公开(公告)号：US20140113223A1

公开(公告)日：2014-04-24

申请号：US14141748

申请日：2013-12-27

Applicant: FUJIFILM Corporation

Inventor： Keita KATO ,  Michihiro SHIRAKAWA ,  Tadahiro ODANI ,  Atsushi NAKAMURA ,  Hidenori TAKAHASHI ,  Kaoru IWATO

IPC: G03F7/32

CPC classification number: G03F7/325 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/095

Abstract: There is provided a pattern forming method comprising: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Abstract translation: 提供一种图案形成方法，包括：（i）通过使用第一树脂组合物（I）在基材上形成第一膜的步骤，（ii）通过使用第二树脂在第一膜上形成第二膜的步骤 不同于树脂组合物（I）的树脂组合物（II），（iii）暴露具有第一膜和第二膜的多层膜的步骤，以及（iv）使第一膜和第二膜显影的步骤 在曝光的多层膜中，通过使用含有机溶剂的显影剂形成负图案。

公开(公告)号：US20240339368A1

公开(公告)日：2024-10-10

申请号：US18746015

申请日：2024-06-17

Applicant: FUJIFILM Corporation

Inventor： Atsushi NAKAMURA ,  Kosuke Yamashita ,  Kazuki Tomota

IPC: H01L23/29 ,  C09J133/24 ,  H01L21/56 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/295 ,  C09J133/24 ,  H01L21/563 ,  H01L24/43 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/45016 ,  H01L2224/4502 ,  H01L2225/06513

Abstract: There is provided a manufacturing method for a bonded body, comprising: preparing a substrate A having a surface on which a wiring line terminal is provided; forming a polyimide-containing precursor portion on the surface of the substrate A, where the wiring line terminal is provided on the surface of the substrate A; preparing a substrate B having a surface on which a wiring line terminal is provided; and bonding the surface of the substrate A, where the polyimide-containing precursor portion is provided on the surface of the substrate A, to the surface of the substrate B, where the wiring line terminal is provided on the surface of the substrate B, wherein a difference between a cyclization rate of a polyimide in the polyimide-containing precursor portion before the bonding of the surface of the substrate A and a cyclization rate of a polyimide in a polyimide-containing portion formed at a bonded portion after the bonding of the surface of the substrate A is 5% or more.

公开(公告)号：US20160170303A1

公开(公告)日：2016-06-16

申请号：US15048187

申请日：2016-02-19

Applicant: FUJIFILM CORPORATION

Inventor： Yoshitaka KAMOCHI ,  Ichiro KOYAMA ,  Yu IWAI ,  Atsushi NAKAMURA

IPC: G03F7/11 ,  G03F7/038

CPC classification number: G03F7/11 ,  G03F7/0045 ,  G03F7/0046 ,  G03F7/0382 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/325

Abstract: There is provided a laminate body which is capable of forming an excellent pattern on an organic semiconductor.A laminate body includes at least a water-soluble resin film and a resist film formed of a chemically amplified photosensitive resin composition on a surface of an organic semiconductor film in this order, in which the chemically amplified photosensitive resin composition contains a photoacid generator which is decomposed in an amount of 80% by mole or greater when exposed to light under the condition of 100 mJ/cm2 or greater at a wavelength of 365 nm, a mask pattern is formed by an exposed portion being hardly soluble in a developer containing an organic solvent, and the formed mask pattern is used as an etching mask.

Abstract translation: 提供能够在有机半导体上形成优异图案的层叠体。 层叠体依次包含至少一种水溶性树脂膜和由化学放大型感光性树脂组合物形成的抗蚀剂膜，其中化学增幅感光性树脂组合物含有光致酸产生剂，该光致酸性发生剂为 当在365nm的波长为100mJ / cm 2以上的条件下曝光时，以80摩尔％以上的量分解，掩模图案由几乎不溶于含有有机物的显影剂的露出部分形成 溶剂，并且将形成的掩模图案用作蚀刻掩模。

公开(公告)号：US20150284603A1

公开(公告)日：2015-10-08

申请号：US14743619

申请日：2015-06-18

Applicant: FUJIFILM CORPORATION

Inventor： Yu IWAI ,  Kazuhiro FUJIMAKI ,  Ichiro KOYAMA ,  Atsushi NAKAMURA

IPC: C09J133/12 ,  H01L21/304 ,  C09J125/14 ,  C09J133/16 ,  C09J183/06 ,  H01L21/683 ,  H01L21/306

CPC classification number: C09J151/003 ,  C09J4/00 ,  C09J5/04 ,  C09J5/06 ,  C09J125/14 ,  C09J133/12 ,  C09J133/16 ,  C09J183/06 ,  H01L21/304 ,  H01L21/306 ,  H01L21/6835 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381

Abstract: By a temporary adhesive for production of semiconductor device containing (A) a radical polymerizable monomer or oligomer containing a fluorine atom or a silicon atom, (B) a polymer compound, and (C) a radical polymerization initiator, a temporary adhesive for production of semiconductor device, which is excellent in coating property, which reduces a problem of generation of gas therefrom in the temporary support even under high temperature condition when the member to be processed (for example, a semiconductor wafer) is subjected to a mechanical or chemical processing, and further which can easily release the temporary support for the member processed without imparting damage to the member processed even after being subjected to a process at a high temperature, and an adhesive support and a production method of semiconductor device using the same are provided.

