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公开(公告)号：US20100266236A1
公开(公告)日：2010-10-21
申请号：US12424273
申请日：2009-04-15
CPC分类号： G02B6/4249 , Y10T29/49117
摘要： A parallel optical communications device is provided that has a mounting core that functions as a mounting system for mounting core components of the parallel optical communications device. In addition, the mounting core functions as a heat dissipation system for the core components of the parallel optical communications device, and also protects the core components and other elements of the communications device from dust and damage that can be caused by handling and other factors. In addition to performing the aforementioned functions, the mounting core is configured to enable the parallel optical communications device to be made extremely small in size while also protecting signal integrity.
摘要翻译： 提供了一种并行光通信设备，其具有用作安装并行光通信设备的核心部件的安装系统的安装芯。 此外，安装芯体用作并行光通信设备的核心部件的散热系统，并且还保护通信设备的核心部件和其他元件免受可能由处理和其他因素引起的灰尘和损坏。 除了执行上述功能之外，安装芯被配置为使并行光通信设备的尺寸非常小，同时也保护信号完整性。
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公开(公告)号：US20140063743A1
公开(公告)日：2014-03-06
申请号：US13600334
申请日：2012-08-31
IPC分类号： H05K7/20
CPC分类号： G02B6/428 , G02B6/4269 , H05K1/0209 , H05K7/2039 , H05K7/2049 , H05K2201/10106 , H05K2201/10121 , H05K2201/10174
摘要： Heat dissipation resources are allocated in an optical communications module based on the sensitivity of electrical and optoelectronic components of the module to temperature. Components that have a higher sensitivity to temperature are allocated a greater proportion of available heat dissipation resources than components that have a lower sensitivity to temperature. In addition, heat dissipation resources that are allocated to components that have different sensitivities to temperature are thermally decoupled from one another.
摘要翻译： 散热资源根据模块的电气和光电组件对温度的灵敏度在光通信模块中分配。 具有较高温度敏感性的组件比具有较低温度敏感性的组分分配更多的可用散热资源。 此外，分配给具有不同温度敏感度的部件的散热资源彼此热分解。
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公开(公告)号：US20100289160A1
公开(公告)日：2010-11-18
申请号：US12844644
申请日：2010-07-27
IPC分类号： H01L23/49
CPC分类号： H01S5/02248 , G02B6/4201 , G02B6/4246 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/484 , H01L2224/4899 , H01L2224/49175 , H01L2224/78 , H01L2224/85201 , H01L2224/85205 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/3025 , H01S5/005 , H01S5/183 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds.
摘要翻译： 引线键保护器具有细长形状，其对应于沿着将半导体管芯连接到衬底上的电导体的微电子器件的边缘的细长的引线阵列。 在制造具有引线接合保护的微电子器件时，首先以常规方式形成引线。然后，引线键合保护器以沿着引线键阵列延伸的方向附接到器件，以至少部分地覆盖引线键。
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公开(公告)号：US20140056592A1
公开(公告)日：2014-02-27
申请号：US13595784
申请日：2012-08-27
CPC分类号： H04B10/40 , Y10T29/49826
摘要： In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.
摘要翻译： 在具有一个或多个光收发器模块和外壳的光电系统中，迫使空气通过收发器模块的内部以散发由光电子元件和电子元件产生的热量。
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15.发明申请公开(公告)号：US20140010552A1
公开(公告)日：2014-01-09
申请号：US13543930
申请日：2012-07-09
CPC分类号： H04B10/14 , G02B6/4278 , Y10T29/49117
摘要： A Z-pluggable optical communications module (OCM) is provided that contains multiple parallel OCMs (POCMs) and that is configured to be removably plugged into an opening formed in a front panel of an optical communications system. When the Z-pluggable OCM is plugged in a forward Z-direction into the opening formed in the front panel, an actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the downward Y-direction to cause the Z-pluggable OCM to be mounted on an upper surface of a motherboard PCB. In order to unplug the Z-pluggable OCM, the actuator mechanism is actuated to impart motion to the Z-pluggable OCM in the upward Y-direction to cause it to be dismounted from the motherboard PCB.
摘要翻译： 提供了一种可插拔光通信模块（OCM），其包含多个并行OCM（POCM），并且被配置为可移除地插入形成在光通信系统的前面板中的开口中。 当Z可插拔OCM插入到前面板中形成的开口的Z方向时，致动器机构被致动以向Z方向的可插拔OCM施加运动，以使可插拔的OCM 以安装在母板PCB的上表面上。 为了拔下可插拔的OCM，致动器机构被致动，以向上Y方向的Z可插拔OCM提供运动，使其从主板PCB上卸下。
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公开(公告)号：US20120219257A1
公开(公告)日：2012-08-30
申请号：US13036572
申请日：2011-02-28
申请人： David J.K. Meadowcroft , Paul Yu
发明人： David J.K. Meadowcroft , Paul Yu
CPC分类号： G02B6/4244 , G02B6/12004 , G02B6/4214 , G02B6/4226 , G02B6/4237 , G02B6/4257 , H05K1/0269 , H05K1/0274 , H05K3/303 , H05K2201/09918 , H05K2201/10121 , H05K2203/1305 , H05K2203/1327 , Y02P70/613 , Y10T29/4913
摘要： An optical assembly can be formed by providing a frame made of a plastic material on a surface of a printed circuit board (PCB), mounting at least one opto-electronic element on the surface of the PCB within the frame, and laser-welding a lens device onto the frame.
摘要翻译： 光学组件可以通过在印刷电路板（PCB）的表面上提供由塑料材料制成的框架，在框架内的PCB的表面上安装至少一个光电元件，并激光焊接 透镜装置到框架上。
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17.发明申请PROTECTIVE SOCKET FOR USE WITH A PARALLEL OPTICAL TRANSCEIVER MODULE FOR PROTECTING COMPONENTS OF THE MODULE FROM AIRBORNE MATTER 有权用于保护来自AIRBORNE MATTER模块组件的平行光收发模块的保护插座公开(公告)号：US20110268397A1
公开(公告)日：2011-11-03
申请号：US12772462
申请日：2010-05-03
CPC分类号： G02B6/4251 , G02B6/4214 , G02B6/4246 , G02B6/4249 , G02B6/4261 , G02B6/4284 , G02B6/4292
摘要： A protective socket is provided for use with a parallel optical transceiver module. When the parallel optical transceiver module is seated within a receptacle of the protective socket, the side walls and bottom that define the receptacle of the protective socket protect the internal components of the parallel optical transceiver module from dirt, dust, gases, and other airborne matter.
摘要翻译： 提供了一个用于并行光收发模块的保护插座。 当并行光收发器模块位于保护插座的插座中时，限定保护插座的插座的侧壁和底部保护并行光收发器模块的内部组件免受灰尘，灰尘，气体和其他空气物质的影响 。
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公开(公告)号：US20100007034A1
公开(公告)日：2010-01-14
申请号：US12169784
申请日：2008-07-09
CPC分类号： H01S5/02248 , G02B6/4201 , G02B6/4246 , H01L24/48 , H01L24/49 , H01L24/78 , H01L24/85 , H01L2224/48091 , H01L2224/484 , H01L2224/4899 , H01L2224/49175 , H01L2224/78 , H01L2224/85201 , H01L2224/85205 , H01L2224/8592 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/01033 , H01L2924/01082 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/3025 , H01S5/005 , H01S5/183 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds.
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