公开(公告)号：US07081375B2

公开(公告)日：2006-07-25

申请号：US10767136

申请日：2004-01-28

申请人： Joong-Hyun Baek ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Yun-Hyeok Im

发明人： Joong-Hyun Baek ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Yun-Hyeok Im

IPC分类号： H01L23/10

CPC分类号： H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

公开(公告)号：US06963033B2

公开(公告)日：2005-11-08

申请号：US10032478

申请日：2002-01-02

申请人： Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

发明人： Sang-Young Kim ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Seung-Kon Mok

IPC分类号： B23K33/00 ,  B23K1/00 ,  B23K35/02 ,  B23K35/14 ,  H01L21/60 ,  H01L23/12 ,  H01L23/485 ,  H05K1/11 ,  H05K3/34 ,  H05K1/16

CPC分类号： H01L24/10 ,  B23K1/0008 ,  B23K35/0222 ,  B23K35/0244 ,  B23K2101/40 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/0969 ,  H05K2201/10257 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12014 ,  Y10T428/12222 ,  H01L2224/29099 ,  H01L2924/00

摘要： An array of solder structures comprising a plurality of radially-curved exterior surfaces, each one enclosing a predetermined-sized cavity that can be used for flexibly joining together at predetermined conductive contact points two planar elements having dissimilar properties. By assembling the two planar elements in a tiered arrangement, one planar element having an array of annular conductive pads and the other planar element having either a corresponding array of annular or circular conductive pads, separated by an array of spherical solder balls comprised of solder and a fluxing agent, a hollow solder structure can be created during a melting and subsequent cooling of the solder compound. The plasticity/resiliency characteristics of the resulting hollow solder structure absorbs lateral movement of the two planar elements relative to each other without degradation of the solder joint.

摘要翻译： 一种焊料结构的阵列，包括多个径向弯曲的外表面，每个包围预定尺寸的空腔，其可以用于在预定的导电接触点处将两个具有不同特性的平面元件柔性地接合在一起。 通过以分层布置组装两个平面元件，一个平面元件具有环形导电焊盘的阵列，另一个平面元件具有相应的环形或圆形导电焊盘阵列，由阵列的球形焊球组成，焊球包括焊料和 可以在焊料化合物的熔化和随后的冷却期间产生助熔剂，中空焊料结构。 所得中空焊料结构的可塑性/弹性特性吸收两个平面元件相对于彼此的横向移动，而不会降低焊接接头。