Abstract translation: 通过用于生产包含（A）含有氟原子或硅原子的自由基聚合性单体或低聚物的半导体器件的临时粘合剂，（B）高分子化合物和（C）自由基聚合引发剂，用于生产 半导体装置，其涂布性优异，即使在待处理构件（例如半导体晶片）进行机械或化学处理时，即使在高温条件下也能够在临时支撑体中产生气体的问题 并且进一步地，其可以容易地释放所加工的构件的临时支撑件，而不会对经处理的高温处理的构件造成损害，并且提供粘合剂支撑件和使用其的半导体装置的制造方法。

公开(公告)号：US20150248056A1

公开(公告)日：2015-09-03

申请号：US14713215

申请日：2015-05-15

Applicant: FUJIFILM Corporation

Inventor： Michihiro SHIRAKAWA ,  Keita KATO ,  Tadahiro ODANI ,  Atsushi NAKAMURA ,  Hidenori TAKAHASHI ,  Kaoru IWATO

IPC: G03F7/095 ,  G03F7/075 ,  G03F7/038

CPC classification number: G03F7/095 ,  G03F7/038 ,  G03F7/0392 ,  G03F7/0397 ,  G03F7/0757 ,  G03F7/091 ,  G03F7/094 ,  G03F7/11 ,  G03F7/2041 ,  G03F7/30 ,  G03F7/325 ,  H01L21/0271

Abstract: A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.

Abstract translation: 图案形成方法包括：（i）通过使用第一树脂组合物（I）在基材上形成第一膜的步骤，（ii）通过使用第二树脂组合物在第一膜上形成第二膜的步骤 II），（iii）暴露具有第一膜和第二膜的多层膜的步骤，和（iv）在暴露的第一膜和第二膜中显影第一膜和第二膜的步骤 通过使用含有机溶剂的显影剂形成负图案的多层膜。

公开(公告)号：US20140242359A1

公开(公告)日：2014-08-28

申请号：US14268512

申请日：2014-05-02

Applicant: FUJIFILM CORPORATION

Inventor： Atsushi NAKAMURA ,  Tadahiro ODANI

IPC: G03F7/40

CPC classification number: G03F7/40 ,  G03F7/0397 ,  G03F7/325 ,  G03F7/405 ,  Y10T428/24851

Abstract: Provided is a method of forming a pattern, including (a) forming, into a film, an actinic-ray- or radiation-sensitive resin composition comprising a resin that when acted on by an acid, increases its polarity and a compound that when exposed to actinic rays or radiation, generates an acid, (b) exposing the film to light, (c) developing the exposed film with a developer comprising an organic solvent to thereby form a negative pattern, and (d) coating the pattern with a composition comprising a resin comprising any of repeating units of general formula (I) below, a crosslinker component and an alcohol solvent to thereby induce crosslinking with the resin as a constituent of the pattern and thus form a crosslinked layer, in which R1 represents any of an alkyl group, an alkoxy group, an alkylcarbonyloxy group and an alkoxycarbonyl group.

Abstract translation: 提供一种形成图案的方法，包括（a）在膜中形成包含树脂的光化学射线或辐射敏感性树脂组合物，所述树脂组合物当被酸作用时增加其极性，并且暴露于其中的化合物 产生酸，（b）使膜暴露于光，（c）用包含有机溶剂的显影剂显影曝光的膜，从而形成负图案，和（d）用组合物涂覆图案 包含下述通式（I）的重复单元，交联剂成分和醇类溶剂中的任一种的树脂，由此引起与树脂作为图案的组成的交联，从而形成交联层，其中R1表示 烷基，烷氧基，烷基羰基氧基和烷氧基羰基。

公开(公告)号：US20220066323A1

公开(公告)日：2022-03-03

申请号：US17471926

申请日：2021-09-10

Applicant: FUJIFILM Corporation

Inventor： Atsushi NAKAMURA ,  Hideki Takakuwa

IPC: G03F7/11 ,  C09D133/06 ,  C09D129/04 ,  G03F7/038 ,  C08F220/18

Abstract: Provided is a laminate that includes a base, an organic layer, a protective layer and a photo-sensitive layer in this order, the photo-sensitive layer contains an onium salt-type photo-acid generator that contains an anion moiety having a group with at least one ring structure selected from the group consisting of condensed ring structure, bridged ring structure and spiro ring structure, the photo-sensitive layer is intended for development with use of a developing solution, and the protective layer is intended for stripping with use of a stripping solution; and also provided are a composition used for forming the protective layer or the photo-sensitive layer contained in the laminate; and a laminate forming kit used for forming the laminate.

