-
公开(公告)号：US11697754B2
公开(公告)日：2023-07-11
申请号：US17072001
申请日：2020-10-15
申请人： FUJIFILM Corporation
发明人： Kosuke Yamashita , Kazuto Shimada
IPC分类号： C09K5/14 , C08K3/04 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , C08K7/04 , C08K9/02 , H01L23/373 , G03F7/32
CPC分类号： C09K5/14 , C08K3/042 , C08K3/22 , C08K3/28 , C08K3/34 , C08K3/38 , C08K7/04 , C08K9/02 , H01L23/3737 , C08K2003/2227 , C08K2003/2241 , C08K2003/282 , C08K2003/385 , C08K2201/001 , C08K2201/005 , C08K2201/016 , G03F7/322
摘要： The present invention relates to a thermal conductive layer that includes at least one filler, has a thermal diffusivity of 5.0×10−7 m2s−1 or more, and has a volume resistivity of 1.0×1011 Ω·cm or more. Further, the present invention relates to a photosensitive layer to which the thermal conductive layer is applied, a photosensitive composition, a manufacturing method for a thermal conductive layer, and a laminate and a semiconductor device.
-
公开(公告)号：US09899306B2
公开(公告)日：2018-02-20
申请号：US15401778
申请日：2017-01-09
申请人： FUJIFILM Corporation
IPC分类号： H01L23/498 , H05K1/14 , H05K1/03
CPC分类号： H01L23/49822 , H01L23/32 , H01L23/49827 , H01L2924/0002 , H01R4/04 , H01R12/52 , H01R13/2414 , H05K1/03 , H05K1/14 , H05K1/144 , H01L2924/00
摘要： An object of the present invention is to provide an anisotropic conductive member capable of achieving excellent conduction reliability and a multilayer wiring substrate using the same. The anisotropic conductive member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion which protrudes from the surface of the insulating base, and an end of the protrusion of each of the conductive paths is exposed or protrudes from the surface of the pressure sensitive adhesive layer.
-
公开(公告)号：US09799594B2
公开(公告)日：2017-10-24
申请号：US15219803
申请日：2016-07-26
申请人： FUJIFILM Corporation
发明人： Kosuke Yamashita
IPC分类号： H01L23/498 , H05K1/11 , H01L21/48 , H05K3/40 , H05K3/46 , H05K1/02 , H05K1/03 , H05K3/36 , C25D3/00 , C23C18/00 , H05K1/14
CPC分类号： H01L23/49838 , C23C18/00 , C23C18/1653 , C23C18/54 , C25D3/00 , C25D3/38 , C25D5/48 , C25D11/045 , C25D11/08 , C25D11/12 , C25D11/16 , C25D11/20 , C25F3/20 , H01L21/4857 , H01L21/486 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H05K1/0298 , H05K1/0306 , H05K1/115 , H05K1/144 , H05K3/368 , H05K3/4038 , H05K3/4611 , H05K2201/042 , H05K2201/10378 , H05K2203/0315
摘要： The present invention is to provide a microstructure capable of improving the withstand voltage of an insulating substrate while securing fine conductive paths, a multilayer wiring board, a semiconductor package, and a microstructure manufacturing method. The microstructure of the present invention has an insulating substrate having a plurality of through holes, and conductive paths consisting of a conductive material containing metal filling the plurality of through holes, in which an average opening diameter of the plurality of through holes is 5 nm to 500 nm, an average value of the shortest distances connecting the through holes adjacent to each other is 10 nm to 300 nm, and a moisture content is 0.005% or less with respect to the total mass of the microstructure.
