公开(公告)号：US09393595B2

公开(公告)日：2016-07-19

申请号：US13950066

申请日：2013-07-24

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Masayuki Nakanishi ,  Kenya Ito

IPC: B05D5/02 ,  B24D11/00

CPC classification number: B24D11/003 ,  B05D5/02 ,  B24D11/00 ,  B24D11/001

Abstract: A method for fabricating an abrasive firm includes preparing a base film, coating the base film with a first paint which contains no abrasive grain but contains a binder resin, and drying the paint to form a first layer. The method further includes coating the first layer with a second paint which contains the abrasive grains and the binder resin, and drying the paint to form a second layer. The method further includes heating the first layer and the second layer for imidization.

Abstract translation: 制造磨料制品的方法包括制备基膜，用不含磨粒但含有粘合剂树脂的第一涂料涂覆基膜，并干燥涂料以形成第一层。 该方法还包括用含有磨料颗粒和粘合剂树脂的第二种涂料涂覆第一层，并干燥涂料以形成第二层。 该方法还包括加热第一层和第二层以进行酰亚胺化。

公开(公告)号：US12036634B2

公开(公告)日：2024-07-16

申请号：US16338931

申请日：2017-09-07

Applicant: Ebara Corporation

Inventor： Koichi Takeda ,  Tsuneo Torikoshi ,  Kunio Oishi ,  Katsuhide Watanabe ,  Hozumi Yasuda ,  Yu Ishii

IPC: B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

CPC classification number: B24B37/005 ,  B24B37/12 ,  B24B37/14 ,  B24B49/03 ,  B24B49/04 ,  B24B55/06 ,  H01L21/304

Abstract: A local polishing system comprises: a particle estimation unit (30) for estimating the film thickness distribution of a wafer; a local polishing region setting unit (11) for setting a local polishing region on the wafer based on the film thickness distribution; a polishing head selection unit (12) for selecting a polishing head based on the size of the local polishing region; a model storage (20) holding a recipe generating model that defines the relation between an input node and an output node, the input node being an attribute of the local polishing region, the output node comprising a recipe for a polishing process; a polishing recipe generator (13) that puts an attribute of the local polishing region set by the local polishing region setting unit (11) into the input node of the recipe generating model and determines a polishing recipe for polishing the local polishing region; and a polishing recipe transmitter (15) for transmitting data of the polishing recipe to a local polishing module (200) that performs local polishing.

公开(公告)号：US11139160B2

公开(公告)日：2021-10-05

申请号：US16184694

申请日：2018-11-08

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Keisuke Uchiyama

IPC: B24B1/00 ,  B24B41/06 ,  H01L21/02 ,  B24B21/06 ,  H01L21/67 ,  B24B37/10 ,  B24B21/00 ,  B24B9/06 ,  H01L21/683 ,  H01L21/687

Abstract: An apparatus and a method which can perform different processes, such as polishing and cleaning, on a surface of a substrate, such as a wafer, with a single processing head, and can process the surface of the substrate efficiently are disclosed. The apparatus includes: a substrate holder configured to hold a substrate and rotate the substrate; and a processing head configured to bring scrubbing tapes into contact with a first surface of the substrate to process the first surface. The processing head includes: pressing members arranged to press the scrubbing tapes against the first surface of the substrate; position switching devices configured to be able to switch positions of the pressing members between processing positions and retreat positions; tape feeding reels configured to feed the scrubbing tapes, respectively; and tape take-up reels configured to take up the scrubbing tapes, respectively.

