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公开(公告)号：US20090007241A1
公开(公告)日：2009-01-01
申请号：US12107734
申请日：2008-04-22
IPC分类号： H04L9/32
CPC分类号： H04L63/0428 , H04L12/14 , H04L29/12066 , H04L29/12113 , H04L61/1511 , H04L61/1541 , H04L63/061 , H04L63/08 , H04L63/10 , H04L63/104 , H04L63/126 , H04L67/02 , H04L67/06 , H04L67/1002 , H04L67/1008 , H04L67/101 , H04L67/1014 , H04L67/1023 , H04L67/1027 , H04L67/1095 , H04L67/2852 , H04L69/329
摘要： A secure streaming content delivery system provides a plurality of content servers connected to a network that host customer content that can be cached and/or stored, e.g., images, video, text, and/or software. The content servers respond to requests for customer content from users. The invention load balances user requests for cached customer content to the appropriate content server. A user makes a request to a customer's server/authorization server for delivery of the customer's content. The authorization server checks if the user is authorized to view the requested content. If the user is authorized, then the authorization server generates a hash value using the authorization server's secret key, the current time, a time-to-live value, and any other information that the customer has configured, and embeds it into the URL which is passed to the user. A content server receives a URL request from the user for customer content cached on the content server. The request is verified by the content server creating its own hash value using the customer server's secret key, the current time, a time-to-live value, and any other related information configured for the customer. If the hash value from the URL matches the content server's generated hash value, then the user's request is valid and within the expiration time period and the content server delivers the requested content to the user.
摘要翻译： 安全流式传输内容传送系统提供连接到网络的多个内容服务器，该网络主持可缓存和/或存储客户内容，例如图像，视频，文本和/或软件。 内容服务器响应用户对客户内容的请求。 本发明将缓存的客户内容的用户请求负载平衡到适当的内容服务器。 用户向客户的服务器/授权服务器请求传送客户的内容。 授权服务器检查用户是否被授权查看请求的内容。 如果用户被授权，则授权服务器使用授权服务器的秘密密钥，当前时间，生存时间值以及客户已经配置的任何其他信息来生成哈希值，并将其嵌入到URL中 被传递给用户。 内容服务器从用户接收缓存在内容服务器上的客户内容的URL请求。 该请求由内容服务器使用客户服务器的密钥，当前时间，生存时间值以及为客户配置的任何其他相关信息创建自己的散列值进行验证。 如果来自URL的哈希值与内容服务器生成的哈希值匹配，则用户的请求是有效的，并且在到期时间段内，并且内容服务器将所请求的内容递送给用户。
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公开(公告)号：US07363361B2
公开(公告)日：2008-04-22
申请号：US10234723
申请日：2002-09-03
IPC分类号： G06F15/173
CPC分类号： H04L63/0428 , H04L12/14 , H04L29/12066 , H04L29/12113 , H04L61/1511 , H04L61/1541 , H04L63/061 , H04L63/08 , H04L63/10 , H04L63/104 , H04L63/126 , H04L67/02 , H04L67/06 , H04L67/1002 , H04L67/1008 , H04L67/101 , H04L67/1014 , H04L67/1023 , H04L67/1027 , H04L67/1095 , H04L67/2852 , H04L69/329
摘要： A secure streaming content delivery system provides a plurality of content servers connected to a network that host customer content that can be cached and/or stored, e.g., images, video, text, and/or software. The content servers respond to requests for customer content from users. The invention load balances user requests for cached customer content to the appropriate content server. A user makes a request to a customer's server/authorization server for delivery of the customer's content. The authorization server checks if the user is authorized to view the requested content. If the user is authorized, then the authorization server generates a hash value and embeds it into the URL which is passed to the user. A content server receives a URL request from the user for customer content cached on the content server. The request is verified by the content server.
