comprising (A) an ethylene/α-olefin interpolymer; (B) a filler; and (C) an α,β-unsaturated carboxylic acid. The composition may optionally include additives selected from the group consisting of plasticizer, peroxide curing agent, antioxidant, process additives, flame retardant and combinations thereof.
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12.
公开(公告)号:US20180254126A1
公开(公告)日:2018-09-06
申请号:US15757992
申请日:2016-09-06
Applicant: Dow Global Technologies LLC
Inventor: Mohamed Esseghir , Wenyi Huang , Chester J. Kmiec
CPC classification number: H01B7/38 , H01B3/28 , H01B3/302 , H01B3/441 , H01B3/46 , H01B7/185 , H01B7/285 , H01B7/365 , H01B13/14 , Y02A30/14
Abstract: Coated conductors comprising a conductor and a peelable polymeric coating at least partially surrounding the conductor, where the peelable polymeric coating comprises from 1 to 8 microcapillaries which comprise an elastomeric polymer having a lower flexural modulus than the polymeric matrix material of the polymeric coating. Also disclosed are methods for making such coated conductors.
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公开(公告)号:US09777205B2
公开(公告)日:2017-10-03
申请号:US15501878
申请日:2014-09-22
Applicant: Dow Global Technologies LLC
Inventor: Yunfeng Yang , Hongyu Chen , Brad C. Bailey , Mohamed Esseghir , Suh Joon Han
CPC classification number: C09K5/10 , B01J31/22 , C08F4/659 , C08F4/65908 , C08F4/65912 , C08F110/02 , C08K3/22 , C08K3/28 , C08K2003/2227 , C08K2003/2296 , C08K2003/282 , C10M107/06 , C10M169/02 , C10M2201/0416 , C10M2201/0616 , C10M2201/0626 , C10M2201/0656 , C10M2205/0225 , C10M2229/041 , C10M2229/042 , C10M2229/045 , C10N2220/022 , C10N2220/028 , C10N2230/08 , C08F2500/10 , C08F2500/02 , C08F10/02 , C08F4/64193 , C08F210/16 , C08F210/06 , C08F2500/17 , C08L23/14 , C08L23/06 , C10M2205/0245 , C10M2205/0285
Abstract: Disclosed is an effective thermal grease comprising a hyperbranched olefinic fluid and a thermally conductive filler. Property-modifying additives and fillers may also be included. The hyperbranched olefinic fluid is selected to have an average of at least 1.5 methine carbons per oligomer molecule and at least 40 methine carbons per one thousand total carbons. The thermal grease exhibits a flash point of 180° C. or higher, a pour point of 0° C. or lower, and a kinematic viscosity at 40° C. of no more than 200 cSt (0.0002 m 2/s). The composition may offer improved thermal conductivity, reduced tendency to migrate, and lower cost when compared with many other thermal greases, including silicone-based thermal greases.
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14.
公开(公告)号:US20170267828A1
公开(公告)日:2017-09-21
申请号:US15528712
申请日:2014-11-28
Applicant: Dow Global Technologies LLC
Inventor: Gangwei Sun , Mohamed Esseghir , XianMin Xu , Chester J. Kmiec
CPC classification number: C08J9/228 , C07C55/22 , C08J9/0061 , C08J9/08 , C08J2203/02 , C08J2323/06 , C08J2423/06 , C08J2427/12 , C08K5/098 , C08K2003/262 , C08L23/06 , C08L27/18 , H01B3/44 , H01B3/441 , H01B3/445
Abstract: The process of foaming a polyolefin, e.g., polyethylene, composition using as a nucleator a combination of (A) a fluororesin, and (B) a mixture of (1) a first component consisting of at least one of citric acid and an alkali metal citrate, and (2) a second component consisting of at least one of an alkali metal citrate, a di-alkali metal hydrogen citrate, an alkali metal dihydrogen citrate and an alkali metal bicarbonate with the proviso that if the first component of the mixture is an alkali metal citrate, then the second component of the mixture is not an alkali metal citrate.
