公开(公告)号：US07081375B2

公开(公告)日：2006-07-25

申请号：US10767136

申请日：2004-01-28

申请人： Joong-Hyun Baek ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Yun-Hyeok Im

发明人： Joong-Hyun Baek ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Yun-Hyeok Im

IPC分类号： H01L23/10

CPC分类号： H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

公开(公告)号：US06756668B2

公开(公告)日：2004-06-29

申请号：US10232344

申请日：2002-08-30

申请人： Joong-Hyun Baek ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Yun-Hyeok Im

发明人： Joong-Hyun Baek ,  Ho-Jeong Moon ,  Dong-Kil Shin ,  Yun-Hyeok Im

IPC分类号： H01L2312

CPC分类号： H01L23/433 ,  H01L24/31 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00

摘要： A semiconductor package and a method for forming the same are provided. The semiconductor package comprises a chip having an active surface and a back surface. The semiconductor package further comprises a substrate having an upper surface and a lower surface opposite the upper surface. The chip is electrically connected to the upper surface of the substrate. A lid is thermally coupled to the back surface of the chip. A thermal interface material (TIM) is located between the chip and the lid. The TIM includes voids to reduce thermomechanical stresses applied on the chip and the TIM, thereby preventing package cracks.

公开(公告)号：US07372148B2

公开(公告)日：2008-05-13

申请号：US11274588

申请日：2005-11-14

申请人： Yun-Hyeok Im ,  Jae-Wook Yoo ,  Hee-Seok Lee

发明人： Yun-Hyeok Im ,  Jae-Wook Yoo ,  Hee-Seok Lee

IPC分类号： H01L23/34

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L23/473 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10158 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： The present invention relates to a semiconductor chip coolant path, a semiconductor package utilizing the semiconductor chip coolant path, and a cooling system for the semiconductor package. For effective dissipation of heat generated during semiconductor chip operation, a semiconductor chip having a coolant path formed through or adjacent to its backside and a semiconductor package utilizing the semiconductor chip are provided. In addition, a cooling system for the semiconductor package circulates a coolant through the coolant path within the semiconductor package to directly contact and cool the semiconductor chip.

摘要翻译： 本发明涉及半导体芯片冷却剂路径，利用半导体芯片冷却剂路径的半导体封装以及半导体封装的冷却系统。 为了有效消散在半导体芯片操作期间产生的热量，提供了具有形成在其背面或靠近其背面的冷却剂通道的半导体芯片以及利用半导体芯片的半导体封装。 此外，用于半导体封装的冷却系统使冷却剂循环通过半导体封装内的冷却剂路径，以直接接触和冷却半导体芯片。

公开(公告)号：US20070108599A1

公开(公告)日：2007-05-17

申请号：US11477547

申请日：2006-06-30

申请人： Yun-Hyeok Im ,  Jae-Wook Yoo

发明人： Yun-Hyeok Im ,  Jae-Wook Yoo

IPC分类号： H01L23/34

CPC分类号： H01L23/3675 ,  H01L23/142 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor chip package includes: a metal substrate having a core; a semiconductor chip mounted on the metal substrate; and a heat sink extending from the core.

摘要翻译： 半导体芯片封装包括：具有芯的金属基板; 安装在所述金属基板上的半导体芯片; 以及从芯延伸的散热片。

公开(公告)号：US08643179B2

公开(公告)日：2014-02-04

申请号：US13240302

申请日：2011-09-22

申请人： Yun-Hyeok Im ,  Jong-Yeon Kim ,  Tae-Je Cho ,  Un-Byoung Kang

发明人： Yun-Hyeok Im ,  Jong-Yeon Kim ,  Tae-Je Cho ,  Un-Byoung Kang

IPC分类号： H01L23/485

CPC分类号： H01L24/81 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/11001 ,  H01L2224/13025 ,  H01L2224/13075 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

摘要： Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump.

摘要翻译： 提供一种凸块结构，包括第一凸块和第二凸块，包括该凸块的半导体封装及其制造方法。 凸块结构包括：设置在基板的连接焊盘上的第一凸块，所述第一凸块包括从所述连接焊盘延伸的多个纳米线和连接所述多个纳米线的端部的主体; 以及设置在第一凸块的主体上的第二凸块。

公开(公告)号：US07601561B2

公开(公告)日：2009-10-13

申请号：US11585962

申请日：2006-10-25

申请人： Yun-Hyeok Im ,  Dong-Han Kim ,  Jae-Wook Yoo

发明人： Yun-Hyeok Im ,  Dong-Han Kim ,  Jae-Wook Yoo

IPC分类号： H01L21/44 ,  H01L29/40 ,  H01L23/29

CPC分类号： H01L23/4334 ,  H01L23/49572 ,  H01L24/50 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00

摘要： A tape carrier package may include an interposer having a first surface and a second surface. The first surface of the interposer may be attached to an exposed active surface of a semiconductor chip. A heat sink may be attached to the second surface of the interposer.