摘要翻译： 安全流式传输内容传送系统提供连接到网络的多个内容服务器，该网络主持可缓存和/或存储客户内容，例如图像，视频，文本和/或软件。 内容服务器响应用户对客户内容的请求。 本发明将缓存的客户内容的用户请求负载平衡到适当的内容服务器。 用户向客户的服务器/授权服务器请求传送客户的内容。 授权服务器检查用户是否被授权查看请求的内容。 如果用户被授权，则授权服务器生成哈希值并将其嵌入到传递给用户的URL中。 内容服务器从用户接收缓存在内容服务器上的客户内容的URL请求。 请求由内容服务器进行验证。
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13.发明申请SEMICONDUCTOR DEVICE WITH PACKAGE-LEVEL DECOUPLING CAPACITORS FORMED WITH BOND WIRES 审中-公开具有捆绑线形式的封装级解耦电容器的半导体器件公开(公告)号：US20150221592A1
公开(公告)日：2015-08-06
申请号：US14170651
申请日：2014-02-03
IPC分类号： H01L23/522 , H01L23/00
CPC分类号： H01L24/49 , H01L23/5223 , H01L24/48 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/48091 , H01L2224/48101 , H01L2224/4813 , H01L2224/48464 , H01L2224/4903 , H01L2224/49052 , H01L2224/49097 , H01L2224/4911 , H01L2224/49111 , H01L2224/49175 , H01L2224/49431 , H01L2924/00014 , H01L2924/1205 , H01L2924/14 , H01L2924/181 , H01L2924/19104 , H01L2224/45099 , H01L2224/05599 , H01L2924/00
摘要： A decoupling capacitor (decap) for circuitry (e.g., an I/O interface) in a semiconductor die is formed using one or more pairs of (parallel) bond wires wire-bonded to bond pads on a top surface of the die. Depending on the implementation, the pairs of bond wires may be horizontally or vertically aligned and may be bonded to I/O and/or array bond pads.
摘要翻译： 用半导体管芯中的电路（例如，I / O接口）的去耦电容器（decap）是使用一对或多对引线键合到管芯顶表面上的接合焊盘的（平行）接合线形成的。 根据实施方式，这对接合线可以是水平或垂直对准的并且可以结合到I / O和/或阵列接合焊盘。
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14.发明公开公开(公告)号：US20240163185A1
公开(公告)日：2024-05-16
申请号：US18416898
申请日：2024-01-19
摘要： A method implemented through a data processing device in a computing network includes sampling time series data associated with each network entity for each feature thereof into a smaller time interval as a first data series and a second data series including a maximum value and a minimum value respectively of the sampled time series data for the each feature within the smaller time interval, and generating a reference data band from predicted future data sets. The method also includes detecting, based on the reference data band, an anomaly in real-time data associated with the each network entity for the each feature thereof, and determining an event associated with a pattern of change of the real-time data associated with the each network entity based on executing an optimization algorithm to determine a series of anomalies including the detected anomaly.
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公开(公告)号：US20160163671A1
公开(公告)日：2016-06-09
申请号：US14559893
申请日：2014-12-03
申请人： SHAILESH KUMAR , Rishi Bhooshan , Chee Seng Foong , Vikas Garg , Navas Khan Oratti Kalandar , Chetan Verma
发明人： SHAILESH KUMAR , Rishi Bhooshan , Chee Seng Foong , Vikas Garg , Navas Khan Oratti Kalandar , Chetan Verma
IPC分类号： H01L23/00 , H01L23/31 , H01L21/56 , H01L23/495
CPC分类号： H01L23/49517 , H01L23/3107 , H01L23/49555 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L2224/03334 , H01L2224/04105 , H01L2224/05005 , H01L2224/05541 , H01L2224/12105 , H01L2224/13124 , H01L2224/16245 , H01L2224/45124 , H01L2224/45147 , H01L2224/48091 , H01L2224/48247 , H01L2224/73207 , H01L2224/73227 , H01L2224/73253 , H01L2224/73265 , H01L2224/92164 , H01L2224/92227 , H01L2924/00014 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A surface-mounted integrated circuit package containing a semiconductor die has at least two conductive plates on its lower surface for contacting power and ground areas of a printed circuit board (PCB). The conductive plates are electrically connected to metal studs encapsulated within the package and which link the plates to the power and ground grids of the semiconductor die. Power and ground can thus be provided to the package with conductive patterns on the PCB that match with the plates. The resistance of the plates is low and hence the IR drop across the die is low. By supplying power directly to the package via the plates, the peripheral package pins that would otherwise have been allocated for power (and ground) are now freed up for signal assignment.
