公开(公告)号：US06894091B2

公开(公告)日：2005-05-17

申请号：US09883276

申请日：2001-06-19

申请人： Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

发明人： Shoichi Osada ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Takayuki Aoki ,  Shigeki Ino

IPC分类号： C08K3/00 ,  C08G59/28 ,  C08G59/62 ,  C08K9/02 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08K5/00

CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  C08L61/04 ,  H01L2924/00

摘要： A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, and (D) 300-900 parts by weight per 100 parts by weight of components (A) and (B) combined of an inorganic filler contains nitrogen atoms in an amount of 1.5-20% by weight based on the weight of components (A) and (B) combined. Cured parts of the composition exhibit high-temperature capabilities and flame retardance despite the absence of halogenated epoxy resins and antimony trioxide.

摘要翻译： 一种半导体封装环氧树脂组合物，其包含（A）环氧树脂，（B）酚醛树脂固化剂，（C）钼化合物和（D）每100重量份组分（A）300-900重量份， 和（B）组合的无机填料含有以组分（A）和（B）的重量计为1.5-20重量％的氮原子。 尽管没有卤化环氧树脂和三氧化锑，组合物的固化部分表现出高温能力和阻燃性。

公开(公告)号：US5175199A

公开(公告)日：1992-12-29

申请号：US651438

申请日：1991-02-07

申请人： Eiichi Asano ,  Takaaki Shimizu ,  Masatoshi Takita ,  Toshio Shiobara ,  Koji Futatsumori ,  Kazuhiro Arai

发明人： Eiichi Asano ,  Takaaki Shimizu ,  Masatoshi Takita ,  Toshio Shiobara ,  Koji Futatsumori ,  Kazuhiro Arai

IPC分类号： C03C1/00 ,  C03C12/00 ,  C08K7/20 ,  H01L33/56

CPC分类号： C03C12/00 ,  C03C1/006 ,  C08K7/20 ,  H01L33/56

摘要： High transparency silica-titania glass beads are characterized by a linear transmittance of at least 70% as measured at a wavelength of 900 nm to 600 nm by a specific measurement method. Such beads are prepared by hydrolyzing and polycondensing a silicon alkoxide and a titanium alkoxide to form a silica-titania sol, converting the sol into a dry gel, and then grinding the gel followed by heating or heating the gel followed by grinding. A light transmisson epoxy resin composition comprising a curable epoxy resin, a curing agent, and the high tranparency silica-titania glass beads has crack resistance and high transparency in cured state. It is useful in encapsulating optical semiconductor devices.

公开(公告)号：US06794058B2

公开(公告)日：2004-09-21

申请号：US10350110

申请日：2003-01-24

申请人： Tsuyoshi Honda ,  Tatsuya Kanamaru ,  Eiichi Asano ,  Toshio Shiobara

发明人： Tsuyoshi Honda ,  Tatsuya Kanamaru ,  Eiichi Asano ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： C08K3/22 ,  C08K3/36 ,  C08K2003/2237 ,  Y10T428/12528 ,  C08L63/00

摘要： A flip-chip type semiconductor device sealed with a light transmissive epoxy resin composition comprising (A) an epoxy resin having the following general formula (i):  wherein n is 0 or a positive number, (B) a curing accelerator, and (C) an amorphous silica-titania co-melt as at least one of inorganic fillers, said composition satisfying the relationship of the following formula (1): [ { 2 ⁢ ( n A 2 + n C 2 ) - ( n A + n C ) 2 } / 2 ] 1 / 2

摘要翻译： 一种用透光性环氧树脂组合物密封的倒装芯片型半导体器件，其包含（A）具有以下通式（i）的环氧树脂：其中n为0或正数，（B）固化促进剂和（C ）无定形二氧化硅 - 二氧化钛共熔体作为无机填料中的至少一种，所述组合物满足下式（1）的关系：其中nA是组合物的固化产物在25℃以下的折射率，不包括 无机填料，nC是25℃下的无机填料的折射率。

公开(公告)号：US6001901A

公开(公告)日：1999-12-14

申请号：US993867

申请日：1997-12-18

申请人： Toshio Shiobara ,  Eiichi Asano ,  Shigeki Ino ,  Kazutoshi Tomiyoshi

发明人： Toshio Shiobara ,  Eiichi Asano ,  Shigeki Ino ,  Kazutoshi Tomiyoshi

IPC分类号： C08K3/36 ,  C08L63/00 ,  C08L63/02

CPC分类号： C08L63/00 ,  C08K3/36

摘要： An epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler has a melt viscosity of at most 150 poise at 175.degree. C. The inorganic filler has a BET specific surface area of 1.5-6 m.sup.2 /g and is such that when a 75/25 mixture of the inorganic filler and a bisphenol F type liquid epoxy resin is measured for viscosity at shear rates of 0.6/sec. and 10/sec. at a temperature of 25.+-.0.05.degree. C. by an E type viscometer, the ratio of the viscosity at 0.6/sec. to the viscosity at 10/sec. is at least 3.5/1. The amount of the inorganic filler loaded is 80-90% by weight of the composition. The composition is suitable for the encapsulation of matrix frames.