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公开(公告)号:US20170227304A1
公开(公告)日:2017-08-10
申请号:US15514862
申请日:2015-10-14
Applicant: Dow Global Technologies LLC
Inventor: Mohamed Esseghir , Bharat I. Chaudhary , Jeffrey M. Cogen , Gary R. Marchand
IPC: F28F13/18 , C08L53/00 , B29C45/00 , B29C33/38 , C08L23/08 , C08L23/14 , C08K3/08 , C08K3/04 , F28F21/02
CPC classification number: F28F13/18 , B29C33/38 , B29C45/0001 , C08K3/04 , C08K3/041 , C08K3/08 , C08K2003/0812 , C08K2003/0893 , C08L23/08 , C08L23/14 , C08L53/00 , C08L2205/03 , F28F21/02 , F28F2255/06
Abstract: Thermally conductive materials comprising an olefin block composite and a thermally conductive filler, where the thermally conductive filler is present in an amount sufficient to increase the thermal conductivity of the olefin block composite relative to the olefin block composite in its neat state. Such thermally conductive materials can be used in various articles of manufacture, such as a thermal interface material or a molded heat dissipation component.
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公开(公告)号:US09670345B2
公开(公告)日:2017-06-06
申请号:US14917502
申请日:2013-10-18
Applicant: Dow Global Technologies LLC
Inventor: Mohamed Esseghir , Gangwei Sun , Jeffrey M. Cogen , Gary R. Marchand
CPC classification number: C08L23/12 , C08L23/142 , C08L51/06 , C08L2201/08 , C08L2203/12 , C08L2205/06 , C08L2205/24 , G02B6/4407 , G02B6/443 , G02B6/4479 , C08L53/00
Abstract: Optical cable components fabricated from an extrudable polymeric blend of crystalline polypropylene modified with one or more impact-modifying polymers. The impact-modifying polymers are crosslinked and can be selected from a polyolefin elastomer, an olefin multi-block interpolymer, an olefin block composite, and combinations thereof. Optionally, the polymeric blend can further comprise a compatibilizer. The polymeric blend may also contain one or more additives. The optical fiber cable components can be selected from buffer tubes, core tubes, and slotted core tubes.
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17.
公开(公告)号:US20150319889A1
公开(公告)日:2015-11-05
申请号:US14648015
申请日:2013-12-17
Applicant: Dow Global Technologies LLC
Inventor: Anny L. Flory , Mohamed Esseghir
IPC: H05K7/20
CPC classification number: H05K7/20781 , C09K5/10 , G06F1/20 , G06F2200/201 , H05K7/20236
Abstract: Liquid cooling mediums employed to immersion-cool electronic hardware devices. Such liquid cooling mediums have a flash point of at least 190° C., as determined according to ASTM D92, and a viscosity of 27 centistokes (“cSt”) or less at 40° C., as determined according to ASTM D445. Such liquid cooling mediums can be employed to immersion-cool such devices as computer servers, server motherboards, and microprocessors.
Abstract translation: 用于浸入冷却电子硬件设备的液体冷却介质。 如根据ASTM D92测定的,这样的液体冷却介质的闪点为至少190℃,根据ASTM D445确定,在40℃下的粘度为27厘沲(“cSt”)或更小。 这种液体冷却介质可用于浸入冷却诸如计算机服务器,服务器主板和微处理器的设备。
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公开(公告)号:US20150200038A1
公开(公告)日:2015-07-16
申请号:US14374112
申请日:2013-01-29
Applicant: Dow Global Technologies LLC
Inventor: Mohamed Esseghir , Jeffrey M. Cogen , Saurav S. Sengupta , Neil W. Dunchus
IPC: H01B1/24
CPC classification number: H01B1/24 , C08L101/10
Abstract: Crosslinkable, semiconductive, peroxide-free thermoplastic compositions having a stable volume resistivity of less than 1000 ohm-cm comprise, based on the weight of the composition: A. 60-90 wt % silane-functionalized polyethylene; B. 0.5-20 wt % organopolysiloxane containing two or more functional end groups; C. 10-20 wt % high conductivity carbon black, e.g., a carbon black having an average particle size of 50 nm or less, a surface area (BET) of 700-1250 m2/g, and an oil absorption (DBP) of 300-500 ml/100 g; and D. 0.05-0.2 wt % crosslinking catalyst.