摘要翻译： 包含半导体管芯的表面安装集成电路封装在其下表面上具有至少两个导电板，用于接触印刷电路板（PCB）的电源和接地区域。 导电板电连接到封装在封装内的金属螺柱，并将板连接到半导体管芯的电源和接地栅极。 因此，电源和接地可以在PCB上的与板匹配的导电图案上提供给封装。 板的电阻低，因此裸片上的IR降低。 通过经由板向封装提供电源，否则将分配给电源（和地）的外围封装引脚现在被释放以进行信号分配。
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公开(公告)号：US20150364439A1
公开(公告)日：2015-12-17
申请号：US14302425
申请日：2014-06-12
IPC分类号： H01L23/00
CPC分类号： H01L24/49 , H01L24/48 , H01L2224/05554 , H01L2224/4554 , H01L2224/4813 , H01L2224/4911 , H01L2224/4917 , H01L2924/00014 , H01L2924/30101 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/85399 , H01L2224/05599
摘要： A semiconductor device uses insulated bond wires to connect peripheral power supply and ground bond pads on the periphery of the device to array power supply and ground bond pads located on an interior region of a integrated circuit die of the device. Power supply and ground voltages are conveyed from array bond pads using vertical vias down to one or more corresponding inner power distribution layers. The bond wire connections form rows and columns of hops constituting a mesh power grid that reduces the IR drop of the semiconductor device.
摘要翻译： 半导体器件使用绝缘接合线来将设备周边上的外围电源和接地焊盘连接到位于器件的集成电路管芯的内部区域上的阵列电源和接地焊盘。 电源和接地电压使用垂直通孔从阵列接合焊盘传送到一个或多个对应的内部配电层。 接合线连接形成构成网格电网的行的行和列，其减小了半导体器件的IR降。
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公开(公告)号：US08832238B2
公开(公告)日：2014-09-09
申请号：US13230043
申请日：2011-09-12
CPC分类号： H04L61/35 , H04L61/2015 , H04L61/6004 , H04L61/6022 , H04L61/6059
摘要： Techniques are described for recording stateless internet protocol (IP) addresses. A DHCP server may receive information requests and/or other communications from a stateless IPv6 client that can be employed to ascertain corresponding IP addresses generated by the client. In one approach, the DHCP server is configured to parse appropriate communications to find information indicative of a stateless IP address. This may include extracting a subnet prefix of the IPv6 client and an interface ID which identifies the specific network interface employed by the client for communications. The DHCP server uses this information to generate corresponding IP addresses. The DHCP server records the extracted information and/or generated addresses in its database (e.g., IP address event log). The DHCP server is then able to provide a count of clients and percentage utilization for a network using the recorded addressing information.
摘要翻译： 描述了记录无状态互联网协议（IP）地址的技术。 DHCP服务器可以从无状态IPv6客户端接收信息请求和/或其他通信，可以用于确定客户端生成的相应IP地址。 在一种方法中，DHCP服务器被配置为解析适当的通信以找到指示无状态IP地址的信息。 这可能包括提取IPv6客户端的子网前缀以及标识客户端用于通信的特定网络接口的接口ID。 DHCP服务器使用此信息生成相应的IP地址。 DHCP服务器将提取的信息和/或生成的地址记录在其数据库中（例如，IP地址事件日志）。 然后，DHCP服务器能够使用记录的寻址信息提供客户端的计数和网络的百分比利用率。
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公开(公告)号：US09418873B2
公开(公告)日：2016-08-16
申请号：US14467039
申请日：2014-08-24
申请人： Shailesh Kumar , Vikas Garg , Sumit Varshney , Chetan Verma
发明人： Shailesh Kumar , Vikas Garg , Sumit Varshney , Chetan Verma
IPC分类号： H01L23/48 , H01L23/12 , H01G2/14 , H01L21/50 , H01L23/522 , H01L23/495
CPC分类号： H01L21/50 , H01L23/49503 , H01L23/49551 , H01L23/5223 , H01L2224/05553 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device has an on-die decoupling capacitor that is shared between alternative high-speed interfaces. A capacitance pad is connected to the decoupling capacitor and internal connection pads are connected respectively to the alternative interfaces. Internal connection bond wires connect the decoupling capacitor to the selected interface through the capacitance pad and the internal connection pads in the same process as connecting the die to external electrical contacts of the device.