摘要翻译： 包含环氧树脂，固化剂和无机填料的环氧树脂组合物在175℃下的熔融粘度至多为150泊。无机填料的BET比表面积为1.5-6m 2 / g，为 当以0.6 /秒的剪切速率测量无机填料和双酚F型液体环氧树脂的75/25混合物的粘度时。 和10 /秒。 通过E型粘度计在25 +/- 0.05℃的温度下，粘度在0.6 /秒的比例。 以10 /秒的粘度。 至少为3.5 / 1。 无机填料的加入量为组合物重量的80-90％。 该组合物适用于矩阵框架的封装。

公开(公告)号：US5935314A

公开(公告)日：1999-08-10

申请号：US919344

申请日：1997-08-28

申请人： Noriaki Higuchi ,  Takaaki Fukumoto ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi

发明人： Noriaki Higuchi ,  Takaaki Fukumoto ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi

IPC分类号： C08K3/00 ,  C08K7/16 ,  C08K7/18 ,  C08L63/00 ,  C09C1/30 ,  C09C3/04 ,  H01L23/29 ,  H01L23/31 ,  C04B14/00

CPC分类号： H01L23/295 ,  C08K7/18 ,  C09C1/3009 ,  C09C3/04 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/22 ,  C01P2006/80 ,  H01L2924/0002 ,  Y10T428/12528

摘要： By removing a fraction of fine particles having a particle size of less than 2 .mu.m from starting inorganic filler particles having a mean particle size of 10-50 .mu.m and adding thereto particles having a mean particle size of 0.1-2 .mu.m and a specific surface area of 3-10 m.sup.2 /g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 .mu.m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.

摘要翻译： 通过从平均粒径为10-50μm的起始无机填料颗粒中除去一小部分粒径小于2μm的细颗粒，并加入平均粒度为0.1-2μm的颗粒和 比表面积为3-10m2 / g（BET），得到平均粒径为5-40μm的颗粒状无机填料。 当大量的无机填料装载在环氧树脂组合物中时，该组合物保持足够低的熔体粘度以成型，并且对于封装半导体器件而言不会引起芯片焊盘的变形和焊丝变形。 封装的半导体器件是高度可靠的。

公开(公告)号：US07943706B2

公开(公告)日：2011-05-17

申请号：US11386667

申请日：2006-03-23

申请人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

发明人： Yasuo Kimura ,  Eiichi Asano ,  Toshio Shiobara ,  Takayuki Aoki

IPC分类号： C08F283/00 ,  B32B27/38 ,  C08G59/50

CPC分类号： H01L23/293 ,  C08G59/245 ,  C08G59/3218 ,  C08G59/621 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/31511 ,  C08L2666/16 ,  H01L2924/00

摘要： An epoxy resin composition comprising(A) at least one epoxy resin comprising (a) a naphthalene ring-containing epoxy resin having at least one substituted or unsubstituted naphthalene ring in a molecule and having an epoxy equivalent of 175 to 210,(B) a phenolic resin having at least one substituted or unsubstituted naphthalene ring in a molecule, and(C) an inorganic filler,the substituted or unsubstituted naphthalene ring of the epoxy resin (a) being contained in an amount of 45 to 60% by weight in the total amount of the epoxy resin (A) is best suited for semiconductor encapsulation because it has good flow, a low coefficient of linear expansion, a high Tg, minimal moisture absorption, and crack resistance upon lead-free soldering.

摘要翻译： 一种环氧树脂组合物，其包含（A）至少一种环氧树脂，其包含（a）在分子中具有至少一个取代或未取代的萘环并且具有175至210的环氧当量的含萘环的环氧树脂，（B） 在分子中具有至少一个取代或未取代的萘环的酚醛树脂和（C）无机填料，所述环氧树脂（a）中的取代或未取代的萘环的含量为45〜60重量％ 环氧树脂（A）的总量最适合于半导体封装，因为它具有良好的流动性，低的线性膨胀系数，高的Tg，最小的吸湿性和无铅焊接时的抗裂纹性。

公开(公告)号：US06723452B2

公开(公告)日：2004-04-20

申请号：US10196222

申请日：2002-07-17

申请人： Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

发明人： Yasuo Kimura ,  Kazutoshi Tomiyoshi ,  Tarou Shimoda ,  Eiichi Asano ,  Takayuki Aoki ,  Toshio Shiobara

IPC分类号： H01L2912

CPC分类号： H01L23/293 ,  C08G59/20 ,  C08G59/245 ,  C08G59/3218 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L2666/22 ,  H01L2924/00

摘要： Epoxy resin compositions comprising (A) an epoxy resin having an epoxy equivalent of at least 185 and possessing a structure in which two benzene rings can be directly conjugated, carbon atoms having an sp2 type atomic orbital accounting for at least 50% of all the carbon atoms, (B) a &bgr;-naphthol type phenolic resin curing agent, (C) a curing accelerator, and (D) an inorganic filler cure into products having satisfactory solder crack resistance on use of lead-free solder and improved flame retardance despite the absence of halogenated epoxy resins and antimony compounds and are thus suited for semiconductor encapsulation.