摘要翻译： 带状载体封装可以包括具有第一表面和第二表面的插入件。 插入器的第一表面可以附接到半导体芯片的暴露的有源表面。 散热器可以附接到插入件的第二表面。

公开(公告)号：US20060075760A1

公开(公告)日：2006-04-13

申请号：US11217597

申请日：2005-08-31

申请人： Yun-Hyeok Im ,  Suk-Chae Kang ,  Hee-Seok Lee

发明人： Yun-Hyeok Im ,  Suk-Chae Kang ,  Hee-Seok Lee

IPC分类号： F25B21/02 ,  F25D23/12 ,  H01L35/28 ,  F24F7/00

CPC分类号： H01L22/34 ,  H01L23/34 ,  H01L2924/0002 ,  H01L2924/00

摘要： An embodiment relates to a temperature measuring device using a matrix switch, and a semiconductor package. In another embodiment a cooling system may be included. A plurality of temperature sensors may be arranged on a surface of a semiconductor device. The matrix switch may select the temperature sensors by an address method to form a circuit that includes the selected temperature sensor. A measuring unit may receive an output signal of the selected temperature sensor to calculate the temperature at the selected temperature sensor.

摘要翻译： 实施例涉及使用矩阵开关的温度测量装置和半导体封装。 在另一个实施例中，可以包括冷却系统。 多个温度传感器可以布置在半导体器件的表面上。 矩阵开关可以通过地址方法来选择温度传感器，以形成包括所选温度传感器的电路。 测量单元可以接收所选温度传感器的输出信号，以计算所选温度传感器的温度。

公开(公告)号：US20050189093A1

公开(公告)日：2005-09-01

申请号：US11064957

申请日：2005-02-25

申请人： Yun-Hyeok Im

发明人： Yun-Hyeok Im

IPC分类号： H01L23/427 ,  F28F3/12 ,  F28F13/00 ,  F28F21/08 ,  H01L23/373 ,  H01L23/473 ,  F28F13/18

CPC分类号： H01L23/473 ,  F28F3/12 ,  F28F13/00 ,  F28F21/089 ,  F28F2255/18 ,  H01L23/3733 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： An apparatus and method for manufacturing a heat transfer device for a semiconductor device are provided. The method of manufacturing the heat transfer device may include at least providing a composite material film having uniformly dispersed metal powder and binder powder and a region intended for a fluid channel packed with a packing material, melting the binder powder by heating the composite material film, pressing the metal powder, sintering the metal powder to form the thin film metal sintered body, and forming the fluid channel inside the thin film metal sintered body by removing the packing structure.

摘要翻译： 提供一种用于制造用于半导体器件的传热装置的装置和方法。 制造传热装置的方法可以包括至少提供具有均匀分散的金属粉末和粘合剂粉末的复合材料膜和用于填充有填充材料的流体通道的区域，通过加热复合材料膜来熔化粘合剂粉末， 压制金属粉末，烧结金属粉末以形成薄膜金属烧结体，并通过去除包装结构在薄膜金属烧结体内部形成流体通道。

公开(公告)号：US20070216016A1

公开(公告)日：2007-09-20

申请号：US11585962

申请日：2006-10-25

申请人： Yun-Hyeok Im ,  Dong-Han Kim ,  Jae-Wook Yoo

发明人： Yun-Hyeok Im ,  Dong-Han Kim ,  Jae-Wook Yoo

IPC分类号： H01L23/52

CPC分类号： H01L23/4334 ,  H01L23/49572 ,  H01L24/50 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00

摘要： A tape carrier package may include an interposer having a first surface and a second surface. The first surface of the interposer may be attached to an exposed active surface of a semiconductor chip. A heat sink may be attached to the second surface of the interposer.

摘要翻译： 带状载体封装可以包括具有第一表面和第二表面的插入件。 插入器的第一表面可以附接到半导体芯片的暴露的有源表面。 散热器可以附接到插入件的第二表面。

公开(公告)号：US20060012019A1

公开(公告)日：2006-01-19

申请号：US11173852

申请日：2005-06-30

申请人： Suk-Chae Kang ,  Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim ,  Yun-Hyeok Im ,  Gu-Sung Kim

发明人： Suk-Chae Kang ,  Si-Hoon Lee ,  Sa-Yoon Kang ,  Dong-Han Kim ,  Yun-Hyeok Im ,  Gu-Sung Kim

IPC分类号： H01L23/02

CPC分类号： H01L23/3675 ,  H01L23/13 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/12044 ,  H01L2924/15312 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.

摘要翻译： 半导体封装包括半导体芯片，形成有线图形的电路板，以及包括插入电路板的开口部分的半导体芯片所在的金属结构体。 随着半导体芯片与金属结构直接接触，热特性得到改善。 由于电路板由金属结构支撑，机械稳定性提高。