摘要翻译： 半导体器件具有在备用高速接口之间共享的片上去耦电容器。 电容焊盘连接到去耦电容器，内部连接焊盘分别连接到备用接口。 内部连接接合线通过电容焊盘和内部连接焊盘将去耦电容器连接到选定的接口，与将器件连接到器件的外部电触点相同。
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公开(公告)号：US20160233183A1
公开(公告)日：2016-08-11
申请号：US14620155
申请日：2015-02-11
申请人： Shailesh Kumar , Vikas Garg , Meng Kong Lye
发明人： Shailesh Kumar , Vikas Garg , Meng Kong Lye
IPC分类号： H01L23/00
CPC分类号： H01L24/06 , H01L23/3171 , H01L24/02 , H01L24/05 , H01L2224/0235 , H01L2224/02375 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05567 , H01L2224/0603 , H01L2224/06051 , H01L2224/06131 , H01L2224/06135 , H01L2224/06138 , H01L2224/06139 , H01L2224/06179 , H01L2924/00012
摘要： An integrated circuit (IC) die has side input/output (IO) pads located along each side of the die interior. Each die corner has a corner IO pad. The side IO pads adjacent to the corner IO pads have shortened passivation regions in the top metal layer (TML) that define TML access regions. TML traces run through the TML access regions to connect the corner IO pads to the die interior. Providing corner IO pads enables an IC die to have up to four more IO pads than a comparable conventional IC die that does not have any corner IO pads, or an IC die to have the same number of IO pads within a smaller overall footprint.
摘要翻译： 集成电路（IC）管芯具有位于管芯内部的每一侧的侧面输入/输出（IO）焊盘。 每个模具角都有一个角落的IO垫。 靠近角IO垫的侧IO垫具有限定TML访问区域的顶层金属层（TML）中的钝化区域缩短。 TML轨迹通过TML访问区域将角IO垫连接到模具内部。 提供拐角IO垫使IC芯片能够具有比不具有任何拐角IO垫的可比较的常规IC芯片多达四个IO垫，或IC芯片在更小的总体占地面积内具有相同数量的IO焊盘。
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公开(公告)号：US20160056099A1
公开(公告)日：2016-02-25
申请号：US14467039
申请日：2014-08-24
申请人： Shailesh Kumar , Vikas Garg , Sumit Varshney , Chetan Verma
发明人： Shailesh Kumar , Vikas Garg , Sumit Varshney , Chetan Verma
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L21/50 , H01L23/49503 , H01L23/49551 , H01L23/5223 , H01L2224/05553 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48464 , H01L2224/73265 , H01L2924/181 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor device has an on-die decoupling capacitor that is shared between alternative high-speed interfaces. A capacitance pad is connected to the decoupling capacitor and internal connection pads are connected respectively to the alternative interfaces. Internal connection bond wires connect the decoupling capacitor to the selected interface through the capacitance pad and the internal connection pads in the same process as connecting the die to external electrical contacts of the device.
摘要翻译： 半导体器件具有在备用高速接口之间共享的片上去耦电容器。 电容焊盘连接到去耦电容器，内部连接焊盘分别连接到备用接口。 内部连接接合线通过电容焊盘和内部连接焊盘将去耦电容器连接到选定的接口，与将器件连接到器件的外部电触点相同。
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