摘要翻译： 环氧树脂组合物，其包含（A）环氧当量至少为185的具有两个苯环可以直接键合的结构的环氧树脂，具有sp 2类型原子轨道的碳原子占至少50％ 所有碳原子，（B）β-萘酚型酚醛树脂固化剂，（C）固化促进剂，和（D）无机填料固化成使用无铅焊料和改善火焰时具有令人满意的耐焊料裂纹性的产品 尽管不存在卤化环氧树脂和锑化合物，因此适用于半导体封装。

公开(公告)号：US06518332B2

公开(公告)日：2003-02-11

申请号：US09841046

申请日：2001-04-25

申请人： Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Masachika Yoshino ,  Toshio Shiobara ,  Shoichi Osada

发明人： Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Masachika Yoshino ,  Toshio Shiobara ,  Shoichi Osada

IPC分类号： C08K310

CPC分类号： H01L23/293 ,  C08G59/3218 ,  C08K9/12 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L61/04 ,  H01L2924/00

摘要： Semiconductor encapsulating epoxy resin compositions comprising an epoxy resin, a phenolic resin curing agent, a fire retardant comprising zinc molybdate carried on spherical silica having a mean particle diameter of 0.2-20 &mgr;m and a specific surface of 1-20 m2/g, and an inorganic filler are able to provide cured products having excellent fire retardance. The compositions have good flow and curing properties and excellent reliability and do not pose a hazard to human health or the environment.

公开(公告)号：US06274251B1

公开(公告)日：2001-08-14

申请号：US09337520

申请日：1999-06-22

申请人： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Shoichi Osada ,  Toshio Shiobara

发明人： Kenji Ohashi ,  Tatsuya Ishizaki ,  Masayuki Umeno ,  Eiichi Asano ,  Kazutoshi Tomiyoshi ,  Shoichi Osada ,  Toshio Shiobara

IPC分类号： C09D16300

CPC分类号： H01L23/293 ,  C08G59/688 ,  C08L63/00 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L61/04 ,  H01L2924/00

摘要： An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.

摘要翻译： 环氧树脂组合物含有（A）环氧树脂，（B）酚醛树脂固化剂，（C）固化催化剂和（D）无机填料。 催化剂是与具有至少两个羟基的酚醛树脂混合并反应的季磷化合物或季磷化合物。 该组合物是有效流动的，可模制的和可固化的，因此适合于半导体封装。

公开(公告)号：US06207296B1

公开(公告)日：2001-03-27

申请号：US09326588

申请日：1999-06-07

申请人： Noriaki Higuchi ,  Takaaki Fukumoto ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi

发明人： Noriaki Higuchi ,  Takaaki Fukumoto ,  Toshio Shiobara ,  Eiichi Asano ,  Kazutoshi Tomiyoshi

IPC分类号： H01L2912

CPC分类号： H01L23/295 ,  C01P2004/32 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/22 ,  C01P2006/80 ,  C08K7/18 ,  C09C1/3009 ,  C09C3/04 ,  H01L2924/0002 ,  Y10T428/12528 ,  C08L63/00 ,  H01L2924/00

摘要： By removing a fraction of fine particles having a particle size of less than 2 &mgr;m from starting inorganic filler particles having a mean particle size of 10-50 mm and adding thereto particles having a mean particle size of 0.1-2 &mgr;m and a specific surface area of 3-10 m2/g (BET), there is obtained a particulate inorganic filler having a mean particle size of 5-40 &mgr;m. When a large amount of the inorganic filler is loaded in an epoxy resin composition, the composition maintains a low melt viscosity enough to mold and is effective for encapsulating a semiconductor device without causing die pad deformation and wire deformation. The encapsulated semiconductor device is highly reliable.

摘要翻译： 通过从平均粒径为10-50mm的起始无机填料颗粒中除去粒径小于2μm的一部分细粒，并加入平均粒径为0.1-2μm的颗粒和比表面积 为3-10m 2 / g（BET），得到平均粒度为5-40μm的颗粒状无机填料。 当大量的无机填料装载在环氧树脂组合物中时，该组合物保持足够低的熔体粘度以成型，并且对于封装半导体器件而言不会引起芯片焊盘的变形和焊丝变形。 封装的半导体器件是高度可靠的。