公开(公告)号：US20210170543A1

公开(公告)日：2021-06-10

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US20190262869A1

公开(公告)日：2019-08-29

申请号：US16405559

申请日：2019-05-07

Applicant: EBARA CORPORATION ,  TOSHIBA MEMORY CORPORATION

Inventor： Yu Ishii ,  Hiroyuki Kawasaki ,  Kenichi Nagaoka ,  Kenya Ito ,  Masako Kodera ,  Hiroshi Tomita ,  Takeshi Nishioka

IPC: B08B1/00 ,  H01L21/67 ,  H01L21/687

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

公开(公告)号：US09808903B2

公开(公告)日：2017-11-07

申请号：US14167934

申请日：2014-01-29

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Kenya Ito ,  Masayuki Nakanishi ,  Tetsuji Togawa

IPC: B24B21/06 ,  B24B37/04 ,  B24B37/30 ,  B24B7/22 ,  B24B21/00

CPC classification number: B24B7/228 ,  B24B21/004 ,  B24B21/06 ,  B24B37/04 ,  B24B37/042 ,  B24B37/30

Abstract: A polishing method which can remove foreign matters from an entire back surface of a substrate at a high removal rate is provided. The polishing method includes placing a polishing tool in sliding contact with an outer circumferential region of a back surface of a substrate while holding a center-side region of the back surface of the substrate, and placing a polishing tool in sliding contact with the center-side region of the back surface of the substrate while holding a bevel portion of the substrate to polish the back surface in its entirety.

公开(公告)号：US09808836B2

公开(公告)日：2017-11-07

申请号：US14316709

申请日：2014-06-26

Applicant: EBARA CORPORATION

Inventor： Tetsuji Togawa ,  Kenya Ito ,  Yu Ishii ,  Keisuke Uchiyama

IPC: B08B1/04 ,  H01L21/304 ,  H01L21/687 ,  B24B37/10 ,  B24B37/30 ,  B08B1/00 ,  H01L21/67

CPC classification number: B08B1/04 ,  B08B1/001 ,  B08B1/006 ,  B24B37/10 ,  B24B37/107 ,  B24B37/30 ,  H01L21/304 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/687 ,  H01L21/68728

Abstract: There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.

公开(公告)号：US11701750B2

公开(公告)日：2023-07-18

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

CPC classification number: B24B37/32 ,  H01L21/6838

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US11446784B2

公开(公告)日：2022-09-20

申请号：US16412562

申请日：2019-05-15

Applicant: EBARA CORPORATION ,  FUJIMI INCORPORATED

Inventor： Yu Ishii ,  Kenya Ito ,  Hitoshi Morinaga ,  Kazusei Tamai ,  Shingo Ohtsuki ,  Hiroshi Asano

IPC: B24B9/06 ,  B24B5/04 ,  B24B19/08 ,  B24B37/005 ,  B24B37/04 ,  B24B49/00 ,  B24B9/10 ,  B24B5/36 ,  B24B37/10 ,  B24B37/24 ,  B24B37/30

Abstract: The present invention relates to a chemical mechanical polishing (CMP) apparatus for polishing a workpiece, such as a metal body, to a mirror finish. The chemical mechanical polishing apparatus includes: a polishing pad (2) having an annular polishing surface (2a) which has a curved vertical cross-section; a workpiece holder (11) for holding a workpiece (W) having a polygonal shape; a rotating device (15) configured to rotate the workpiece holder (11) about an axis of the workpiece (W); a pressing device (14) configured to press a periphery of the workpiece (W) against the annular polishing surface (2a); and an operation controller (25) configured to change a speed at which the rotating device (15) rotates the workpiece (W) according to a rotation angle of the workpiece (W). The pressing device (14) is disposed more inwardly than the workpiece holder (11) in a radial direction of the polishing table (3).

公开(公告)号：US11436392B2

公开(公告)日：2022-09-06

申请号：US15982814

申请日：2018-05-17

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Keisuke Uchiyama ,  Kunio Oishi ,  Hiroyuki Takenaka

IPC: G06F17/18 ,  G06F30/20 ,  H01L21/67 ,  G06N3/08 ,  G06N5/00 ,  G06F111/10

Abstract: A substrate processing apparatus for processing a substrate includes a setting device that sets a plurality of recipe items including operation conditions of the substrate processing apparatus and a recipe generating device that acquires a plurality of recipe models obtained by changing values of the plurality of recipe items and experimenting or simulating a processing result of the substrate and analyzes the plurality of recipe models to generate a recipe, the recipe generating device combining a part or all of the plurality of recipe models to generate the recipe such that a calculation value of a processing result of the substrate by the recipe satisfies a predetermined condition.