-
公开(公告)号：US11848249B2
公开(公告)日：2023-12-19
申请号：US17699181
申请日：2022-03-21
申请人： FUJIFILM Corporation
发明人： Kosuke Yamashita , Naotsugu Muro , Toshiyuki Saie , Naoki Sato , Kazuto Shimada
IPC分类号： H01L21/66 , H01L23/373
CPC分类号： H01L23/3737 , H01L22/12 , H01L22/26
摘要： There is provided a manufacturing method for a thermal conductive layer, with which a thermal conductive layer having a thermal diffusivity of 3.0×10−7 m2s−1 or more is manufactured on a support by using a composition for forming a thermal conductive layer, the composition containing a resin, a filler, and a solvent and having a concentration of solid contents of less than 90% by mass, the manufacturing method including a discharge step of discharging the composition toward the support; and a solvent amount reduction step of reducing a solvent amount in the composition such that a first solvent amount reduction time taken after the composition is discharged until the concentration of solid contents in the composition reaches 90% by mass on the support is 10 seconds or more for each position on the support.
-
公开(公告)号：US20240339368A1
公开(公告)日：2024-10-10
申请号：US18746015
申请日：2024-06-17
申请人： FUJIFILM Corporation
IPC分类号： H01L23/29 , C09J133/24 , H01L21/56 , H01L23/00 , H01L25/065
CPC分类号： H01L23/295 , C09J133/24 , H01L21/563 , H01L24/43 , H01L24/45 , H01L25/0657 , H01L2224/45016 , H01L2224/4502 , H01L2225/06513
摘要： There is provided a manufacturing method for a bonded body, comprising: preparing a substrate A having a surface on which a wiring line terminal is provided; forming a polyimide-containing precursor portion on the surface of the substrate A, where the wiring line terminal is provided on the surface of the substrate A; preparing a substrate B having a surface on which a wiring line terminal is provided; and bonding the surface of the substrate A, where the polyimide-containing precursor portion is provided on the surface of the substrate A, to the surface of the substrate B, where the wiring line terminal is provided on the surface of the substrate B, wherein a difference between a cyclization rate of a polyimide in the polyimide-containing precursor portion before the bonding of the surface of the substrate A and a cyclization rate of a polyimide in a polyimide-containing portion formed at a bonded portion after the bonding of the surface of the substrate A is 5% or more.
-
公开(公告)号：US11355439B2
公开(公告)日：2022-06-07
申请号：US16775497
申请日：2020-01-29
申请人： FUJIFILM Corporation
发明人： Kosuke Yamashita
IPC分类号： H01L23/538 , H01L21/48 , H01L25/16
摘要： A structure includes: a plurality of through holes that are provided to an insulating base and penetrate the insulating base in the thickness direction; conductive paths that are constituted of a conductive substance filling the plurality of through-holes; and insulators with which the plurality of through-holes are filled and are constituted of an insulating substance different from that of the insulating base. Both ends of the respective conductive paths are provided with protrusions that protrude from each surface of the insulating base in the thickness direction. Both ends of the insulators are flush with each surface of the insulating base in the thickness direction, protrude with respect to the surface in the thickness direction, or are recessed from the surface in the thickness direction.
-
公开(公告)号：US10559548B2
公开(公告)日：2020-02-11
申请号：US16055734
申请日：2018-08-06
申请人： FUJIFILM Corporation
发明人： Kosuke Yamashita
IPC分类号： H01L23/52 , H01L23/00 , H01L21/768
摘要： An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, a semiconductor device using the same, a semiconductor package, and a semiconductor device production method. An anisotropic conductive bonding member of the present invention includes an insulating base which is made of an inorganic material, a plurality of conductive paths which are made of a conductive member, penetrate the insulating base in a thickness direction thereof, and are provided in a mutually insulated state, and a pressure sensitive adhesive layer which is provided on a surface of the insulating base, in which each of the conductive paths has a protrusion protruding from the surface of the insulating base, the protrusion of each of the conductive paths is buried in the pressure sensitive adhesive layer, and the pressure sensitive adhesive layer contains a polymer material and an antioxidant material.
-
-
-
-
-
-
搜索结果
7 条记录 (耗时 0.019 秒)