Abstract translation: 基于组合物的重量,具有小于1000欧姆 - 厘米的稳定体积电阻率的可交联的,半导电的,无过氧化物的热塑性组合物包括:A.60-90重量%的硅烷官能化聚乙烯; B.含有两个或更多个官能端基的0.5-20wt%有机聚硅氧烷; C.10-20重量%的高导电率炭黑,例如平均粒度为50nm以下的炭黑,700-1250m 2 / g的表面积(BET)和70-1250m 2 / g的吸油量(DBP) 300-500ml / 100g; 和D. 0.05-0.2重量%的交联催化剂。
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19.
公开(公告)号:US20130118583A1
公开(公告)日:2013-05-16
申请号:US13667744
申请日:2012-11-02
Applicant: Dow Global Technologies LLC
Inventor: Rajen M. Patel , Shaofu Wu , Mark T. Bernius , Mohamed Esseghir , Robert L. McGee , Michael H. Mazor , John A. Naumovitz
IPC: H01L31/048 , H01L31/18
CPC classification number: H01L31/0481 , B32B17/10018 , B32B17/10678 , B32B2457/12 , C08L51/06 , H01L31/18 , Y02E10/50 , C08L2666/02 , C08L2666/04
Abstract: An electronic device module comprising: A. At least one electronic device, e.g., a solar cell, and B. A polymeric material in intimate contact with at least one surface of the electronic device, the polymeric material comprising (1) a polyolefin copolymer with at least one of (a) a density of less than about 0.90 g/cc, (b) a 2% secant modulus of less than about 150 megaPascal (mPa) as measured by ASTM D-882-02), (c) a melt point of less than about 95 C, (d) an ∀-olefin content of at least about 15 and less than about 50 wt % based on the weight of the polymer, (e) a Tg of less than about −35 C, and (f) a SCBDI of at least about 50, (2) optionally, free radical initiator, e.g., a peroxide or azo compound, or a photoinitiator, e.g., benzophenone, and (3) optionally, a co-agent. Typically, the polyolefin copolymer is an ethylene/∀-olefin copolymer. Optionally, the polymeric material can further comprise a vinyl silane and/or a scorch inhibitor, and the copolymer can remain uncrosslinked or be crosslinked.
Abstract translation: 一种电子设备模块,包括:A.至少一个电子设备,例如太阳能电池和B.与所述电子设备的至少一个表面紧密接触的聚合物材料,所述聚合材料包含(1)聚烯烃共聚物, (a)小于约0.90g / cc的密度,(b)通过ASTM D-882-02测量的小于约150兆帕(mPa)的2%割线模量中的至少一个),(c) 熔点小于约95℃,(d)基于聚合物的重量,至少约15至小于约50重量%的烯烃含量,(e)小于约-35℃的Tg, 和(f)至少约50的SCBDI,(2)任选的自由基引发剂,例如过氧化物或偶氮化合物,或光引发剂,例如二苯甲酮,和(3)任选的助剂。 通常,聚烯烃共聚物是乙烯/∀-烯烃共聚物。 任选地,聚合物材料还可以包含乙烯基硅烷和/或焦烧抑制剂,并且共聚物可保持未交联或交联。
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公开(公告)号:US12240970B2
公开(公告)日:2025-03-04
申请号:US17634402
申请日:2020-11-03
Applicant: Dow Global Technologies LLC
Inventor: Karl M. Seven , Mohamed Esseghir , Jeffrey M. Cogen
Abstract: A method includes steps of (a) blending a polymeric composition, including: (i) 5 wt % to 45 wt % of a silanol-functionalized polyolefin based on a total weight of the polymeric composition; (ii) 55 wt % to 90 wt % of a polybutylene terephthalate based on a total weight of the polymeric composition having a melt flow index from 21 g/10 min. to 35 g/10 min. at 250° C. and 2.16 kg; (iii) a condensation catalyst; and (iv) 0.5 wt % to 10 wt % of hydroxy terminated poly(dimethylsiloxane) based on a total weight of the polymeric composition; and (b) extruding the polymeric composition.
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