公开(公告)号：US20180190908A1

公开(公告)日：2018-07-05

申请号：US15740265

申请日：2016-06-27

Applicant: IMEC VZW ,  FUJIFILM CORPORATION

Inventor： Tung Huei KE ,  Pawel MALINOWSKI ,  Atsushi NAKAMURA

IPC: H01L51/00 ,  H01L51/56 ,  H01L51/42 ,  H01L51/05

CPC classification number: H01L51/0018 ,  H01L51/0085 ,  H01L51/0508 ,  H01L51/42 ,  H01L51/56 ,  Y02E10/549

Abstract: At least one embodiment relates to a method for photolithographic patterning of an organic layer on a substrate. The method includes providing a water-soluble shielding layer over the organic layer. In addition, the method includes providing a photoresist layer on the water-soluble shielding layer. The method also includes photolithographic patterning of the photoresist layer to form a patterned photoresist layer. Further, the method includes etching the water-soluble shielding layer and the organic layer, using the patterned photoresist layer as a mask, to form a patterned water-soluble shielding layer and a patterned organic layer. Still further, the method includes removing the patterned water-soluble shielding layer. The method includes, before providing the water-soluble shielding layer, providing a hydrophobic protection layer having a hydrophobic upper surface on the organic layer.

公开(公告)号：US20180040824A1

公开(公告)日：2018-02-08

申请号：US15787990

申请日：2017-10-19

Applicant: FUJIFILM Corporation

Inventor： Seiya MASUDA ,  Yoshitaka KAMOCHI ,  Atsushi NAKAMURA

IPC: H01L51/00 ,  G03F7/16 ,  C08F220/28 ,  B32B27/30 ,  G03F7/038

Abstract: Provided are a laminate which includes an organic semiconductor film, a water-soluble resin layer, and a photosensitive resin layer and in which cracks are unlikely to occur; and a kit.The laminate includes a water-soluble resin layer containing a water-soluble resin and a photosensitive resin layer containing a photosensitive resin, which are provided in this order on an organic semiconductor film. The water-soluble resin layer and the photosensitive resin layer are adjacent to each other, the water-soluble resin is at least one of polyvinylpyrrolidone having a weight-average molecular weight of 300,000 or greater or polyvinyl alcohol having a weight-average molecular weight of 15,000 or greater, and the photosensitive resin has a weight-average molecular weight of 30,000 or greater.

公开(公告)号：US20160172595A1

公开(公告)日：2016-06-16

申请号：US15053426

申请日：2016-02-25

Applicant: FUJIFILM Corporation

Inventor： Pawel MALINOWSKI ,  Atsushi NAKAMURA ,  Yu IWAI

IPC: H01L51/00 ,  H01L51/42

CPC classification number: H01L51/0018 ,  H01L51/0036 ,  H01L51/0047 ,  H01L51/0097 ,  H01L51/0508 ,  H01L51/42 ,  H01L51/4253 ,  H01L51/56

Abstract: A method is provided for photolithographic patterning of an organic layer, comprising: providing a shielding layer on the organic layer; providing a photoresist layer on the shielding layer; illuminating the photoresist layer through a shadow mask; developing the photoresist layer, thereby forming a patterned photoresist layer; performing a first dry etching step using the patterned photoresist layer as a mask, thereby removing at least an upper portion of the photoresist layer and completely removing the shielding layer at locations not covered by the photoresist layer; performing a second dry etching step using the patterned shielding layer as a mask, thereby removing the organic layer at locations not covered by the shielding layer; and removing the shielding layer, wherein removing the shielding layer comprises exposing it to water. A method of the present disclosure may advantageously be used in a process for fabricating organic semiconductor based devices and circuits.

Abstract translation: 提供了一种用于有机层的光刻图案化的方法，包括：在有机层上提供屏蔽层; 在所述屏蔽层上提供光致抗蚀剂层; 通过荫罩照射光致抗蚀剂层; 显影光致抗蚀剂层，从而形成图案化的光致抗蚀剂层; 使用图案化的光致抗蚀剂层作为掩模进行第一干蚀刻步骤，从而去除光致抗蚀剂层的至少上部，并且在未被光致抗蚀剂层覆盖的位置处完全除去屏蔽层; 使用图案化屏蔽层作为掩模进行第二干蚀刻步骤，从而在未被屏蔽层覆盖的位置移除有机层; 并且去除屏蔽层，其中去除屏蔽层包括将其暴露于水中。 本公开的方法可有利地用于制造基于有机半导体的器件和电路的工艺。